조사회사 : MarketsandMarkets (마켓츠앤마켓츠) 조사년월 : 2023년08월
SiC 웨이퍼 연마 (SiC Wafer Polishing) 시장 : 제품 유형(연마, 연마 패드, 다이아몬드 슬러리, 콜로이드 실리카 현탁액), 용도, 프로세스, 지역(북미, 유럽, APAC, 남미, MEA) – 2028년 세계 예측
SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), application, Process, & Region (North America, Europe, APAC, South America, MEA) – Global Forecast 2028
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The Sic wafer polishing market is projected to grow from USD 0.4 billion in 2023 to USD 2.2 billion by 2028, at a CAGR of 37.5% from 2023 to 2028. Considering these factors, the increasing demand for SiC wafers in the power electronics, automotive, aerospace, and telecommunications sectors is driving the market expansion. SiC wafers offer exceptional properties like high thermal conductivity and wide bandgap, making them essential for advanced devices that require higher efficiency and performance. Additionally, the growing adoption of SiC-based devices in renewable energy systems and electric vehicles is fueling the demand for high-quality polished wafers.
“By product type, the diamond slurry sic wafer polishing centrifuges segment is estimated to be the fastest-growing segment of the Sic wafer polishing market from 2023 to 2028.”
Based on the product type, the Sic wafer polishing market made of diamond slurry sic wafer polishing centrifuge is regarded as one of the greatest product types. The inherent hardness and sharpness of diamond particles make them highly effective in tackling the challenges presented by SiC wafers, resulting in precise material removal and exceptional surface smoothness. As demand for SiC-based power electronics, optoelectronics, and high-frequency devices continues to surge, manufacturers seek advanced and reliable polishing solutions. Diamond slurry products meet these requirements, offering excellent control over material removal rates and superior planarization, leading to enhanced device performance and yield.
“By process, Chemical mechanical polishing process estimated to be the fastest-growing segment of Sic wafer polishing market from 2023 to 2028.”
Based on application, the chemical mechanical polishing (CMP) segment is expected to be the most significant in the sic wafer polishing market during the forecast period due to Its unique capacity to give a highly controlled and exact polishing procedure. CMP combines chemical reactions and mechanical abrasion to provide superior planarization and surface smoothness on SiC wafers, both of which are required for high-performance semiconductor devices. Its success is also due to its compatibility with diverse SiC substrate types and its ability to handle larger wafer sizes, answering the semiconductor industry’s aspirations for advanced applications. Furthermore, the efficacy of CMP in eliminating flaws and impurities from SiC wafers makes it a preferred method for producing reliable and high-quality devices.
“The Sic wafer polishing market in Asia Pacific region is projected to witness the highest CAGR during the forecast period.”
The Asia Pacific region is projected to register the highest CAGR in the Sic wafer polishing market from 2023 to 2028. Asia Pacific is one of the key markets of sic wafer polishing considering these factors, as the region is a major hub for the electronics and semiconductor industries, with countries like China, Japan, South Korea, and Taiwan playing significant roles in global semiconductor production. The growing demand for SiC-based devices, such as power electronics, RF components, and LEDs, is driving the need for high-quality polished SiC wafers, fostering the expansion of the polishing market.
Profile break-up of primary participants for the report:
• By Company Type: Tier 1 – 35%, Tier 2 – 45%, and Tier 3 – 20%
• By Designation: C-level Executives – 35%, Directors – 25%, and Others – 40%
• By Region: North America – 40%, Europe –20%, Asia Pacific – 30% Middle East & Africa-5%, and South America-5%
The Sic wafer polishing market report is dominated by players such as Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), Saint-Gobain (US), JSR Corporation (Japan), Engis Corporation (US), Ferro Corporation (US), 3M (US), SKC (South Korea), DuPont Incorporated (US), Fujifilm Holding America Corporation (US), and others.
Research Coverage:
The report defines, segments, and projects the size of the sic wafer polishing based on type, design type, application, and region. It strategically profiles the key players and comprehensively analyzes their market share and core competencies. It also tracks and analyzes competitive developments, such as new product launches, agreements, contracts, partnerships, and acquisitions undertaken by them in the market.
