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인터포저 및 팬아웃 웨이퍼 레벨 패키징 (FOWLP) 시장조사 보고서

조사회사 : MarketsandMarkets (마켓츠앤마켓츠)   출판년월 : 2024년02월

Interposer and FOWLP Market – Global Forecast to 2029

인터포저 및 팬아웃 웨이퍼 레벨 패키징 (FOWLP) 시장 : 패키징 컴포넌트 및 설계(실리콘, 유기, 유리, 세라믹), 패키징(2.5D, 3D), 디바이스(로직 IC, LED, 메모리 디바이스, MEMS, 이미징 및 광전자), 업계 – 2029년까지의 세계 예측
Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry – Global Forecast to 2029

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Report Overview

The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% from 2024 to 2029.

세계 인터포저 및 FOWLP 시장은 2024년 356억 달러, 2029년에는 635억 달러에 이를 것으로 예상됩니다. 2024년부터 2029년까지 연평균 성장률(CAGR) 12.3%로 성장할 것으로 예상됩니다.

Increasing demand for advanced packaging in AI and high-performance computing serves as a significant driver for the Interposer and FOWLP market.

인터포저 및 팬아웃 웨이퍼 레벨 패키징 (FOWLP) 시장조사 보고서


“3D packaging by packaging type segment to account higher CAGR in Interposer and FOWLP market during the forecast period”
The semiconductor packaging industry is witnessing a surge in 3D packaging due to its ability to enhance performance, reduce form factor, and address challenges associated with traditional 2D packaging. As demand for compact and powerful electronic devices increases, 3D packaging technologies, such as stacked integrated circuits and through-silicon vias, are gaining prominence for their efficiency in meeting these evolving market needs.

인터포저 및 팬아웃 웨이퍼 레벨 패키징 (FOWLP) 시장조사 보고서 ecosystem


“Consumer Electronics to hold the largest share in Interposer and FOWLP market in 2029”
Semiconductor packaging plays a crucial role in consumer electronics by enabling miniaturization, improved performance, and energy efficiency. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones and wearables, is driving continuous innovation in semiconductor packaging technologies to meet the evolving requirements of the consumer electronics market.


“Asia Pacific region growing at highest CAGR in Interposer and FOWLP market”
The growth of semiconductor packaging in Asia Pacific can be attributed to the region’s strong presence in electronics manufacturing, the availability of skilled labor, and the establishment of advanced packaging facilities by major semiconductor companies seeking cost-effective production and proximity to key markets. Additionally, supportive government policies and investment in research and development contribute to the region’s prominence in semiconductor packaging.

인터포저 및 팬아웃 웨이퍼 레벨 패키징 (FOWLP) 시장조사 보고서 region

The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
• By Company Type: Tier 1 – 38%, Tier 2 – 28%, and Tier 3 – 34%
• By Designation: C-level Executives – 40%, Directors – 30%, and Others – 30%
• By Region: North America – 35%, Europe – 20%, Asia Pacific – 35%, and RoW – 10%
The key players operating in the Interposer and FOWLP market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), among others.


Research Coverage:
The research reports the Interposer and FOWLP Market, by Packaging Component & Design (Interposer, FOWLP); Packaging Type (2.5D,3D); Device Type (Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, Memory Devices and Other Device Types), End-user Industry (Consumer Electronics, Communications, Manufacturing, Automotive, Medical Devices, Aerospace); Region (North America, Europe, Asia Pacific, RoW)
The scope of the report covers detailed information regarding the major factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the interposer and FOWLP market. A detailed analysis of the key industry players has been done to provide insights into their business overviews, products, key strategies, contracts, partnerships, and agreements. New product & service launches, mergers and acquisitions, and recent developments associated with the Interposer and FOWLP market. Competitive analysis of upcoming startups in the Interposer and FOWLP market ecosystem is covered in this report.


Key Benefits of Buying the Report
§ Analysis of key drivers (Rising trend of miniaturization and form factor requirements; Increasing demand for advanced packaging in AI and high-performance computing; Growing demand for consumer electronics and gaming devices; Cost advantages offered by advanced packaging), restraints (Environmental concerns due to the usage of certain materials and chemicals; Complex manufacturing process), opportunities (Growing demand for IoT devices and wearables; Integration of advanced electronics in automobiles), and challenges (Thermal issues in wafer level packaging; Complexities in supply chain) influencing the growth of the Interposer and FOWLP market.

• Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and new product launches in the Interposer and FOWLP market
• Market Development: Comprehensive information about lucrative markets – the report analyses the Interposer and FOWLP market across varied regions.
• Market Diversification: Exhaustive information about new products/services, untapped geographies, recent developments, and investments in the Interposer and FOWLP market
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), among others in the interposers and FOWLP market.

Table of Contents

1            INTRODUCTION            29

1.1         STUDY OBJECTIVES      29

1.2         MARKET DEFINITION   29

1.3         INCLUSIONS AND EXCLUSIONS 30

1.4         STUDY SCOPE  30

FIGURE 1           INTERPOSER AND FOWLP MARKET SEGMENTATION    30

1.4.1      REGIONAL SCOPE         31

1.4.2      YEARS CONSIDERED     31

1.4.3      CURRENCY CONSIDERED          31

1.4.4      UNITS CONSIDERED     31

1.5         LIMITATIONS   32

1.6         STAKEHOLDERS            32

1.7         SUMMARY OF CHANGES            32

1.8         IMPACT OF RECESSION 33

2            RESEARCH METHODOLOGY     34

2.1         RESEARCH DATA           34

FIGURE 2           INTERPOSER AND FOWLP MARKET: RESEARCH DESIGN              34

2.1.1      SECONDARY AND PRIMARY RESEARCH 36

2.1.2      SECONDARY DATA       36

2.1.2.1   List of major secondary sources       37

2.1.2.2   Key data from secondary sources     37

2.1.3      PRIMARY DATA 37

2.1.3.1   Breakdown of primaries     37

2.1.3.2   Key data from primary sources         38

2.1.3.3   Key industry insights          39

2.1.3.4   List of primary interview participants             39

2.2         MARKET SIZE ESTIMATION METHODOLOGY    40

FIGURE 3           INTERPOSER AND FOWLP MARKET: MARKET SIZE ESTIMATION METHODOLOGY 40

2.2.1      BOTTOM-UP APPROACH           40

2.2.1.1   Approach to arrive at market size using bottom-up analysis (demand side)              41

FIGURE 4           INTERPOSER AND FOWLP MARKET: BOTTOM-UP APPROACH              41

2.2.2      TOP-DOWN APPROACH             41

2.2.2.1   Approach to arrive at market size using top-down analysis (supply side)  42

FIGURE 5           INTERPOSER AND FOWLP MARKET: TOP-DOWN APPROACH              42

FIGURE 6           INTERPOSER AND FOWLP MARKET: SUPPLY-SIDE ANALYSIS              42

2.3         MARKET BREAKDOWN AND DATA TRIANGULATION    43

FIGURE 7           INTERPOSER AND FOWLP MARKET: DATA TRIANGULATION              43

2.4         RESEARCH ASSUMPTIONS         43

TABLE 1             INTERPOSER AND FOWLP MARKET: RESEARCH ASSUMPTIONS              43

2.5         RESEARCH LIMITATIONS           44

FIGURE 8           INTERPOSER AND FOWLP MARKET: RESEARCH LIMITATIONS              44

2.6         RISK ASSESSMENT         44

TABLE 2             INTERPOSER AND FOWLP MARKET: RISK ASSESSMENT 44

2.7         PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET       44

TABLE 3             INTERPOSER AND FOWLP MARKET: PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET            44

3            EXECUTIVE SUMMARY 45

FIGURE 9           CONSUMER ELECTRONICS TO HOLD LARGEST SHARE OF INTERPOSER AND FOWLP MARKET IN 2029       46

FIGURE 10         MEMS/SENSORS TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD        46

FIGURE 11         2.5D PACKAGING TYPE TO ACCOUNT FOR LARGER MARKET SHARE IN 2024  47

FIGURE 12         INTERPOSER AND FOWLP PACKAGING MARKET IN ASIA PACIFIC TO RECORD HIGHEST CAGR FROM 2024 TO 2029          47

4            PREMIUM INSIGHTS      48

4.1         ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN INTERPOSER AND FOWLP MARKET            48

FIGURE 13         GROWING DEMAND FOR CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH           48

