조사회사 : MarketsandMarkets (마켓츠앤마켓츠) 출판년월 : 2024년03월
Semiconductor & IC Packaging Materials Market – Global Forecast to 2029
반도체 및 IC 패키징 소재 시장 : 종류(유기 기판, 본딩 와이어, 리드프레임, 캡슐화 수지, 세라믹 패키지, 다이 부착 재료, 솔더 볼), 패키징 기술, 최종 용도 산업, 지역별 – 2029년까지의 세계 예측
Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region – Global Forecast to 2029
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Report Overview
The Semiconductor & IC packaging materials Market is projected to reach USD 70.9 billion by 2029, at a CAGR of 10.1% from USD 43.9 billion in 2024.
반도체 및 IC 패키징 소재 시장은 2024년 439억 달러에서 연평균 성장률(CAGR) 10.1%로 성장해 2029년까지 709억 달러에 이를 것으로 예상됩니다.
The semiconductor and IC packaging materials market experiences dynamic growth fueled by various pivotal factors. Firstly, there is a rising demand for advanced packaging solutions due to continuous technological advancements in semiconductor devices. This demand is further boosted by the expanding market for consumer electronics and IoT devices, which require efficient and innovative packaging materials. Additionally, the industry witnesses a surge in the need for compact and lightweight packaging solutions, aligning with the trend of miniaturization in electronics. Moreover, the emergence of new applications such as autonomous vehicles and the implementation of 5G technology contribute significantly to the market’s evolution. These new applications require sophisticated packaging materials to meet the stringent performance and reliability standards. Furthermore, the semiconductor industry’s expansion in regions like Asia Pacific plays a crucial role in driving market growth. The region’s strategic position as a global manufacturing hub, combined with government support and investment incentives, further propels the demand for semiconductor and IC packaging materials. In essence, the interplay of these factors drives the continuous growth and evolution of the semiconductor and IC packaging materials market, shaping its trajectory in response to evolving technological and industry trends.
“Bonding wire, by type, accounts for the second-largest market share in 2023.”
Bonding wire is the second-largest type segment for semiconductor and IC packaging materials due to several key factors. Firstly, bonding wires play a crucial role in connecting semiconductor devices to their package leads or pads, forming electrical connections essential for device functionality. This critical function makes bonding wires a fundamental component in semiconductor packaging. Secondly, advancements in semiconductor technology, such as the miniaturization of semiconductor devices and the shift towards higher-density packaging, have increased the demand for fine-pitch bonding wires capable of handling intricate bonding configurations. This trend has driven the adoption of advanced bonding wire materials with improved electrical conductivity, thermal stability, and mechanical strength to meet the evolving requirements of modern semiconductor packaging. Additionally, bonding wires offer cost-effective solutions compared to other interconnection technologies like flip-chip bonding or wire bonding alternatives, making them a preferred choice for many semiconductor manufacturers, particularly in applications where cost considerations are significant. Furthermore, the versatility of bonding wires allows for compatibility with various packaging techniques, such as ball bonding and wedge bonding, providing flexibility in design and manufacturing processes. Overall, the combination of essential functionality, technological advancements, cost-effectiveness, and versatility positions bonding wires as a significant segment in the semiconductor and IC packaging materials market.
“Consumer electronics is expected to be the fastest growing end use industry segment at CAGR 10.3% for semiconductor & IC packaging materials market during the forecast period, in terms of value.”
Consumer electronics is the fastest-growing end-use industry for semiconductor and IC packaging materials due to several key factors. Firstly, the rapid pace of technological innovation in the consumer electronics sector drives continuous demand for advanced semiconductor devices with enhanced performance, functionality, and miniaturization. This demand, in turn, fuels the need for cutting-edge packaging materials capable of meeting the stringent requirements of modern electronic devices. Secondly, the growing adoption of emerging technologies such as artificial intelligence (AI), internet of things (IoT), augmented reality (AR), and virtual reality (VR) in consumer electronics contributes significantly to the increased demand for semiconductor and IC packaging materials. These technologies rely heavily on high-performance semiconductor components that require efficient and reliable packaging solutions to function optimally. Additionally, the expanding global market for consumer electronics, fueled by rising disposable incomes, urbanization, and digitalization trends, further drives the growth of the semiconductor and IC packaging materials market. The proliferation of smartphones, tablets, laptops, wearables, smart home devices, and automotive electronics amplifies the demand for packaging materials across a wide range of consumer electronic products.
“Based on region, North America was the second largest market for semiconductor & IC packaging materials market in 2023.”
North America is the second-largest region after Asia Pacific for the semiconductor and IC packaging materials market due to several key factors. Firstly, North America is home to a significant number of leading semiconductor companies, research institutions, and technology hubs, particularly in regions like Silicon Valley in California. This concentration of industry expertise and innovation drives demand for high-quality packaging materials to support cutting-edge semiconductor technologies and applications. Secondly, North America boasts a robust consumer electronics market with a high adoption rate of advanced electronic devices such as smartphones, tablets, laptops, and IoT gadgets. This demand for consumer electronics fuels the need for efficient and reliable semiconductor packaging materials to ensure optimal performance and functionality of these devices. Additionally, North America is at the forefront of technological advancements in areas like artificial intelligence (AI), machine learning, 5G technology, and autonomous vehicles, all of which rely heavily on semiconductor and IC packaging materials. The region’s strong focus on innovation and investment in emerging technologies contribute to the growth of the semiconductor packaging materials market. Furthermore, North America has a well-established manufacturing infrastructure and supply chain network for semiconductor and electronics industries, supporting efficient production and distribution of packaging materials. The presence of major semiconductor foundries, packaging and testing facilities, equipment suppliers, and research centers enhances the region’s competitiveness in the global semiconductor packaging materials market.