Reasons to Buy the Report:
The report is expected to help the market leaders/new entrants in the market by providing them with the closest approximations of revenue numbers of the sic wafer polishing and their segments. This report is also expected to help stakeholders obtain an improved understanding of the competitive landscape of the market, gain insights to improve the position of their businesses and make suitable go-to-market strategies. It also enables stakeholders to understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.
The report provides insights on the following pointers:
Analysis of key drivers (Growing Consumption of Consumer Electronics, Growing demand for SIC-based power devices, Development of advanced polishing consumables, Adoption of SiC wafers in radio frequency (RF) devices.), restraints (Surface defects and contamination, Long polishing cycle times, Limited supplier base.), opportunities (Growing investments in SiC research and development, Emergence of new applications, Advancements in polishing technologies), and challenges (Complexity Regarding Manufacturing, Intense competition and market consolidation) influencing the growth of the sic wafer polishing market.
• Product Development/Innovation: Detailed insights on upcoming technologies, research &
development activities in the sic wafer polishing.
• Market Development: Comprehensive information about sic wafer polishing – the report analyses
the sic wafer polishing across varied regions.
• Market Diversification: Exhaustive information about new products & services, untapped
geographies, recent developments, and investments in the sic wafer polishing market.
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and service
offerings of leading players like Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), and Saint-Gobain (US). among others in the sic wafer polishing market.
목차
1 INTRODUCTION 18
1.1 STUDY OBJECTIVES 18
1.2 MARKET DEFINITION 18
1.3 INCLUSIONS & EXCLUSIONS 18
1.4 MARKET SCOPE 19
1.4.1 MARKETS COVERED 19
1.4.2 REGIONAL SCOPE 19
1.4.3 YEARS CONSIDERED 20
1.5 CURRENCY CONSIDERED 20
1.6 LIMITATIONS 20
1.7 STAKEHOLDERS 21
2 RESEARCH METHODOLOGY 22
2.1 RESEARCH DATA 22
FIGURE 1 SIC WAFER POLISHING MARKET: RESEARCH DESIGN 22
2.1.1 SECONDARY DATA 23
2.1.1.1 Key data from secondary sources 23
2.1.2 PRIMARY DATA 24
2.1.2.1 Key data from primary sources 24
FIGURE 2 KEY INDUSTRY INSIGHTS 24
2.1.2.2 Breakdown of primary interviews 25
FIGURE 3 BREAKDOWN OF PRIMARY INTERVIEWS: BY COMPANY TYPE, DESIGNATION, AND REGION 25
2.2 DATA TRIANGULATION 26
FIGURE 4 DATA TRIANGULATION 26
2.3 MARKET SIZE ESTIMATION 27
2.3.1 BOTTOM-UP APPROACH 27
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 27
2.3.2 TOP-DOWN APPROACH 28
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 28
2.3.3 DEMAND SIDE 28
FIGURE 7 DEMAND-SIDE ANALYSIS 28
FIGURE 8 METRICS CONSIDERED FOR ANALYZING AND ASSESSING DEMAND FOR SIC WAFER POLISHING 29
2.3.3.1 Research assumptions 29
2.3.4 FORECAST 30
3 EXECUTIVE SUMMARY 31
TABLE 1 SIC WAFER POLISHING MARKET: SNAPSHOT 31
FIGURE 9 DIAMOND SLURRIES SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD 32