4.2         INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN    48

FIGURE 14         INTERPOSERS TO ACCOUNT FOR LARGER MARKET SHARE IN 2029      48

4.3         INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY   49

FIGURE 15         MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD   49

4.4         INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC, BY END-USER INDUSTRY AND COUNTRY        49

FIGURE 16         CONSUMER ELECTRONICS END-USER INDUSTRY AND CHINA HELD LARGEST SHARES OF INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC IN 2023              49

4.5         INTERPOSER AND FOWLP MARKET, BY COUNTRY         50

FIGURE 17         CHINA TO REGISTER HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD   50

5            MARKET OVERVIEW     51

5.1         INTRODUCTION            51

5.2         MARKET DYNAMICS     51

FIGURE 18         INTERPOSER AND FOWLP MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES    51

5.2.1      DRIVERS            52

5.2.1.1   Surging demand for miniaturized electronic devices     52

5.2.1.2   Growing reliance on AI and high-performance computing technologies   52

5.2.1.3   Rising popularity of esports and game streaming platforms        52

FIGURE 19         NUMBER OF GLOBAL SMARTPHONE AND MOBILE PHONE USERS,  2020–2025         53

5.2.1.4   Increasing focus on developing advanced chip packaging techniques        53

FIGURE 20         IMPACT ANALYSIS: DRIVERS     54

5.2.2      RESTRAINTS     54

5.2.2.1   Environmental concerns associated with use of chemicals in interposer production facilities 54

5.2.2.2   Requirement for advanced and high-cost manufacturing techniques        55

FIGURE 21         IMPACT ANALYSIS: RESTRAINTS            55

5.2.3      OPPORTUNITIES           55

5.2.3.1   Growing demand for wearable IoT devices    55

5.2.3.2   Integration of advanced electronics into automobiles   56

FIGURE 22         IMPACT ANALYSIS: OPPORTUNITIES    56

5.2.4      CHALLENGES   57

5.2.4.1   Thermal issues in interposer and wafer-level packaging             57

5.2.4.2   Managing complex semiconductor supply chain           57

FIGURE 23         IMPACT ANALYSIS: CHALLENGES          57

5.3         SUPPLY CHAIN ANALYSIS          58

FIGURE 24         INTERPOSER AND FOWLP MARKET: SUPPLY CHAIN ANALYSIS              58

5.4         ECOSYSTEM/MARKET MAP       59

FIGURE 25         KEY PLAYERS IN INTERPOSER AND FOWLP ECOSYSTEM              59

TABLE 4             COMPANIES AND THEIR ROLES IN INTERPOSER AND FOWLP ECOSYSTEM     60

5.5         PRICING ANALYSIS        61

5.5.1      AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS           61

FIGURE 26         AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS (USD/THOUSAND UNITS)   61

5.5.2      AVERAGE SELLING PRICE OF 12-INCH WAFERS 62

TABLE 5             AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023 (USD/THOUSAND UNITS)          62

FIGURE 27         AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023              62

5.5.3      AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION       62

FIGURE 28         AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION, 2019–2023          63

5.6         TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 63

FIGURE 29         INTERPOSER AND FOWLP MARKET: TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 64

5.7         TECHNOLOGY ANALYSIS           64

5.7.1      3D STACKING   64

5.7.2      FAN-OUT PANEL-LEVEL PACKAGING   65

5.7.3      MONOLITHIC 3D           65

5.7.4      3D IC    65

5.8         PORTER’S FIVE FORCES ANALYSIS         66

FIGURE 30         INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS          66

TABLE 6             INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS          67

5.8.1      INTENSITY OF COMPETITIVE RIVALRY 67

5.8.2      BARGAINING POWER OF SUPPLIERS     67

5.8.3      BARGAINING POWER OF BUYERS           67

5.8.4      THREAT OF SUBSTITUTES         68

5.8.5      THREAT OF NEW ENTRANTS    68

5.9         KEY STAKEHOLDERS AND BUYING CRITERIA    68

5.9.1      KEY STAKEHOLDERS IN BUYING PROCESS         68

FIGURE 31         INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES  68

TABLE 7             INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER  INDUSTRIES (%)       68

5.9.2      BUYING CRITERIA         69

FIGURE 32         KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES              69

TABLE 8             KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES              69

5.10       CASE STUDY ANALYSIS 69

5.10.1    SPTS TECHNOLOGIES PARTNERS WITH IMEC TO REDUCE WAFER THINNING COSTS          69

5.10.2    SEMICONDUCTOR FOUNDRY USES SPTS OMEGA RAPIER XE TO ENHANCE PRODUCTIVITY OF WAFER BACKSIDE VIA REVEAL PROCESS 70

