전극 및 종단 재료의 세계 시장 2024-2027년

조사회사：Paumanok IMR　출판년월：2024년04월

Electrodes and Terminations: World Markets, Technologies and Opportunities: 2024-2027

전극 및 종단 재료의 세계 시장, 기술 및 기회: 2024-2027년

주문/문의　　　　조사회사/라이센스/납기안내

Report Description

A study of global markets for electrode and termination materials for multilayered stacked ceramic components; covering ores, powders and pastes in Palladium, Nickel, Copper and Silver With Value, Volume and Pricing Forecasts to 2027.

다층 적층 세라믹 부품용 전극 및 종단 재료의 세계 시장에 대한 연구. 2027년까지의 가치, 수량 및 가격 예측을 통해 팔라듐, 니켈, 구리 및 은의 광석, 분말 및 페이스트를 포괄합니다.

Paumanok Publications, Inc., Saxapahaw, NC USA has published “Electrodes and Terminations: World Markets, Technologies and Opportunities: 2024-2027 ISBN# 1-89-3211-38-X,” which is a detailed deep dive analysis of four metals markets feeding into the global stacked ceramic component markets as electrodes and terminations- considered cornerstone to all electronic circuits worldwide.  This detailed analysis is produced with an eye on creating transparency from raw materials costs to produce ceramic chip components.  Metals in the form of ores, powders and pastes are consumed by the multilayered ceramic chip component markets with emphasis on two base metals and two precious metals; this market study traces their detailed supply chains to the paste and ink processors, the nano-technology powder producers and the ore miners that support the global high-tech economy.

Paumanok Industrial Market Research employs a vertical research model that has data input resources at each level of the supply chain- mining, materials production, component manufacturing; component distribution, component consumption and materials recycling. This creates a legacy of data, whereby each segment of the supply chain is a set of checks and balances for data coming from the components markets. This methodology also provides the best short-term and long-term forecasting model for Paumanok IMR predictive analytics.  This article focuses on four metals that are consumed as electrodes and terminations in passive electronic components and includes two precious metals and two base metals.  We use this data to monitor the variable costs structure for producing passive electronic components.  Electrodes and terminations and fundamental to the construction of passive electronic components, with emphasis upon stacked ceramic solutions for capacitance, resistance, inductance and sensing in electronic circuits.

In an effort to achieve higher operating functionality, electronic components adopted a stacking method for ceramic dielectric materials almost 70 years ago.  This stacking capability has evolved over time to handle increasingly thinner layers; which in turn has fostered in an age of increased volumetric efficiency in portable electronics.  The specific product lines that benefited from increased functionality through stacking includes multilayered ceramic chip Multilayered Ceramic components (MLC); multilayered chip varistors; ceramic chip coil inductors; PTC thermistors, NTC thermistors and various types of EMC, EMI and RFI filters.  A cornerstone material supply chain for multilayered chip components is the precious and base metals used for electrodes and terminations and matched with the ceramic stacks.  This study sheds light on the metals ecosystems that feed into mass produced electronic components.

The Stacking Method for Electronic components creates opportunities for base and precious metals in the form of metal electrodes and metal terminations.  These metals represent a significant cost for component manufacturers and also involves ecosystems and expertise outside of the direct control of the component manufacturers.

“Electrodes and Terminations: World Markets, Technologies and Opportunities: 2024-2027 ISBN# 1-89-3211-38-X,” is a study of global markets for electrode and termination materials for multilayered stacked ceramic components; covering ores, powders and pastes in Palladium, Nickel, Copper and Silver With Value, Volume and Pricing Forecasts to 2027.

Table of Contents

자세한 목차는 이메일로 보내드립니다. 필요하신 분은 주문/문의로 연락 주시길 바랍니다.