FIGURE 10 POWER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD 32
FIGURE 11 CHEMICAL MECHANICAL POLISHING (CMP) PROCESS TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD 33
FIGURE 12 ASIA PACIFIC TO LEAD SIC WAFER POLISHING MARKET IN 2023 34
4 PREMIUM INSIGHTS 35
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SIC WAFER POLISHING MARKET 35
FIGURE 13 INCREASING AWARENESS OF SUSTAINABLE TECHNOLOGY DRIVING MARKET DURING FORECAST PERIOD 35
4.2 SIC WAFER POLISHING MARKET: ASIA PACIFIC, BY APPLICATION AND COUNTRY 36
FIGURE 14 CHEMICAL AND CHINA ACCOUNTED FOR SIGNIFICANT SHARE IN 2022 36
4.3 SIC WAFER POLISHING MARKET, BY PRODUCT 36
FIGURE 15 DIAMOND SLURRIES SEGMENT TO ACCOUNT FOR LARGEST SHARE BY 2028 36
4.4 SIC WAFER POLISHING MARKET, BY APPLICATION 37
FIGURE 16 POWER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE IN 2028 37
4.5 SIC WAFER POLISHING MARKET, BY PROCESS 37
FIGURE 17 CHEMICAL MECHANICAL POLISHING SEGMENT TO ACCOUNT FOR LARGEST SHARE IN 2028 37
4.6 SIC WAFER POLISHING MARKET: REGIONAL ANALYSIS 38
FIGURE 18 ASIA PACIFIC TO ACCOUNT FOR LARGEST SHARE OF SIC WAFER POLISHING MARKET IN 2023 38
5 MARKET OVERVIEW 39
5.1 INTRODUCTION 39
5.2 MARKET DYNAMICS 39
FIGURE 19 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES IN SIC WAFER POLISHING MARKET 39
5.2.1 DRIVERS 40
5.2.1.1 Growing consumption of consumer electronics 40
5.2.1.2 Growing demand for SiC-based power devices 40
5.2.1.3 Development of advanced polishing consumable 41
5.2.1.4 Adoption of SiC wafers in radio frequency (RF) devices 41
5.2.2 RESTRAINTS 42
5.2.2.1 Surface defects and contamination 42
5.2.2.2 Long polishing cycle times 42
5.2.2.3 Limited supplier base 43
5.2.3 OPPORTUNITIES 43
5.2.3.1 Growing investments in SiC R&D 43
5.2.3.2 Emergence of new applications 43
5.2.3.3 Advancements in polishing technologies 44
5.2.4 CHALLENGES 45
5.2.4.1 Complexity regarding manufacturing 45
5.2.4.2 Intense competition and market consolidation 45
5.3 PORTER’S FIVE FORCES ANALYSIS 46
TABLE 2 SIC WAFER POLISHING MARKET: PORTER’S FIVE FORCES ANALYSIS 46
FIGURE 20 PORTER’S FIVE FORCES ANALYSIS: SIC WAFER POLISHING MARKET 46
5.3.1 THREAT OF NEW ENTRANTS 47
5.3.2 THREATS OF SUBSTITUTES 47
5.3.3 BARGAINING POWER OF SUPPLIERS 47
5.3.4 BARGAINING POWER OF BUYERS 47
5.3.5 INTENSITY OF COMPETITIVE RIVALRY 48
6 INDUSTRY TRENDS 49
6.1 RECESSION IMPACT 49
6.2 VALUE CHAIN ANALYSIS 49
FIGURE 21 VALUE CHAIN FOR SIC WAFER POLISHING MARKET 50
6.2.1 RAW MATERIAL SUPPLIERS 50
6.2.2 MANUFACTURERS 51
6.2.3 DISTRIBUTORS 51
6.2.4 END USER 51
6.3 MACROECONOMIC INDICATORS 52
6.3.1 GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES 52
TABLE 3 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2019–2027 (USD MILLION) 52
6.4 SIC WAFER POLISHING MARKET REGULATIONS 53
6.4.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 53
TABLE 4 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 53
TABLE 5 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 54
TABLE 6 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 54
6.5 TRADE ANALYSIS 55
6.5.1 EXPORT SCENARIO 55
FIGURE 22 EXPORT SCENARIO FOR HS CODE 381800, BY KEY COUNTRY (2019–2022) 55