5.10.3    CHROMALOX, INC. DEVELOPS KAPTON HEATERS TO GAIN CONTROL OVER TEMPERATURE-SENSITIVE ETCHING CHEMICALS            70

5.11       TRADE ANALYSIS          70

5.11.1    IMPORT SCENARIO       71

FIGURE 33         IMPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION)    71

5.11.2    EXPORT SCENARIO       71

FIGURE 34         EXPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION)    71

5.12       PATENT ANALYSIS        72

FIGURE 35         INTERPOSER AND FOWLP MARKET: PATENTS APPLIED AND GRANTED,  2013–2023  72

TABLE 9             LIST OF PATENTS IN INTERPOSER AND FOWLP MARKET              73

5.13       KEY CONFERENCES AND EVENTS, 2024–2025     74

TABLE 10           INTERPOSER AND FOWLP MARKET: LIST OF CONFERENCES AND EVENTS, 2024–2025             74

5.14       TARIFF, REGULATORY LANDSCAPE, AND STANDARDS 75

5.14.1    COUNTRY-WISE TARIFF FOR HS CODE 381800-COMPLIANT PRODUCTS              75

TABLE 11           MFN TARIFF FOR PRODUCTS UNDER HS CODE 381800 EXPORTED BY BRAZIL  75

5.14.2    REGULATORY BODIES, GOVERNMENT AGENCIES,  AND OTHER ORGANIZATIONS          76

TABLE 12           NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES,  AND OTHER ORGANIZATIONS      76

TABLE 13           EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 76

TABLE 14           ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES,  AND OTHER ORGANIZATIONS      77

TABLE 15           ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS          77

5.14.3    REGULATIONS 77

5.14.3.1 North America     78

5.14.3.2 Europe  78

5.14.3.3 Asia Pacific          79

5.14.3.4 RoW      79

5.14.4    STANDARDS     79

6            INTERPOSER AND FOWLP MARKET,  BY PACKAGING COMPONENT AND DESIGN    80

6.1         INTRODUCTION            81

FIGURE 36         INTERPOSERS TO REGISTER HIGHER CAGR BETWEEN 2024 AND 2029           81

TABLE 16           INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN,  2020–2023 (USD BILLION) 81

TABLE 17           INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN,  2024–2029 (USD BILLION) 81

6.2         INTERPOSERS  82

TABLE 18           INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2020–2023 (USD BILLION)  82

TABLE 19           INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2024–2029 (USD BILLION)  82

TABLE 20           INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT,  2020–2023 (USD MILLION) 83

TABLE 21           INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT,  2024–2029 (USD MILLION) 83

TABLE 22           INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION)    83

TABLE 23           INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION)    84

6.2.1      SILICON             84

6.2.1.1   Implementation of silicon interposers to stack multiple semiconductor dies in single package to foster segmental growth      84

6.2.2      ORGANIC          84

6.2.2.1   Adoption of organic interposers to facilitate effective thermal management to accelerate segmental growth            84

6.2.3      GLASS  85

6.2.3.1   Use of glass interposers to ensure high-speed electrical data transfer to fuel segmental growth 85

6.2.4      CERAMIC           85

6.2.4.1   Trend of electronic device miniaturization to augment demand for ceramic interposers           85

6.2.5      OTHER INTERPOSERS  86

6.3         FOWLP 86

6.3.1      VERSATILITY AND FLEXIBLE DESIGN TO BOOST ADOPTION OF FOWLP TECHNOLOGY 86

TABLE 24           FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2020–2023 (USD BILLION)           86

TABLE 25           FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2024–2029 (USD BILLION)           87

TABLE 26           FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION) 87

TABLE 27           FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION) 87

6.3.2      SINGLE-DIE      88

6.3.3      MULTI-DIE        88

7            INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE         91

7.1         INTRODUCTION            92

FIGURE 37         INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE              92

FIGURE 38         3D PACKAGING TYPE TO DEPICT HIGHER CAGR FROM 2024 TO 2029      92

TABLE 28           INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)           93

TABLE 29           INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)           93