Tables and Graphs

Figure 1: Paumanok Methodology for Studying Electrode and Termination Materials for Electronic Components: 1988-2024 16
Figure 2: Electrode and Termination Metal Ecosystems for Passive Electronic Components 17
Figure 3: Passive Component Raw Material Pricing Trend: 2012-2024 by Month 22
Figure 4: Palladium Price Trend by Month: 2012-2024 24
Figure 5: Nickel Price Trend by Month: 2012-2024 26
Figure 6: Copper Price Trend by Month: 2012-2024 28
Figure 7: Silver Price Trend By Month: 2012-2024 30
Figure 8: Paumanok Provenance and Utility in Dielectric Material Supply Chains and Ecosystems: 1988-2024 32
Figure 9: Paumanok Scope of Coverage in Electronic Components and Supporting Materials 33
Figure 10: The Passive Electronic Component Supply Chain 35
Figure 11: The Technical Economic Maxims Associated with Passive Electronic Components 40
Figure 12: Currency Translations Used In This Report: FY 2013-2024 (Yen, NT$ and Won Currencies To The United States Dollar Quarterly Exchange) 43
Figure 13: Fixed Stacked chip component Market Breakdown by Sub-Category: FY 2024 45
Figure 14: Fixed Linear Resistor Market Breakdown by Sub-Category: FY 2024 46
Figure 15: Discrete Inductor Market Breakdown by Sub-Category: FY 2024 47
Figure 16: Feedstocks, Engineering Steps, Dielectric Development and End-Market Pull 49
Figure 17: PGM Electrode and Termination: Complete Supply Chain: Ore To Powder To Paste To MLCC 57
Figure 18: Base Metal Electrode Supply To The Global MLCC Markets: Ore, Powder and Paste for Copper and Nickel 60
Figure 19: Overall Metal Paste Consumption in Ceramic Stack Electronic Components: FY 2024 66
Figure 20: Multilayered Ceramic Diagram of Materials 69
Figure 21: Nickel: A Changing Supply Chain For Stacked Chip 71
Figure 22: Nickel Ore Mining Output By Country: 2024 73
Figure 23: Nickel Ore Output By Mining Company: 2024 75
Figure 24: Global Market Overview For Nickel Electrode Powder for Multilayered Ceramic: 2024 79
Figure 25: Development of the Nickel Electrode Powder for Multilayered Ceramic Consumption Volume (Tons): 1997-2024; 2024-2027 FORECAST 80
Figure 26: Development of the Nickel Electrode Powder for Multilayered Ceramic Consumption Value (Millions of USD): 1997-2024; 2024-2027 81
Figure 27: Nickel Electrode Powder for Multilayered Ceramic (Price per Kilogram): 1997-2024; 2024-2027 FORECAST 83
Figure 29: Multilayered Ceramic Nickel Electrode Powder Market by Particle Size: 2024 86
Figure 30: Nickel Electrode Powder Vendors to the Global Multilayered Ceramic Market: 2024 Estimated Sales and Market Shares 88
Figure 31: Nickel Electrode Powder Sales by Key Customer in Key Countries 91
Figure 32: Nickel Paste Vendors To Multilayered Ceramic: 2024 Estimated Market Shares 94
Figure 33: New Nickel Paste Development: 2024 Breakthrough in Japan 96
Figure 34: Ni Electrode Thickness/Multilayered Ceramic Capacitance- 98
Figure 35: Multilayered Ceramic Manufacturers: 2024 Competition by Multilayered Ceramic Capacitance Value 100
Figure 36: Maximum Voltage at Maximum Capacitance by Case Size in Stacked Chip 102
Figure 37: Multilayered Ceramic Nickel Powder Forecasts: FY 2024-2027 (In Tons) 103
Figure 38: Multilayered Ceramic Nickel Powder Market Value Forecasts (Worldwide): FY 2024-2027 (In Millions of US Dollars) 104
Figure 39: Multilayered Ceramic Nickel Powder Market Value Forecasts (Worldwide): FY 2024-2027 (In Millions of US Dollars) 105