6.5.2 IMPORT SCENARIO 55
FIGURE 23 IMPORT SCENARIO FOR HS CODE 381800, BY KEY COUNTRY, (2019–2022) 55
6.6 PATENT ANALYSIS 56
6.6.1 INTRODUCTION 56
6.6.2 METHODOLOGY 56
6.6.2.1 Document type 56
TABLE 7 GRANTED PATENTS ACCOUNTED FOR 35% OF TOTAL PATENTS IN LAST 10 YEARS 56
FIGURE 24 PUBLICATION TRENDS OVER LAST TEN YEARS 57
6.6.3 INSIGHTS 57
6.6.4 LEGAL STATUS OF PATENTS 57
FIGURE 25 LEGAL STATUS OF PATENTS FIELD FOR SIC WAFER POLISHING MARKET 57
6.6.5 JURISDICTION ANALYSIS 58
FIGURE 26 TOP JURISDICTION-BY DOCUMENT 58
6.6.6 ANALYSIS OF TOP APPLICANTS 58
FIGURE 27 TAIWAN SEMICONDUCTOR MFG CO LTD REGISTERED HIGHEST NUMBER OF PATIENTS BETWEEN 2017 AND 2022 58
6.7 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 59
6.7.1 REVENUE SHIFTS & NEW REVENUE POCKETS FOR SIC WAFER POLISHING MARKET 59
FIGURE 28 REVENUE SHIFT OF SIC WAFER POLISHING PROVIDERS 59
6.8 ECOSYSTEM/MARKETMAP 60
TABLE 8 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2019–2027 60
FIGURE 29 SIC WAFER POLISHING MARKET: ECOSYSTEM 61
6.9 TECHNOLOGY ANALYSIS 61
6.9.1 CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY 61
TABLE 9 ADVANTAGES OF CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY 62
6.9.2 FIXED ABRASIVE POLISHING (FAP) 62
TABLE 10 ADVANTAGES OF FIXED ABRASIVE POLISHING (FAP) TECHNOLOGY 62
6.10 KEY STAKEHOLDERS AND BUYING CRITERIA 63
6.10.1 KEY STAKEHOLDERS IN BUYING PROCESS 63
FIGURE 30 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 4 APPLICATIONS 63
TABLE 11 INFLUENCE OF INSTITUTIONAL BUYERS ON BUYING PROCESS FOR TOP 4 APPLICATIONS 63
6.10.2 BUYING CRITERIA 64
FIGURE 31 KEY BUYING CRITERIA FOR END-USER INDUSTRIES 64
TABLE 12 KEY BUYING CRITERIA FOR END-USER INDUSTRIES 64
7 SIC WAFER POLISHING MARKET, BY PRODUCT 65
7.1 INTRODUCTION 66
FIGURE 32 SIC WAFER POLISHING MARKET, BY PRODUCT, 2022 66
TABLE 13 SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 66
TABLE 14 SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 67
7.2 ABRASIVE POWDER 67
7.2.1 COMPATIBILITY WITH DIFFERENT POLISHING SYSTEMS AND EQUIPMENT TO DRIVE MARKET 67
7.3 POLISHING PADS 67
7.3.1 HIGHLY VERSATILE NATURE TO INCREASE USAGE 67
7.4 DIAMOND SLURRIES 68
7.4.1 INCREASING DEMAND FOR HIGH-PERFORMANCE SIC-BASED DEVICES TO DRIVE MARKET 68
7.5 COLLOIDAL SILICA SUSPENSIONS 68
7.5.1 COST-EFFECTIVENESS IN SIC WAFER POLISHING PROCESSES TO DRIVE MARKET 68
7.6 OTHERS 69
7.6.1 ABRASIVE SLURRIES 69
8 SIC WAFER POLISHING MARKET, BY PROCESS 70
8.1 INTRODUCTION 71
FIGURE 33 SIC WAFER POLISHING MARKET, BY PROCESS, 2022 71
TABLE 15 SIC WAFER POLISHING MARKET, BY PROCESS, 2020–2022 (USD MILLION) 71
TABLE 16 SIC WAFER POLISHING MARKET SIZE, BY PROCESS, 2023–2028 (USD MILLION) 72
8.2 MECHANICAL POLISHING 72
8.2.1 VERSATILE PROCESS FOR POLISHING COMPLEX SIC WAFERS TO DRIVE MARKET 72
8.3 CHEMICAL-MECHANICAL POLISHING (CMP) 72
8.3.1 HIGH DEMAND FOR POLISHING SEMICONDUCTOR DEVICES TO DRIVE MARKET 72
8.4 ELECTROPOLISHING 73
8.4.1 CUTTING-EDGE ELECTROPOLISHING ADVANCES TO INCREASE DEMAND 73
8.5 CHEMICAL POLISHING 73
8.5.1 RISING DEMAND FOR HIGH-THROUGHPUT SIC POLISHING TO DRIVE MARKET 73
8.6 PLASMA-ASSISTED POLISHING 74
8.6.1 HIGHLY EFFICIENT AND EFFECTIVE PROCESS TO DRIVE MARKET 74