7.2         2.5D      94

7.2.1      ADOPTION OF 2.5D PACKAGING TECHNOLOGY TO ENHANCE PERFORMANCE OF COMPUTING SOLUTIONS TO DRIVE MARKET          94

TABLE 30           2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)     94

TABLE 31           2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)     94

7.3         3D         95

7.3.1      USE OF 3D PACKAGING SOLUTIONS IN ADVANCED SEMICONDUCTOR MANUFACTURING FACILITIES TO FUEL SEGMENTAL GROWTH             95

TABLE 32           3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 95

TABLE 33           3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 95

8            INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE   96

8.1         INTRODUCTION            97

FIGURE 39         MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD   97

TABLE 34           INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD BILLION)      97

TABLE 35           INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2024–2029 (USD BILLION)      98

8.2         LOGIC ICS         98

8.2.1      GROWING DEMAND FOR SMART HOME APPLIANCES TO CONTRIBUTE TO SEGMENTAL GROWTH        98

TABLE 36           LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION) 99

TABLE 37           LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION) 99

8.3         IMAGING & OPTOELECTRONICS            99

8.3.1      RISING POPULARITY OF AUTONOMOUS VEHICLES TO ACCELERATE SEGMENTAL GROWTH 99

TABLE 38           IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)  100

TABLE 39           IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)  100

8.4         MEMORY DEVICES        101

8.4.1      INCREASING DEMAND FOR SPECIALIZED AI AND ML HARDWARE COMPONENTS TO DRIVE MARKET        101

TABLE 40           MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION)         101

TABLE 41           MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION)         102

8.5         MEMS/SENSORS             102

8.5.1      ESCALATING ADOPTION OF ADVANCED CONSUMER ELECTRONICS TO FOSTER SEGMENTAL GROWTH       102

TABLE 42           MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION)    103

TABLE 43           MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION)    103

8.6         LEDS    103

8.6.1      INCREASING USE OF LEDS IN TELECOMMUNICATION DEVICES TO PROPEL MARKET          103

TABLE 44           LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION) 104

TABLE 45           LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION) 104

8.7         OTHER DEVICE TYPES 104

TABLE 46           OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)           105

TABLE 47           OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)           105

9            INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY   106

9.1         INTRODUCTION            107

FIGURE 40         AUTOMOTIVE END-USER INDUSTRY TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET FROM 2024 TO 2029           107

TABLE 48           INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD BILLION)           107

TABLE 49           INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD BILLION)           108

9.2         CONSUMER ELECTRONICS        108

9.2.1      SURGING DEMAND FOR SLEEK AND MULTIFUNCTIONAL ELECTRONIC GADGETS TO DRIVE MARKET      108

TABLE 50           CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)          109

TABLE 51           CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)          109

TABLE 52           CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2020–2023 (USD MILLION) 109

TABLE 53           CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2024–2029 (USD MILLION) 110

TABLE 54           CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION,  2020–2023 (USD MILLION)          110

TABLE 55           CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION,  2024–2029 (USD MILLION)          110

9.3         MANUFACTURING        111

9.3.1      ESCALATING ADOPTION OF SMART MANUFACTURING AND INDUSTRY 4.0 TECHNOLOGIES TO FUEL SEGMENTAL GROWTH            111

TABLE 56           MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)      111

TABLE 57           MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)      111

TABLE 58           MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2020–2023 (USD MILLION)         112

TABLE 59           MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2024–2029 (USD MILLION)         112

TABLE 60           MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION,  2020–2023 (USD MILLION)     112

TABLE 61           MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION,  2024–2029 (USD MILLION)     113

9.4         COMMUNICATIONS      113

9.4.1      INCREASING DEVELOPMENT OF DATA CENTERS TO CONTRIBUTE TO SEGMENTAL GROWTH 113

TABLE 62           COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)      113

TABLE 63           COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)      114

TABLE 64           COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2020–2023 (USD MILLION)         114

TABLE 65           COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2024–2029 (USD MILLION)         114

TABLE 66           COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION,  2020–2023 (USD MILLION)     115

TABLE 67           COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION,  2024–2029 (USD MILLION)     115

9.5         AUTOMOTIVE  115

9.5.1      RISING POPULARITY OF ELECTRIC VEHICLES TO ACCELERATE SEGMENTAL GROWTH 115

TABLE 68           AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)      116