Moreover, strategic partnerships, collaborations, and government initiatives aimed at promoting technological innovation and industry growth further bolster North America’s position as a key player in the semiconductor and IC packaging materials market, making it the second-largest region after Asia Pacific.
In the process of determining and verifying the market size for several segments and subsegments identified through secondary research, extensive primary interviews were conducted. A breakdown of the profiles of the primary interviewees is as follows:
• By Company Type: Tier 1 – 50%, Tier 2 – 25%, and Tier 3 – 25%
• By Designation: C-Level – 25%, Director Level – 15%, and Others – 60%
• By Region: North America – 30%, Europe -20%, Asia Pacific – 35%, Middle East & Africa – 10%, and South America- 5%
The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
Research Coverage
This report segments the market for the semiconductor & IC packaging materials market on the basis of type, packaging technology, end-use industry and region. It provides estimations for the overall value of the market across various regions. A detailed analysis of key industry players has been conducted to provide insights into their business overviews, products & services, key strategies, new product launches, expansions, and mergers & acquisitions associated with the market for the semiconductor & IC packaging materials market.
Key benefits of buying this report
This research report is focused on various levels of analysis — industry analysis (industry trends), market ranking analysis of top players, and company profiles, which together provide an overall view of the competitive landscape, emerging and high-growth segments of the semiconductor & IC packaging materials market; high-growth regions; and market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
• Analysis of key drivers: The market growth is driven by increasing demand from consumer electronics industry, growing miniaturization and densification in the electronic sector and adoption of emerging technologies like 5G and autonomous vehicles.
• Market Penetration: Comprehensive information on the semiconductor & IC packaging materials market offered by top players in the global semiconductor & IC packaging materials market.
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the semiconductor & IC packaging materials market.
• Market Development: Comprehensive information about lucrative emerging markets — the report analyzes the markets for the semiconductor & IC packaging materials market across regions.
• Market Diversification: Exhaustive information about new products, untapped regions, and recent developments in the global semiconductor & IC packaging materials market.
• Competitive Assessment: In-depth assessment of market shares, strategies, products, and manufacturing capabilities of leading players in the semiconductor & IC packaging materials market.
Table of Contents
1 INTRODUCTION 23
1.1 STUDY OBJECTIVES 23
1.2 MARKET DEFINITION 23
1.3 INCLUSIONS & EXCLUSIONS 24
1.4 MARKET SCOPE 25
FIGURE 1 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION 25
1.4.1 REGIONS COVERED 25
1.4.2 YEARS CONSIDERED 26
1.5 CURRENCY CONSIDERED 26
1.6 LIMITATIONS 26
1.7 STAKEHOLDERS 27
1.8 SUMMARY OF CHANGES 27
2 RESEARCH METHODOLOGY 28
2.1 RESEARCH DATA 28
FIGURE 2 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: RESEARCH DESIGN 28
2.1.1 SECONDARY DATA 29
2.1.2 PRIMARY DATA 29
2.1.2.1 Primary data sources 29
2.1.2.2 Primary interviews – Top semiconductor & IC packaging material manufacturers 30
2.1.2.3 Breakdown of primary interviews 30
2.1.2.4 Key industry insights 30
2.2 BASE NUMBER CALCULATION 31
2.2.1 SUPPLY-SIDE APPROACH 31
2.2.2 DEMAND-SIDE APPROACH 31
2.3 FORECAST NUMBER CALCULATION 31
2.3.1 SUPPLY SIDE 31
2.3.2 DEMAND SIDE 32
2.4 MARKET SIZE ESTIMATION 32
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: REVENUE OF MARKET PLAYERS 32
2.4.1 BOTTOM-UP APPROACH 33
2.4.2 TOP-DOWN APPROACH 33
2.5 DATA TRIANGULATION 34
FIGURE 4 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DATA TRIANGULATION 34
2.6 RESEARCH ASSUMPTIONS 35
2.7 IMPACT OF RECESSION 35
2.8 GROWTH FORECAST 36
2.9 RISK ASSESSMENT 36
3 EXECUTIVE SUMMARY 37
FIGURE 5 ORGANIC SUBSTRATE TYPE SEGMENT TO DOMINATE MARKET BETWEEN 2024 AND 2029 37
FIGURE 6 CONSUMER ELECTRONICS END-USE INDUSTRY TO LEAD MARKET BETWEEN 2024 AND 2029 38
FIGURE 7 SOP PACKAGING TECHNOLOGY TO LEAD MARKET BETWEEN 2024 AND 2029 39