8.7 OTHERS 75
8.7.1 REACTIVE ION ETCHING (RIE) 75
9 SIC WAFER POLISHING MARKET, BY APPLICATION 76
9.1 INTRODUCTION 77
FIGURE 34 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023 77
TABLE 17 SIC WAFER POLISHING MARKET, BY APPLICATION, 2020–2022 (USD MILLION) 77
TABLE 18 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 78
9.2 POWER ELECTRONICS 78
9.2.1 ADVANCED POLISHING TECHNIQUES TO DRIVE MARKET 78
9.3 LIGHT-EMITTING DIODES (LEDS) 79
9.3.1 STABLE ILLUMINATION AND INCREASING PRODUCTIVITY TO DRIVE MARKET 79
9.4 SENSORS AND DETECTORS 79
9.4.1 SIC POLISHING EMPOWERING GROWTH WITH ADVANCED SENSORS AND DETECTORS TO DRIVE MARKET 79
9.5 RF AND MICROWAVE DEVICES 80
9.5.1 ELECTRICAL AND THERMAL PERFORMANCE TO DRIVE MARKET 80
9.6 OTHERS 80
9.6.1 SEMICONDUCTOR DEVICES 80
10 SIC WAFER POLISHING MARKET, BY REGION 81
10.1 INTRODUCTION 82
FIGURE 35 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 82
TABLE 19 SIC WAFER POLISHING MARKET, BY REGION, 2020–2022 (USD MILLION) 82
TABLE 20 SIC WAFER POLISHING MARKET, BY REGION, 2023–2028 (USD MILLION) 83
TABLE 21 SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 83
TABLE 22 SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 83
TABLE 23 SIC WAFER POLISHING MARKET, BY PROCESS, 2020–2022 (USD MILLION) 84
TABLE 24 SIC WAFER POLISHING MARKET, BY PROCESS, 2023–2028 (USD MILLION) 84
TABLE 25 SIC WAFER POLISHING MARKET, BY APPLICATION, 2020–2022 (USD MILLION) 84
TABLE 26 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 85
10.2 EUROPE 85
10.2.1 RECESSION IMPACT 85
FIGURE 36 EUROPE: SIC WAFER POLISHING MARKET SNAPSHOT 86
TABLE 27 EUROPE: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020–2022 (USD MILLION) 86
TABLE 28 EUROPE: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 87
TABLE 29 EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 87
TABLE 30 EUROPE: SIC WAFER POLISHING, BY PRODUCT, 2023–2028 (USD MILLION) 87
10.2.2 GERMANY 88
10.2.2.1 Increasing availability of SiC wafers to drive market 88
TABLE 31 GERMANY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 88
TABLE 32 GERMANY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 88
10.2.3 ITALY 89
10.2.3.1 Government initiatives promoting adoption of renewable energy to drive market 89
TABLE 33 ITALY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 89
TABLE 34 ITALY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 89
10.2.4 FRANCE 90
10.2.4.1 Growing demand for high-performance electronic devices to drive market 90
TABLE 35 FRANCE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 90
TABLE 36 FRANCE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 90
10.2.5 SWEDEN 91
10.2.5.1 Growing importance of cybersecurity for semiconductors to increase market 91
TABLE 37 SWEDEN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 91
TABLE 38 SWEDEN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 91
10.2.6 REST OF EUROPE 92
TABLE 39 REST OF EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 92
TABLE 40 REST OF EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 92
10.3 ASIA PACIFIC 93
10.3.1 RECESSION IMPACT 93