TABLE 69           AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)      116

TABLE 70           AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2020–2023 (USD MILLION)          116

TABLE 71           AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2024–2029 (USD MILLION)          117

TABLE 72           AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION,  2020–2023 (USD MILLION)     117

TABLE 73           AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION,  2024–2029 (USD MILLION)     117

9.6         HEALTHCARE  118

9.6.1      RAPID ADVANCEMENTS IN WEARABLE HEALTHCARE DEVICES TO FOSTER SEGMENTAL GROWTH 118

TABLE 74           HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)      118

TABLE 75           HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)      118

TABLE 76           HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2020–2023 (USD MILLION)          119

TABLE 77           HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2024–2029 (USD MILLION)          119

TABLE 78          HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION,  2020–2023 (USD MILLION)          119

TABLE 79          HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION,  2024–2029 (USD MILLION)          120

9.7         AEROSPACE      120

9.7.1      INCREASING INTEGRATION OF COMPLEX SYSTEMS AND SENSORS INTO AIRCRAFT TO BOOST SEGMENTAL GROWTH       120

TABLE 80           AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)      120

TABLE 81           AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)      121

TABLE 82           AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2020–2023 (USD MILLION)          121

TABLE 83           AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE,  2024–2029 (USD MILLION)          121

TABLE 84           AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)          122

TABLE 85           AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)          122

10          INTERPOSER AND FOWLP MARKET, BY REGION             123

10.1       INTRODUCTION            124

FIGURE 41         ASIA PACIFIC TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET BETWEEN 2024 AND 2029 124

TABLE 86           INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD BILLION) 124

TABLE 87           INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD BILLION) 125

10.2       NORTH AMERICA          125

FIGURE 42         NORTH AMERICA: INTERPOSER AND FOWLP MARKET SNAPSHOT        126

TABLE 88           NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY,  2020–2023 (USD MILLION) 126

TABLE 89           NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY,  2024–2029 (USD MILLION) 127

TABLE 90           NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION)         127

TABLE 91           NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION)         127

TABLE 92           NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2020–2023 (USD MILLION) 128

TABLE 93           NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2024–2029 (USD MILLION) 128

10.2.1    RECESSION IMPACT ON MARKET IN NORTH AMERICA 128

10.2.2    US         128

10.2.2.1 Rising focus on enhancing performance and functionality of electronic devices to drive market        128

10.2.3    CANADA            129

10.2.3.1 Growing emphasis on enhancing semiconductor design and manufacturing to contribute to market growth            129

10.2.4    MEXICO             130

10.2.4.1 Increasing investment in semiconductor R&D projects to fuel market growth              130

10.3       EUROPE             131

FIGURE 43         EUROPE: INTERPOSER AND FOWLP MARKET SNAPSHOT              131

TABLE 94           EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)          132

TABLE 95           EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)          132

TABLE 96           EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION) 132

TABLE 97           EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION) 133

TABLE 98           EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2020–2023 (USD MILLION)          133

TABLE 99           EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2024–2029 (USD MILLION)          133

10.3.1    RECESSION IMPACT ON MARKET IN EUROPE    133

10.3.2    UK         134

10.3.2.1 Rapid advancement in 5G technology to foster market growth   134

10.3.3    GERMANY         134

10.3.3.1 Increased adoption of connected cars and smart home devices to accelerate market growth   134

10.3.4    FRANCE             135

10.3.4.1 Highly developed transport and communication networks to contribute to market growth   135

10.3.5    REST OF EUROPE           135

10.4       ASIA PACIFIC    135

FIGURE 44         ASIA PACIFIC: INTERPOSER AND FOWLP MARKET SNAPSHOT              136

TABLE 100         ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY,  2020–2023 (USD MILLION) 137

TABLE 101         ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY,  2024–2029 (USD MILLION) 137

TABLE 102         ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION)    137

TABLE 103         ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION)    138

TABLE 104         ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2020–2023 (USD MILLION) 138

TABLE 105         ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2024–2029 (USD MILLION) 138