FIGURE 8 ASIA PACIFIC TO DOMINATE MARKET DURING FORECAST PERIOD 40
4 PREMIUM INSIGHTS 41
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 41
FIGURE 9 GROWING DEMAND FROM AUTOMOTIVE AND IT & TELECOMMUNICATION SECTORS TO DRIVE MARKET 41
4.2 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE 42
FIGURE 10 ORGANIC SUBSTRATES TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD 42
FIGURE 11 CONSUMER ELECTRONICS TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD 42
FIGURE 12 SOP TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD 43
4.3 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY 43
FIGURE 13 INDIA TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 43
5 MARKET OVERVIEW 44
5.1 INTRODUCTION 44
5.2 MARKET DYNAMICS 45
FIGURE 14 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 45
5.2.1 DRIVERS 45
5.2.1.1 Increasing demand from consumer electronics market 45
5.2.1.2 Growing miniaturization and densification in electronics sector 46
5.2.1.3 Adoption of emerging technologies like 5G and autonomous vehicles 47
5.2.2 RESTRAINTS 48
5.2.2.1 IP concerns in semiconductor industry during outsourcing and testing processes 48
5.2.2.2 Technological change and obsolescence 48
5.2.3 OPPORTUNITIES 49
5.2.3.1 Integration with advanced technologies 49
5.2.3.2 Need for customization and specialization in electronics industry 49
5.2.4 CHALLENGES 50
5.2.4.1 High cost of advanced materials 50
5.2.4.2 Stringent regulations and sustainability factor 51
5.3 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 51
5.3.1 REVENUE SHIFT AND NEW REVENUE POCKETS FOR SEMICONDUCTOR & IC PACKAGING MATERIAL MANUFACTURERS 51
FIGURE 15 REVENUE SHIFT OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 52
5.4 VALUE CHAIN ANALYSIS 52
FIGURE 16 OVERVIEW OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET VALUE CHAIN 53
5.4.1 RAW MATERIAL SUPPLIERS 53
5.4.2 MANUFACTURING 53
5.4.3 DISTRIBUTION AND LOGISTICS 54
5.4.4 END USERS 54
5.5 INVESTMENT AND FUNDING 54
FIGURE 17 INVESTMENT AND FUNDING SCENARIO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 54
5.6 PRICING ANALYSIS 55
5.6.1 AVERAGE SELLING PRICE TREND OF CERAMIC PACKAGES, BY REGION 55
TABLE 1 AVERAGE SELLING PRICE OF CERAMIC PACKAGES, BY REGION, 2020–2029 (USD/PIECE) 55
FIGURE 18 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF CERAMIC PACKAGES, BY REGION 55
5.6.2 AVERAGE SELLING PRICE TREND OF ENCAPSULATION RESINS, BY REGION 56
TABLE 2 AVERAGE SELLING PRICE OF ENCAPSULATION RESINS, BY REGION, 2020–2029 (USD/KG) 56
FIGURE 19 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF ENCAPSULATION RESINS, BY REGION 56
5.6.3 AVERAGE SELLING PRICE TREND OF LEADFRAMES, BY REGION 57
TABLE 3 AVERAGE SELLING PRICE OF LEADFRAMES, BY REGION, 2020–2029 (USD/PIECE) 57
FIGURE 20 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF LEADFRAMES, BY REGION 57
5.6.4 AVERAGE SELLING PRICE TREND OF SOLDER BALLS, BY REGION 57
TABLE 4 AVERAGE SELLING PRICE OF SOLDER BALLS, BY REGION, 2020–2029 (USD/BALL) 57
FIGURE 21 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF SOLDER BALLS, BY REGION 58
5.7 ECOSYSTEM MAP 58
TABLE 5 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: ECOSYSTEM 58
5.8 TECHNOLOGY ANALYSIS 59
TABLE 6 TECHNOLOGIES OFFERED IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 60
5.9 PATENT ANALYSIS 61
5.9.1 METHODOLOGY 61
5.9.2 PATENTS GRANTED WORLDWIDE, 2014–2023 61
TABLE 7 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: TOTAL NUMBER OF PATENTS 61
5.9.3 PATENT PUBLICATION TRENDS 62
FIGURE 22 NUMBER OF PATENTS GRANTED (2014−2023) 62
5.9.4 INSIGHTS 62
5.9.5 LEGAL STATUS OF PATENTS 63
FIGURE 23 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: LEGAL STATUS OF PATENTS 63
5.9.6 JURISDICTION ANALYSIS 63
FIGURE 24 PATENTS ANALYSIS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS, BY JURISDICTION, 2014−2023 63
5.9.7 TOP COMPANIES/APPLICANTS 64
FIGURE 25 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENTS IN LAST 10 YEARS 64
TABLE 8 LIST OF MAJOR PATENT OWNERS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS 64
5.9.8 LIST OF MAJOR PATENTS 65
TABLE 9 MAJOR PATENTS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS 65
5.10 TRADE ANALYSIS 66
5.10.1 IMPORT SCENARIO 66
FIGURE 26 IMPORTS OF SEMICONDUCTOR & IC PACKAGING MATERIALS, BY COUNTRY, 2020–2023 (USD THOUSAND) 66
5.10.2 EXPORT SCENARIO 67
FIGURE 27 EXPORTS OF SEMICONDUCTOR & IC PACKAGING MATERIALS, BY COUNTRY, 2020–2023 (USD THOUSAND) 67
5.11 KEY CONFERENCES & EVENTS, 2024–2025 67