FIGURE 37 ASIA PACIFIC: SIC WAFER POLISHING MARKET SNAPSHOT 94
TABLE 41 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020–2022 (USD MILLION) 94
TABLE 42 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 95
TABLE 43 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 95
TABLE 44 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 95
10.3.2 CHINA 96
10.3.2.1 Increasing demand for SiC wafers in power electronics applications to drive market 96
TABLE 45 CHINA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 96
TABLE 46 CHINA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 96
10.3.3 JAPAN 97
10.3.3.1 Growing importance as semiconductors market to drive growth 97
TABLE 47 JAPAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 97
TABLE 48 JAPAN: SIC WAFER POLISHING MARKET, BY PRODUCT 2023–2028 (USD MILLION) 97
10.3.4 SOUTH KOREA 98
10.3.4.1 Development of new polishing technologies to drive market 98
TABLE 49 SOUTH KOREA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 98
TABLE 50 SOUTH KOREA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 99
10.3.5 TAIWAN 99
10.3.5.1 Efforts to reduce carbon emissions to drive market 99
TABLE 51 TAIWAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 100
TABLE 52 TAIWAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 100
10.3.6 REST OF ASIA PACIFIC 100
TABLE 53 REST OF ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 100
TABLE 54 REST OF ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 101
10.4 NORTH AMERICA 101
10.4.1 RECESSION IMPACT 101
FIGURE 38 NORTH AMERICA: SIC WAFER POLISHING MARKET SNAPSHOT 102
TABLE 55 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020–2022 (USD MILLION) 102
TABLE 56 NORTH AMERICA: SIC WAFER POLISHING MARKE, BY COUNTRY, 2023–2028 (USD MILLION) 103
TABLE 57 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 103
TABLE 58 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 103
10.4.2 US 104
10.4.2.1 Rising adoption of SiC-based power devices in renewable energy to hamper market 104
TABLE 59 US: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 104
TABLE 60 US: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 104
10.4.3 CANADA 105
10.4.3.1 Growing research activities to drive market 105
TABLE 61 CANADA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 105
TABLE 62 CANADA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 105
10.4.4 MEXICO 106
10.4.4.1 Growing telecommunication industry to increase demand 106
TABLE 63 MEXICO: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 106
TABLE 64 MEXICO: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 106
10.5 REST OF WORLD (ROW) 107
TABLE 65 REST OF WORLD: SIC WAFER POLISHING MARKET SIZE, BY COUNTRY, 2020–2022 (USD MILLION) 107
TABLE 66 REST OF WORLD: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 107
TABLE 67 REST OF WORLD: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 107
TABLE 68 REST OF WORLD: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 108
10.5.1 BRAZIL 108
10.5.1.1 Favorable government policies to drive market 108
TABLE 69 BRAZIL: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 108