10.4.1    RECESSION IMPACT ON MARKET IN ASIA PACIFIC         138

10.4.2    CHINA  139

10.4.2.1 Increasing expansion of automobile and semiconductor manufacturing facilities to propel market      139

10.4.3    JAPAN  139

10.4.3.1 Rising production of advanced consumer electronics to boost market growth              139

10.4.4    SOUTH KOREA 140

10.4.4.1 Growing number of semiconductor fabrication plants to augment market growth              140

10.4.5    REST OF ASIA PACIFIC  140

10.5       ROW     140

TABLE 106         ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)     141

TABLE 107         ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)     141

TABLE 108         ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2020–2023 (USD MILLION) 141

TABLE 109         ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY,  2024–2029 (USD MILLION) 142

TABLE 110         ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2020–2023 (USD MILLION)          142

TABLE 111         ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE,  2024–2029 (USD MILLION)          142

10.5.1    RECESSION IMPACT ON MARKET IN ROW          142

10.5.2    MIDDLE EAST & AFRICA             143

10.5.2.1 High commitment to technological innovation to contribute to market growth              143

10.5.3    SOUTH AMERICA           143

10.5.3.1 Increased R&D of advanced packaging technologies to propel market      143

11          COMPETITIVE LANDSCAPE       144

11.1       INTRODUCTION            144

11.2       STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023      144

TABLE 112         INTERPOSER AND FOWLP MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023      144

11.2.1    PRODUCT PORTFOLIO EXPANSION      145

11.2.2    REGIONAL FOOTPRINT EXPANSION     145

11.2.3    ORGANIC/INORGANIC GROWTH           145

11.3       MARKET SHARE ANALYSIS, 2023             146

TABLE 113         INTERPOSER AND FOWLP MARKET: DEGREE OF COMPETITION 146

11.4       REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022       147

FIGURE 45         REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022       147

11.5       COMPANY EVALUATION MATRIX, 2023 148

11.5.1    STARS  148

11.5.2    EMERGING LEADERS    148

11.5.3    PERVASIVE PLAYERS     148

11.5.4    PARTICIPANTS 148

FIGURE 46         INTERPOSER AND FOWLP MARKET: COMPANY EVALUATION MATRIX, 2023    149

11.5.5    COMPANY FOOTPRINT 149

TABLE 114         COMPANY PACKAGING TYPE FOOTPRINT (10 KEY COMPANIES)    149

TABLE 115         COMPANY PACKAGING COMPONENT AND DESIGN FOOTPRINT (10 KEY COMPANIES)         150

TABLE 116         COMPANY REGION FOOTPRINT (10 KEY COMPANIES)  150

TABLE 117         OVERALL COMPANY FOOTPRINT (10 KEY COMPANIES)              151

11.6       START-UP/SME EVALUATION MATRIX, 2023      151

TABLE 118         INTERPOSER AND FOWLP MARKET: LIST OF KEY START-UPS/SMES         151

11.6.1    PROGRESSIVE COMPANIES       152

11.6.2    RESPONSIVE COMPANIES          152

11.6.3    DYNAMIC COMPANIES 152

11.6.4    STARTING BLOCKS       152

FIGURE 47         INTERPOSER AND FOWLP MARKET: START-UP/SME EVALUATION MATRIX, 2023      152

11.6.5    COMPETITIVE BENCHMARKING            153

TABLE 119         INTERPOSER AND FOWLP MARKET: COMPETITIVE BENCHMARKING OF KEY START-UPS/SMES      153

11.7       COMPETITIVE SITUATION AND TRENDS           153

11.7.1    PRODUCT LAUNCHES  153

TABLE 120         INTERPOSER AND FOWLP MARKET: PRODUCT LAUNCHES,  AUGUST 2020–NOVEMBER 2023 153

11.7.2    DEALS  155

TABLE 121         INTERPOSER AND FOWLP MARKET: DEALS, FEBRUARY 2021–JANUARY 2024  155

12          COMPANY PROFILES    157

12.1       INTRODUCTION            157

12.2       KEY PLAYERS   157

(Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats)*

12.2.1    TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED              157

TABLE 122         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW            157

FIGURE 48         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT            158

TABLE 123         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED             158

TABLE 124         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES            159

TABLE 125         TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS            159

12.2.2    SAMSUNG         161

TABLE 126         SAMSUNG: COMPANY OVERVIEW          161

FIGURE 49         SAMSUNG: COMPANY SNAPSHOT          162

TABLE 127         SAMSUNG: PRODUCTS/SOLUTIONS/SERVICES OFFERED              162

TABLE 128         SAMSUNG: PRODUCT LAUNCHES          163

TABLE 129         SAMSUNG: DEALS         163

12.2.3    ASE TECHNOLOGY HOLDING CO., LTD.             165

TABLE 130         ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW              165