TABLE 10 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DETAILED LIST OF CONFERENCES AND EVENTS 67
5.12 REGULATORY LANDSCAPE 68
5.12.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 68
TABLE 11 NORTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 68
TABLE 12 EUROPE: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 69
TABLE 13 ASIA PACIFIC: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 70
TABLE 14 MIDDLE EAST & AFRICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 71
TABLE 15 SOUTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 72
5.12.2 REGULATIONS RELATED TO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 73
TABLE 16 LIST OF REGULATIONS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 73
5.13 PORTER’S FIVE FORCES ANALYSIS 73
TABLE 17 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: PORTER’S FIVE FORCES ANALYSIS 73
FIGURE 28 PORTER’S FIVE FORCES ANALYSIS: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 74
5.13.1 THREAT OF SUBSTITUTES 74
5.13.2 THREAT OF NEW ENTRANTS 75
5.13.3 BARGAINING POWER OF SUPPLIERS 75
5.13.4 BARGAINING POWER OF BUYERS 76
5.13.5 INTENSITY OF COMPETITIVE RIVALRY 76
5.14 KEY STAKEHOLDERS AND BUYING CRITERIA 77
5.14.1 KEY STAKEHOLDERS IN BUYING PROCESS 77
FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE APPLICATIONS 77
TABLE 18 INFLUENCE OF INSTITUTIONAL BUYERS ON BUYING PROCESS FOR TOP THREE APPLICATIONS 77
5.14.2 BUYING CRITERIA 77
FIGURE 30 KEY BUYING CRITERIA FOR APPLICATIONS 78
TABLE 19 KEY BUYING CRITERIA FOR APPLICATIONS 78
5.15 MACROECONOMIC INDICATORS 79
5.15.1 GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES 79
5.16 CASE STUDIES 79
5.16.1 AMKOR’S CONTRIBUTION TO ADVANCING AUTOMOTIVE SEMICONDUCTOR SOLUTIONS 79
5.16.2 BOLSTERING SEMICONDUCTOR PACKAGING IN US: IMPERATIVE OF NATIONAL ADVANCED PACKAGING MANUFACTURING PROGRAM 80
5.16.3 ADVANCING WEARABLE SENSOR TECHNOLOGY: ROLE OF MASTER BOND EP17HTDA-1 DIE ATTACH ADHESIVE IN INTEGRATING ADVANCED SENSOR COMPONENTS 81
6 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE 82
6.1 INTRODUCTION 83
FIGURE 31 ORGANIC SUBSTRATE TO BE LARGEST SEGMENT OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DURING FORECAST PERIOD 83
TABLE 21 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 83
TABLE 22 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 84
6.2 ORGANIC SUBSTRATES 84
6.2.1 COMPLEX NEEDS OF MODERN ELECTRONIC SEGMENT TO DRIVE GROWTH 84
6.3 BONDING WIRES 85
6.3.1 VITAL FUNCTIONALITY AND ADVANCEMENTS IN BONDING WIRES TO DRIVE MARKET 85
6.4 LEADFRAMES 86
6.4.1 INCREASE IN NEED FOR THERMALLY EFFICIENT MATERIALS FOR SEMICONDUCTORS TO DRIVE DEMAND 86
6.5 ENCAPSULATION RESINS 86
6.5.1 SUPERIOR ELECTRICAL INSULATION, CHEMICAL RESISTANCE, AND MECHANICAL STRENGTH TO DRIVE DEMAND 86
6.6 DIE ATTACH MATERIALS 87
6.6.1 VERSATILITY IN VARIOUS DEVICES FOR MULTIPLE USES TO DRIVE DEMAND 87
6.7 CERAMIC PACKAGES 87
6.7.1 INCREASED USE OF MINIATURIZATION IN ELECTRONICS INDUSTRY TO DRIVE DEMAND 87
6.8 THERMAL INTERFACE MATERIALS 88
6.8.1 INCREASED COMPLEXITY IN ELECTRONIC PRODUCTS TO DRIVE DEMAND 88
6.9 SOLDER BALLS 88
6.9.1 DEMAND FOR COMPACT, EFFICIENT, AND HIGH-PERFORMING DEVICES TO DRIVE MARKET 88
6.10 OTHER TYPES 89
7 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY 90
7.1 INTRODUCTION 91
FIGURE 32 SOP SEGMENT TO LEAD MARKET DURING FORECAST PERIOD 91
TABLE 23 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 92
TABLE 24 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 92
7.2 SMALL OUTLINE PACKAGE (SOP) 92
7.2.1 COMPACT, LOW-PROFILE HIGH-PERFORMANCE PACKAGING SOLUTION FOR WIDE RANGE OF ELECTRONIC APPLICATIONS 92
7.3 GRID ARRAY (GA) 93
7.3.1 REDUCTION IN SIGNAL PROPAGATION DELAYS, IMPROVED SIGNAL INTEGRITY, AND ENHANCED SYSTEM PERFORMANCE TO DRIVE MARKET 93
7.4 QUAD FLAT NO-LEADS (QFN) 94
7.4.1 COMPACTNESS, THERMAL EFFICIENCY, ELECTRICAL PERFORMANCE & RELIABILITY MAKE IT PREFERRED CHOICE FOR HIGH DENSITY ELECTRONIC APPLICATIONS 94
7.5 DUAL FLAT NO-LEADS (DFN) 94
7.5.1 COMPACT, COST-EFFECTIVE, AND THERMALLY EFFICIENT SOLUTIONS FOR SPACE-CONSTRAINED ELECTRONIC APPLICATIONS 94
7.6 QUAD FLAT PACKAGES (QFP) 95
7.6.1 HIGH PIN COUNT, IMPROVED THERMAL PERFORMANCE, AND SUITABILITY FOR AUTOMATED ASSEMBLY MAKE IT PREFERRED CHOICE 95
7.7 DUAL IN-LINE (DIP) 96
7.7.1 ROBUSTNESS, SIMPLICITY, AND EASE OF APPLICATION TO DRIVE DEMAND 96
7.8 OTHER TECHNOLOGIES 97
7.8.1 CHIP SCALE PACKAGE (CSP) 97
7.8.2 WAFER LEVEL PACKAGING (WLP) 97
7.8.3 SYSTEM IN PACKAGE (SIP) 97
8 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY 98
8.1 INTRODUCTION 99