TABLE 70 BRAZIL: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 109
10.5.2 SOUTH AFRICA 109
10.5.2.1 Expanding SiC wafer manufacturing base to drive demand 109
TABLE 71 SOUTH AFRICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 109
TABLE 72 SOUTH AFRICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 110
10.5.3 REST OF ROW 110
TABLE 73 REST OF ROW: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020–2022 (USD MILLION) 110
TABLE 74 REST OF ROW: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023–2028 (USD MILLION) 110
11 COMPETITIVE LANDSCAPE 111
11.1 INTRODUCTION 111
11.2 STRATEGIES ADOPTED BY KEY PLAYERS 111
TABLE 75 OVERVIEW OF STRATEGIES ADOPTED BY KEY SIC WAFER POLISHING MARKET 111
11.3 MARKET SHARE ANALYSIS 112
11.3.1 RANKING OF KEY MARKET PLAYERS, 2022 112
FIGURE 39 RANKING OF TOP FIVE PLAYERS IN SIC WAFER POLISHING MARKET, 2022 112
11.3.2 MARKET SHARE OF KEY PLAYERS 112
TABLE 76 SIC WAFER POLISHINGS: DEGREE OF COMPETITION 113
FIGURE 40 SIC WAFER POLISHING MARKET IN 2022 113
11.3.2.1 Kemet International Limited 113
11.3.2.2 Entegris 113
11.3.2.3 Fujimi Incorporated 114
11.3.2.4 Ferro Corporation 114
11.3.2.5 Iljin Diamond 114
11.4 COMPANY PRODUCT FOOTPRINT ANALYSIS 114
TABLE 77 SIC WAFER POLISHING MARKET: KEY COMPANY PROCESS FOOTPRINT 114
TABLE 78 SIC WAFER POLISHING MARKET: KEY COMPANY PRODUCT FOOTPRINT 115
TABLE 79 SIC WAFER POLISHING MARKET: KEY COMPANY APPLICATION FOOTPRINT 116
TABLE 80 SIC WAFER POLISHING MARKET: KEY COMPANY REGION FOOTPRINT 116
11.5 COMPANY EVALUATION QUADRANT (TIER 1) 117
11.5.1 STARS 117
11.5.2 EMERGING LEADERS 117
11.5.3 PERVASIVE PLAYERS 117
11.5.4 PARTICIPANTS 117
FIGURE 41 SIC WAFER POLISHING MARKET COMPANY EVALUATION MATRIX, 2022 (TIER 1) 118
11.6 COMPETITIVE BENCHMARKING 119
TABLE 81 SIC WAFER POLISHING MARKET: DETAILED LIST OF KEY STARTUPS/SMES 119
TABLE 82 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS PROCESS FOOTPRINT 120
TABLE 83 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS PRODUCT FOOTPRINT 120
TABLE 84 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS APPLICATION FOOTPRINT 121
TABLE 85 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS REGION FOOTPRINT 122
11.7 STARTUP/SME EVALUATION QUADRANT 122
11.7.1 RESPONSIVE COMPANIES 122
11.7.2 STARTING BLOCKS 122
11.7.3 PROGRESSIVE COMPANIES 122
11.7.4 DYNAMIC COMPANIES 122
FIGURE 42 SIC WAFER POLISHING MARKET STARTUPS/SMES COMPANY EVALUATION MATRIX, 2022 123
11.8 COMPETITIVE SCENARIOS AND TRENDS 124
11.8.1 DEALS 124
TABLE 86 SIC WAFER POLISHING MARKET: DEALS (2020–2023) 124
11.8.2 OTHERS 124
TABLE 87 SIC WAFER POLISHING MARKET: OTHERS (2021–2023) 124
12 COMPANY PROFILES 125
(Business overview, Products/Services/Solutions offered, Recent developments & MnM View)*
12.1 KEY PLAYERS 125
12.1.1 ENTEGRIS 125
TABLE 88 ENTEGRIS: COMPANY OVERVIEW 125
FIGURE 43 ENTEGRIS: COMPANY SNAPSHOT 126
TABLE 89 ENTEGRIS: PRODUCTS/SERVICES/SOLUTIONS OFFERED 126
TABLE 90 ENTEGRIS: DEALS 127
12.1.2 SAINT-GOBAIN 129
TABLE 91 SAINT-GOBAIN: COMPANY OVERVIEW 129
TABLE 92 SAINT-GOBAIN: PRODUCTS/SERVICES/SOLUTIONS OFFERED 129
12.1.3 KEMET INTERNATIONAL LIMITED 131
TABLE 93 KEMET INTERNATIONAL LIMITED: COMPANY OVERVIEW 131