FIGURE 50         ASE TECHNOLOGY HOLDING CO. LTD.: COMPANY SNAPSHOT              166

TABLE 131         ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED   166

TABLE 132         ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES              167

TABLE 133         ASE TECHNOLOGY HOLDING CO., LTD.: DEALS             167

12.2.4    AMKOR TECHNOLOGY 169

TABLE 134         AMKOR TECHNOLOGY: COMPANY OVERVIEW 169

FIGURE 51         AMKOR TECHNOLOGY: COMPANY SNAPSHOT 170

TABLE 135         AMKOR TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED          170

TABLE 136         AMKOR TECHNOLOGY: DEALS 171

TABLE 137         AMKOR TECHNOLOGY: OTHERS           171

12.2.5    SK HYNIX INC.   173

TABLE 138         SK HYNIX INC.: COMPANY OVERVIEW   173

FIGURE 52         SK HYNIX INC.: COMPANY SNAPSHOT  173

TABLE 139         SK HYNIX INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED              174

TABLE 140         SK HYNIX INC.: PRODUCT LAUNCHES   174

12.2.6    GLOBAL FOUNDRIES INC.          175

TABLE 141         GLOBAL FOUNDRIES INC.: COMPANY OVERVIEW          175

FIGURE 53         GLOBAL FOUNDRIES INC.: COMPANY SNAPSHOT          176

TABLE 142         GLOBAL FOUNDRIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED          176

TABLE 143         GLOBAL FOUNDRIES INC.: DEALS          177

TABLE 144         GLOBAL FOUNDRIES INC.: OTHERS       177

12.2.7    DECA TECHNOLOGIES 178

TABLE 145         DECA TECHNOLOGIES: COMPANY OVERVIEW  178

TABLE 146         DECA TECHNOLOGIES: PRODUCTS/SOLUTIONS/SERVICES OFFERED          178

TABLE 147         DECA TECHNOLOGIES: DEALS 179

12.2.8    JCET GROUP LTD.         180

TABLE 148         JCET GROUP LTD.: COMPANY OVERVIEW          180

FIGURE 54         JCET GROUP LTD.: COMPANY SNAPSHOT         180

TABLE 149         JCET GROUP LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED          181

TABLE 150         JCET GROUP LTD.: PRODUCT LAUNCHES          181

TABLE 151         JCET GROUP LTD.: OTHERS      181

12.2.9    POWERTECH TECHNOLOGY INC.          182

TABLE 152         POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW              182

FIGURE 55         POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT              183

TABLE 153         POWERTECH TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED   183

TABLE 154         POWERTECH TECHNOLOGY INC.: DEALS          184

12.2.10  ADVANCED MICRO DEVICES, INC.         185

TABLE 155         ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW              185

FIGURE 56         ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT              186

TABLE 156         ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES       186

TABLE 157         ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES              187

12.3       OTHER PLAYERS           188

12.3.1    NEXLOGIC TECHNOLOGIES INC.            188

12.3.2    SPTS TECHNOLOGIES LTD.       188

12.3.3    TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION   189

12.3.4    SAMTEC            189

12.3.5    TELEDYNE DIGITAL IMAGING INC.       190

12.3.6    OKMETIC          190

12.3.7    AMS-OSRAM AG             191

12.3.8    NEPES  191

12.3.9    NHANCED SEMICONDUCTORS 192

12.3.10  DUPONT           192

12.3.11  ALLVIA INC.      193

12.3.12  UNITED MICROELECTRONICS CORPORATION 193

12.3.13  DAI NIPPON PRINTING CO., LTD.           194

12.3.14  RENA TECHNOLOGIES GMBH   194

12.3.15  MURATA MANUFACTURING CO., LTD  195

*Details on Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats might not be captured in case of unlisted companies.

13          APPENDIX         196

13.1       INSIGHTS FROM INDUSTRY EXPERTS   196

13.2       DISCUSSION GUIDE      197

13.3       KNOWLEDGESTORE: MARKETSANDMARKETS’  SUBSCRIPTION PORTAL             200

13.4       CUSTOMIZATION OPTIONS      202

13.5       RELATED REPORTS       202

13.6       AUTHOR DETAILS         203


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