FIGURE 33 CONSUMER ELECTRONICS TO DOMINATE MARKET DURING FORECAST PERIOD (USD MILLION) 99
TABLE 25 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 99
TABLE 26 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 100
8.2 CONSUMER ELECTRONICS 100
8.2.1 INCREASE IN DEMAND FOR ADVANCED PACKAGING SOLUTIONS TO DRIVE MARKET 100
8.3 AUTOMOTIVE 101
8.3.1 RISE IN DEMAND FOR EVS TO DRIVE MARKET FOR SEMICONDUCTOR & IC PACKAGING MATERIALS 101
8.4 HEALTHCARE 101
8.4.1 DEMAND FOR BIOCOMPATIBILITY, PRECISION, AND RELIABILITY TO DRIVE MARKET 101
8.5 IT & TELECOMMUNICATION 102
8.5.1 SEMICONDUCTOR & IC PACKAGING MATERIALS TO PLAY VITAL ROLE IN MEETING DEMANDS FOR FASTER AND MORE EFFICIENT IT & TELECOMMUNICATIONS SYSTEMS 102
8.6 AEROSPACE & DEFENSE 102
8.6.1 DEMAND FOR LIGHTWEIGHT AND HIGH-PERFORMANCE PACKAGING SOLUTIONS TO DRIVE MARKET 102
8.7 OTHER END-USE INDUSTRIES 103
9 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION 104
9.1 INTRODUCTION 105
FIGURE 34 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 105
TABLE 27 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION, 2020–2023 (USD MILLION) 106
TABLE 28 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION, 2024–2029 (USD MILLION) 106
9.2 ASIA PACIFIC 106
9.2.1 RECESSION IMPACT 107
FIGURE 35 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT 107
TABLE 29 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 108
TABLE 30 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 108
TABLE 31 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 109
TABLE 32 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 109
TABLE 33 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 110
TABLE 34 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 110
TABLE 35 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 111
TABLE 36 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 111
9.2.2 CHINA 111
9.2.2.1 Push toward electric vehicles and government support for domestic semiconductor development to drive market 111
TABLE 37 CHINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 112
TABLE 38 CHINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 112
9.2.3 JAPAN 113
9.2.3.1 Focus on high-end technology to drive market 113
TABLE 39 JAPAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 114
TABLE 40 JAPAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 114
9.2.4 INDIA 114
9.2.4.1 Growing automotive and consumer electronics industry coupled with extensive government initiatives to drive market 114
TABLE 41 INDIA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 115
TABLE 42 INDIA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 115
9.2.5 SOUTH KOREA 116
9.2.5.1 Technological prowess and thriving consumer electronics industry to drive market 116
TABLE 43 SOUTH KOREA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 116
TABLE 44 SOUTH KOREA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 116
9.2.6 TAIWAN 117
9.2.6.1 Efficient manufacturing capabilities, government support, and focus on technology and innovation to drive demand 117
TABLE 45 TAIWAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 117
TABLE 46 TAIWAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 118
9.2.7 REST OF ASIA PACIFIC 118
TABLE 47 REST OF ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 118
TABLE 48 REST OF ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 119
9.3 NORTH AMERICA 119
9.3.1 RECESSION IMPACT 119
FIGURE 36 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT 120
TABLE 49 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023(USD MILLION) 120
TABLE 50 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 121
TABLE 51 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 121
TABLE 52 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 121
TABLE 53 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 122
TABLE 54 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 122
TABLE 55 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 122
TABLE 56 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 123
9.3.2 US 123
9.3.2.1 Growth of automotive electronics and government initiatives to drive demand 123
TABLE 57 US: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 124
TABLE 58 US: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 124
9.3.3 CANADA 124
9.3.3.1 Focus on high-reliability solutions to drive market 124
TABLE 59 CANADA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 125
TABLE 60 CANADA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 125