Figure 40: Copper Ore Mining Operations by Country: 2024 109
Figure 41: Copper Ore Output By Mine Location: 2024 110
Figure 42: Top Mining Companies in Copper Based On Dollar Sales: 2024 111
Figure 43: Multilayered Ceramic Copper Termination Powder Volume Markets in High Capacitance Multilayered Ceramic 115
Figure 44: Multilayered Ceramic Copper Termination Powder Market Value in High Capacitance Multilayered Ceramic 116
Figure 45: Multilayered Ceramic Copper Termination Powder Pricing Trend 117
Figure 46: Global Sales & Market Shares in Copper Termination Powder & Flake Supply to the Multilayered Ceramic Industry: 2024 121
Figure 47: Multilayered Ceramic Copper Termination Paste Vendors: 2024 Market Shares 123
Figure 48: Supplier/Customer Relationships in Copper Termination Powder and Paste in the Global Multilayered Ceramic Industry 125
Figure 49: Stacked Chip Copper Termination Powder Consumption Forecasts: 2024-2027 126
Figure 50: Copper Termination Powder Market Volume Forecast: 2024-2027 128
Figure 51: Copper Termination Powder Market Value Forecast: 2024-2027 129
Figure 52: Copper Termination Powder ASP Forecast: 2024-2027 130
Figure 53: Copper Termination Paste Market Volume Forecast: 2024-2027 131
Figure 54: Copper Termination Paste Market Value Forecast: 2024-2027 132
Figure 55: Multilayered Ceramic Copper Termination Paste ASP Forecast: 2024-2027 133
Figure 56: Sources for Palladium Ore- Key Producing Mining Operations by Country: FY 2024 136
Figure 57: Sources for Silver Ore- Key Producing Mining Operations by Country: FY 2024 137
Figure 58: Global Market Value of Consumption for PGM Inks/Pastes Consumed in Ceramic Chip Components: 2019-2024 139
Figure 59: Palladium Consumption Volume in Stacked Ceramic Electrodes: 2024 143
Figure 60: Palladium Consumption Value in Ceramic Chip Electrodes: 2024 145
Figure 61: Global Palladium Price Trend: 2019-2024 146
Figure 62: Silver Powder Consumption Volume in Ceramic Chip Components (Annualized): 2019-2024 148
Figure 63: Silver (AG) Powder Consumption Value in Ceramic Chip Components (Value) 149
Figure 64: Silver Price (Annualized) 150
Figure 65: Palladium + Silver Electrode Powder: Global Volume of Consumption: 2019-2024 151
Figure 66: Palladium + Silver Electrode Powder: Global Value of Consumption: 2019-2024 152
Figure 67: Palladium + Silver Electrode Powder: Pricing and Trend: 2019-2024 153
Figure 68: Palladium + Silver Electrode Paste: Volume and Trend: 2019-2024 154
Figure 69: Palladium + Silver Electrode Paste: Value and Trend: 2019-2024 155
Figure 70: Palladium + Silver Electrode Paste: ASP and Trend: 2019-2024 156
Figure 71: Palladium and Silver Powder and Paste Vendors to The Ceramic Chip Component Markets: FY 2024 158
Figure 72: Forecasts- Palladium in Electrodes (Volume In Troy Ounces) 159
Figure 73: Forecasts- Palladium Price Forecast (US Dollars per Troy Ounces) 160
Figure 74: Forecasts- Palladium in Electrodes (Value in USD) 161
Figure 75: Forecasts- Silver in Electrodes (Volume In Troy Ounces) 162
Figure 76: Forecasts- Silver in Electrodes (US Dollars [per Troy Ounces) 163
Figure 77: Forecasts- Silver in Electrodes (Value in USD) 164
Figure 78: Forecasts- Palladium + Silver Ink/Paste (Volume in Troy Ounces) 165
Figure 79: Forecasts- Palladium + Silver Ink/Paste (Price per Troy Ounce in USD) 166
Figure 80: Forecasts- Palladium + Silver Ink/Paste (Value Forecasts in Millions of US Dollars) 167