TABLE 94 KEMET INTERNATIONAL LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED 131
12.1.4 ILJIN DIAMOND CO., LTD. 133
TABLE 95 ILJIN DIAMOND CO., LTD.: COMPANY OVERVIEW 133
TABLE 96 ILJIN DIAMOND CO., LTD: PRODUCTS/SERVICES/SOLUTIONS OFFERED 133
12.1.5 DUPONT INCORPORATED 135
TABLE 97 DUPONT INCORPORATED: COMPANY OVERVIEW 135
FIGURE 44 DUPONT: COMPANY SNAPSHOT 136
TABLE 98 DUPONT INCORPORATED: PRODUCTS/SERVICES/SOLUTIONS OFFERED 136
12.1.6 FUJIBO HOLDINGS, INC. 138
TABLE 99 FUJIBO HOLDINGS, INC.: COMPANY OVERVIEW 138
FIGURE 45 FUJIBO HOLDING, INC.: COMPANY SNAPSHOT 138
TABLE 100 FUJIBO HOLDINGS, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED 139
12.1.7 FUJIFILM HOLDINGS AMERICA CORPORATION 140
TABLE 101 FUJIFILM HOLDINGS AMERICA CORPORATION: COMPANY OVERVIEW 140
TABLE 102 FUJIFILM HOLDINGS AMERICA CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 141
TABLE 103 FUJIFILM HOLDINGS AMERICA CORPORATION: OTHERS 141
TABLE 104 FUJIFILM HOLDINGS AMERICA CORPORATION: DEALS 142
12.1.8 ENGIS CORPORATION 143
TABLE 105 ENGIS CORPORATION: COMPANY OVERVIEW 143
TABLE 106 ENGIS CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 143
12.1.9 SKC 145
TABLE 107 SKC: COMPANY OVERVIEW 145
FIGURE 46 SKC: COMPANY SNAPSHOT 146
TABLE 108 SKC: PRODUCTS/SERVICES/SOLUTIONS OFFERED 146
TABLE 109 SKC: DEALS 147
TABLE 110 SKC: OTHERS 147
12.1.10 FERRO CORPORATION 148
TABLE 111 FERRO CORPORATION: COMPANY OVERVIEW 148
TABLE 112 FERRO CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 148
12.1.11 3M 150
TABLE 113 3M: COMPANY OVERVIEW 150
FIGURE 47 3M: COMPANY SNAPSHOT 151
TABLE 114 3M: PRODUCTS/SERVICES/SOLUTIONS OFFERED 152
12.1.12 JSR CORPORATION 153
TABLE 115 JSR CORPORATION: COMPANY OVERVIEW 153
FIGURE 48 JSR CORPORATION: COMPANY SNAPSHOT 154
TABLE 116 JSR CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 154
*Details on Business overview, Products/Services/Solutions offered, Recent developments & MnM View might not be captured in case of unlisted companies.
12.2 OTHER PLAYERS 155
12.2.1 PUREON 155
TABLE 117 PUREON: COMPANY OVERVIEW 155
12.2.2 LAPMASTER WOLTERS 156
TABLE 118 LAPMASTER WOLTERS: COMPANY OVERVIEW 156
12.2.3 LOGITECH LTD. 156
TABLE 119 LOGITECH LTD.: COMPANY OVERVIEW 156
12.2.4 ADVANCED ABRASIVES CORPORATION 157
TABLE 120 ADVANCED ABRASIVES CORPORATION: COMPANY OVERVIEW 157
12.2.5 ALLIED HIGH TECH PRODUCTS 157
TABLE 121 ALLIED HIGH TECH PRODUCTS: COMPANY OVERVIEW 157
12.2.6 ACE NANOCHEM CO., LTD. 158
TABLE 122 ACE NANOCHEM CO., LTD.: COMPANY OVERVIEW 158
12.2.7 SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD 159
TABLE 123 SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD: COMPANY OVERVIEW 159
12.2.8 AGC INC. 160
TABLE 124 AGC INC.: COMPANY OVERVIEW 160
12.2.9 FUJIMI INCORPORATED 160
TABLE 125 FUJIMI INCORPORATED: COMPANY OVERVIEW 160
12.2.10 LAM PLAN SAS 161
TABLE 126 LAM PLAN SAS: COMPANY OVERVIEW 161
12.2.11 NITTA DUPONT INCORPORATED 161
TABLE 127 NITTA DUPONT INCORPORATED: COMPANY OVERVIEW 161
13 APPENDIX 162
13.1 DISCUSSION GUIDE 162
13.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 165
13.3 CUSTOMIZATION OPTIONS 167
13.4 RELATED REPORTS 167
13.5 AUTHOR DETAILS 168