9.3.4 MEXICO 125
9.3.4.1 Thriving consumer electronics and automotive manufacturing sectors to drive demand 125
TABLE 61 MEXICO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 126
TABLE 62 MEXICO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 126
9.4 EUROPE 127
9.4.1 RECESSION IMPACT 127
FIGURE 37 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT 128
TABLE 63 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 129
TABLE 64 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 129
TABLE 65 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 130
TABLE 66 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 130
TABLE 67 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 131
TABLE 68 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 131
TABLE 69 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 131
TABLE 70 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 132
9.4.2 GERMANY 132
9.4.2.1 Growth of automotive, pharmaceutical, and industrial automation sectors to drive demand 132
TABLE 71 GERMANY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 133
TABLE 72 GERMANY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 133
9.4.3 ITALY 133
9.4.3.1 Established manufacturing expertise along with government incentives to drive market 133
TABLE 73 ITALY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 134
TABLE 74 ITALY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 134
9.4.4 FRANCE 135
9.4.4.1 Growth in aerospace & defense sector to drive market 135
TABLE 75 FRANCE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 135
TABLE 76 FRANCE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 136
9.4.5 UK 136
9.4.5.1 Key focus on niche and growing end-use industries to drive demand 136
TABLE 77 UK: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 137
TABLE 78 UK: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 137
9.4.6 SPAIN 137
9.4.6.1 Manufacturing sector, along with government’s focus on research & development, to drive demand 137
TABLE 79 SPAIN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 138
TABLE 80 SPAIN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 138
9.4.7 REST OF EUROPE 138
TABLE 81 REST OF EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 139
TABLE 82 REST OF EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 139
9.5 MIDDLE EAST & AFRICA 139
9.5.1 RECESSION IMPACT 140
TABLE 83 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 140
TABLE 84 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 140
TABLE 85 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 141
TABLE 86 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 141
TABLE 87 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 142
TABLE 88 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 142
TABLE 89 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 142
TABLE 90 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 143
9.5.2 UAE 143
9.5.2.1 Commitment to strategic diversification and government initiatives to drive demand 143
TABLE 91 UAE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 144
TABLE 92 UAE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 144
9.5.3 REST OF GCC COUNTRIES 144
TABLE 93 REST OF GCC COUNTRIES: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 145
TABLE 94 REST OF GCC COUNTRIES: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 145
9.5.4 ISRAEL 145
9.5.4.1 Prominent high-tech communication sector coupled with thriving startup ecosystem to drive demand 145
TABLE 95 ISRAEL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 146
TABLE 96 ISRAEL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 146
9.5.5 SOUTH AFRICA 146
9.5.5.1 Automotive electronics sector to drive demand 146
TABLE 97 SOUTH AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 147
TABLE 98 SOUTH AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 147
9.5.6 REST OF MIDDLE EAST & AFRICA 147
TABLE 99 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 148
TABLE 100 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 148
9.6 SOUTH AMERICA 148
9.6.1 RECESSION IMPACT 149
TABLE 101 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023(USD MILLION) 149
TABLE 102 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 149
TABLE 103 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 150
TABLE 104 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 150
TABLE 105 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 151
TABLE 106 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 151
TABLE 107 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 151
TABLE 108 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 152
9.6.2 ARGENTINA 152
9.6.2.1 Government incentives and policies to attract foreign investment to drive demand 152
TABLE 109 ARGENTINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 152
TABLE 110 ARGENTINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 153
9.6.3 BRAZIL 153
9.6.3.1 Thriving electronics sector along with government initiatives attracting foreign investments to support market growth 153
TABLE 111 BRAZIL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 154
TABLE 112 BRAZIL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 154
9.6.4 REST OF SOUTH AMERICA 154
TABLE 113 REST OF SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 155
TABLE 114 REST OF SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 155
10 COMPETITIVE LANDSCAPE 156
10.1 INTRODUCTION 156
10.1.1 OVERVIEW OF STRATEGIES ADOPTED BY KEY SEMICONDUCTOR & IC PACKAGING MANUFACTURERS 156
10.2 MARKET SHARE ANALYSIS 157
10.2.1 RANKING OF KEY MARKET PLAYERS, 2022 157
FIGURE 38 RANKING OF TOP FIVE PLAYERS IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, 2022 157
10.2.2 MARKET SHARE OF KEY PLAYERS 158
TABLE 115 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DEGREE OF COMPETITION 158
10.2.3 BRAND/PRODUCT COMPARATIVE ANALYSIS 159
FIGURE 39 BRAND/PRODUCT COMPARATIVE ANALYSIS, BY SEGMENTS 159
FIGURE 40 SHARE OF KEY PLAYERS IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, 2022 160
10.2.3.1 Jiangsu ChangJian Technology Co., Ltd. 160
10.2.3.2 Henkel AG & Co. KGaA 160
10.2.3.3 Amkor Technology 160
10.2.3.4 ASE 161
10.2.3.5 Siliconware Precision Industries Co., Ltd. (SPIL) 161
10.3 REVENUE ANALYSIS 162
FIGURE 41 REVENUE ANALYSIS OF TOP 5 PLAYERS, 2020–2024 162
10.4 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023 162
10.4.1 STARS 162
10.4.2 EMERGING LEADERS 163
10.4.3 PERVASIVE PLAYERS 163
10.4.4 PARTICIPANTS 163
FIGURE 42 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: COMPANY EVALUATION MATRIX, 2023 163
10.4.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023 164
TABLE 116 COMPANY TYPE FOOTPRINT (10 COMPANIES) 164
TABLE 117 COMPANY END-USE INDUSTRY FOOTPRINT (10 COMPANIES) 165
TABLE 118 COMPANY PACKAGING TECHNOLOGY FOOTPRINT (10 COMPANIES) 165
TABLE 119 COMPANY REGION FOOTPRINT (10 COMPANIES) 166
10.5 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023 166
10.5.1 PROGRESSIVE COMPANIES 166
10.5.2 RESPONSIVE COMPANIES 166
10.5.3 DYNAMIC COMPANIES 167
10.5.4 STARTING BLOCKS 167
FIGURE 43 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: START-UPS/SMES EVALUATION MATRIX, 2023 167
10.5.5 COMPETITIVE BENCHMARKING 168
10.5.5.1 Detailed list of key start-ups/SMES 168
TABLE 120 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DETAILED LIST OF KEY START-UPS/SMES 168
10.5.5.2 Competitive benchmarking of key start-ups/SMEs 169
TABLE 121 START-UPS/SMES TYPE FOOTPRINT (15 COMPANIES) 169
TABLE 122 START-UPS/SMES END-USE INDUSTRY FOOTPRINT (15 COMPANIES) 170
TABLE 123 START-UPS/SMES PACKAGING TECHNOLOGY FOOTPRINT (15 COMPANIES) 171
TABLE 124 START-UPS/SMES REGION FOOTPRINT (15 COMPANIES) 172
FIGURE 44 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: OVERALL FOOTPRINT 173
10.5.6 VALUATION AND FINANCIAL METRICS OF KEY SEMICONDUCTOR & IC PACKAGING VENDORS 174
FIGURE 45 EV/EBITDA OF KEY VENDORS 174
FIGURE 46 YEAR-TO-DATE (YTD) PRICE TOTAL RETURN 174
10.6 COMPETITIVE SCENARIO AND TRENDS 175
10.6.1 PRODUCT LAUNCHES 175
TABLE 125 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: PRODUCT LAUNCHES, JANUARY 2019–FEBRUARY 2024 175
10.6.2 DEALS 177
TABLE 126 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DEALS, JANUARY 2019–FEBRUARY 2024 177
10.6.3 EXPANSIONS 178
TABLE 127 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: EXPANSIONS, JANUARY 2019–FEBRUARY 2024 178
11 COMPANY PROFILES 180
(Business overview, Products offered, Recent developments & MnM View)*
11.1 KEY PLAYERS 180
11.1.1 LG CHEM. 180
TABLE 128 LG CHEM.: COMPANY OVERVIEW 180
FIGURE 47 LG CHEM.: COMPANY SNAPSHOT 181
TABLE 129 LG CHEM.: PRODUCT OFFERINGS 181
TABLE 130 LG CHEM.: DEALS, 2020–2024 182
TABLE 131 LG CHEM.: OTHERS, 2020–2024 182
11.1.2 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD. 184
TABLE 132 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: COMPANY OVERVIEW 184
FIGURE 48 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT 184
TABLE 133 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: PRODUCT OFFERINGS 185
TABLE 134 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: PRODUCT LAUNCHES, 2020–2024 186
TABLE 135 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: OTHER DEVELOPMENTS, 2020–2024 186
11.1.3 HENKEL AG & CO. KGAA 188
TABLE 136 HENKEL AG & CO. KGAA: COMPANY OVERVIEW 188
FIGURE 49 HENKEL AG & CO. KGAA: COMPANY SNAPSHOT 189
TABLE 137 HENKEL AG & CO. KGAA: PRODUCT OFFERINGS 189
TABLE 138 HENKEL AG & CO. KGAA: PRODUCT LAUNCHES, 2020–2024 190
TABLE 139 HENKEL AG & CO. KGAA: DEALS, 2020–2024 191
TABLE 140 HENKEL AG & CO. KGAA: OTHERS, 2020–2024 191
11.1.4 KYOCERA CORPORATION 193
TABLE 141 KYOCERA CORPORATION: COMPANY OVERVIEW 193
FIGURE 50 KYOCERA CORPORATION: COMPANY SNAPSHOT 194
TABLE 142 KYOCERA CORPORATION: PRODUCT OFFERINGS 194
TABLE 143 KYOCERA CORPORATION: PRODUCT LAUNCHES, 2020–2024 195
TABLE 144 KYOCERA CORPORATION: DEALS, 2020–2024 196
TABLE 145 KYOCERA CORPORATION: OTHER DEVELOPMENTS, 2020–2024 197
11.1.5 ASE 199
TABLE 146 ASE: COMPANY OVERVIEW 199
FIGURE 51 ASE: COMPANY SNAPSHOT 200
TABLE 147 ASE: PRODUCT OFFERINGS 201
TABLE 148 ASE: PRODUCT LAUNCHES, 2020–2024 202
TABLE 149 ASE: OTHER DEVELOPMENTS, 2020–2024 204
11.1.6 SILICONWARE PRECISION INDUSTRIES CO., LTD. 205
TABLE 150 SILICONWARE PRECISION INDUSTRIES CO., LTD.: COMPANY OVERVIEW 205
FIGURE 52 SILICONWARE PRECISION INDUSTRIES CO., LTD.: COMPANY SNAPSHOT 206
TABLE 151 SILICONWARE PRECISION INDUSTRIES CO., LTD.: PRODUCT OFFERINGS 206
TABLE 152 SILICONWARE PRECISION INDUSTRIES CO., LTD.: DEALS, 2020–2024 209
TABLE 153 SILICONWARE PRECISION INDUSTRIES CO., LTD.: OTHER DEVELOPMENTS, 2020–2024 209
11.1.7 AMKOR TECHNOLOGY 211
TABLE 154 AMKOR TECHNOLOGY: COMPANY OVERVIEW 211
FIGURE 53 AMKOR TECHNOLOGY: COMPANY SNAPSHOT 212
TABLE 155 AMKOR TECHNOLOGY: PRODUCT OFFERINGS 212
TABLE 156 AMKOR TECHNOLOGY: OTHERS, 2020–2024 215
11.1.8 TEXAS INSTRUMENTS 217
TABLE 157 TEXAS INSTRUMENTS: COMPANY OVERVIEW 217
FIGURE 54 TEXAS INSTRUMENTS: COMPANY SNAPSHOT 218
TABLE 158 TEXAS INSTRUMENTS: PRODUCT OFFERINGS 218
TABLE 159 TEXAS INSTRUMENTS: PRODUCT LAUNCHES, 2020–2024 221
TABLE 160 TEXAS INSTRUMENTS: OTHERS, 2020-2024 221
11.1.9 IBIDEN CO., LTD. 223
TABLE 161 IBIDEN CO., LTD.: COMPANY OVERVIEW 223
FIGURE 55 IBIDEN CO., LTD.: COMPANY SNAPSHOT 224
TABLE 162 IBIDEN CO., LTD.: PRODUCT OFFERINGS 225
11.1.10 POWERTECH TECHNOLOGY INC. 227
TABLE 163 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW 227
FIGURE 56 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT 228
TABLE 164 POWERTECH TECHNOLOGY INC.: PRODUCT OFFERINGS 228
TABLE 165 POWERTECH TECHNOLOGY INC.: DEALS, 2020–2024 229
*Details on Business overview, Products offered, Recent developments & MnM View might not be captured in case of unlisted companies.
11.2 OTHER PLAYERS 230
11.2.1 CHIPMOS TECHNOLOGIES INC. 230
TABLE 166 CHIPMOS TECHNOLOGIES INC.: COMPANY OVERVIEW 230
11.2.2 TONG HSING ELECTRONIC INDUSTRIES LTD. 231
TABLE 167 TONG HSING ELECTRONIC INDUSTRIES LTD.: COMPANY OVERVIEW 231
11.2.3 NEPES CORPORATION LIMITED 232
TABLE 168 NEPES CORPORATION LIMITED: COMPANY OVERVIEW 232
11.2.4 SHINKO ELECTRIC INDUSTRIES CO., LTD. 233
TABLE 169 SHINKO ELECTRIC INDUSTRIES CO., LTD.: COMPANY OVERVIEW 233
11.2.5 DAEDUCK ELECTRONICS CO., LTD. 234
TABLE 170 DAEDUCK ELECTRONICS CO., LTD.: COMPANY OVERVIEW 234
11.2.6 MACDERMID PERFORMANCE SOLUTIONS 235
TABLE 171 MACDERMID PERFORMANCE SOLUTIONS: COMPANY OVERVIEW 235
11.2.7 RENESAS ELECTRONICS CORPORATION 236
TABLE 172 RENESAS ELECTRONICS CORPORATION: COMPANY OVERVIEW 236
11.2.8 SAMSUNG ELECTRO-MECHANICS 237
TABLE 173 SAMSUNG ELECTRO-MECHANICS: COMPANY OVERVIEW 237
11.2.9 UNIMICRON TECHNOLOGY CORPORATION 238
TABLE 174 UNIMICRON TECHNOLOGY CORPORATION: COMPANY OVERVIEW 238
11.2.10 CHIPBOND TECHNOLOGY CORPORATION 239
TABLE 175 CHIPBOND TECHNOLOGY CORPORATION: COMPANY OVERVIEW 239
11.2.11 TANAKA HOLDINGS CO., LTD. 240
TABLE 176 TANAKA HOLDINGS CO., LTD.: COMPANY OVERVIEW 240
11.2.12 NAN YA PLASTICS CORPORATION 241
TABLE 177 NAN YA PLASTICS CORPORATION: COMPANY OVERVIEW 241
11.2.13 HITACHI HIGH-TECH CORPORATION 242
TABLE 178 HITACHI HIGH-TECH CORPORATION: COMPANY OVERVIEW 242
11.2.14 SUMITOMO CHEMICAL COMPANY LIMITED 243
TABLE 179 SUMITOMO CHEMICAL COMPANY LIMITED: COMPANY OVERVIEW 243
11.2.15 VERISILICON 244
TABLE 180 VERISILICON: COMPANY OVERVIEW 244
12 APPENDIX 245
12.1 DISCUSSION GUIDE 245
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 248
12.3 CUSTOMIZATION OPTIONS 250
12.4 RELATED REPORTS 250
12.5 AUTHOR DETAILS 251
Table of Contents
