반도체용 리소그래피 재료 리포트 2022년 – TechCet

출판 : Techcet   출판년월 : 2022년07월

2022 CRITICAL MATERIALS REPORT™: PHOTOLITHOGRAPHY MATERIALS
반도체용 리소그래피 재료 리포트 2022년: 리소그래피 재료, 포토레지스트, 포토레지스트 부속품

(includes information on photoresists and ancillaries)
(포토레지스트 및 보조제에 대한 정보 포함)

구성 영문조사보고서
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도표수 67
가격(사이트 라이센스) USD 8,900

리포트목차    주문/문의    납기/라이센스안내

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Techcet「리소그래피 재료 리포트 2022년: 리소그래피 재료, 포토레지스트, 포토레지스트 부속품 – 2022 CRITICAL MATERIALS REPORT™ : PHOTOLITHOGRAPHY MATERIALS (includes information on photoresists and ancillaries)」는 반도체용 리소그래피 재료 시장을 조사, 특히 포토레지스트, 부속품(안실러리), 확장 재료의 기술 및 시장을 상세하게 분석·해설하고 있습니다。

주요 게시물(목차에서 발췌)

  1. 이그제큐티브 요약
  2. 조사 범위, 목표, 방법론
  3. 반도체 산업 시장 전망
    1. 세계 경제
    2. 전자 제품 시장
    3. 반도체 제조 성장 및 확대
    4. 정책 및 무역 동향 및 영향
    5. 반도체 재료 전망
  4. 포토레지스트
    1. 시장의 매크로 동향
    2. 포토레지스트 수익 예측
    3. 포토레지스트 시장 점유율
    4. 포토레지스트 기술
    5. 지역별 동향
    6. EHS(환경·노동 안전 보건) 문제
  5. 액세서리 및 확장 시장 세그먼트
    1. 액세서리 시장 환경
    2. 액세서리 예측
    3. 확장 소재의 주요 공급업체
    4. 확장 소재 예측
    5. 액세서리 및 확장 소재 기술
    6. 액세서리 공급 환경(비포토레지스트 제조업체)
    7. 액세서리 및 확장 소재 평가
  6. 공급망의 신규 참가자
    1. 공급 체인: LAM RESEARCH
    2. 공급 체인: DONGJIN SEMICHEM
    3. 공급 체인: 디스럽션
    4. 서브티어 공급망: 디스럽션
    5. 공급 체인 가격 동향
    6. 참고 자료
  7. 공급자 정보

Overview

  • Focuses on the markets for lithography materials, covering photoresists, extension, and ancillary materials
  • Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
  • Covers information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments
  • Technological trend analysis, Details on the supply-chain for these specialized chemicals are discussed

Analyst Biography

Warren Montgomery, M.B.A – Senior Technology & Market Analyst covers photolithography the associated materials, such as photoresist and ancillary chemicals for TECHCET. Previously, as VP of Technical and Consortia Program Development at CNSE (formally Albany Nanotech).

Warren led process development efforts associated with (365nm, DUV, EUV, X-ray and e-beam) photoresists and ancillaries. Warren worked at SEMATECH, Applied Materials, LSI Logic, ASML, AZ Microelectronic, Irresistible Materials, and IBM in various, business development, sales, technical and senior leadership roles.

Warren has written over 70 technical and marketing publications and been awarded 30 US and European patents: primarily focused on lithography materials and processes.
Warren been BACUS President and Conference Chair. He has a B.S. in Chemistry from Marist College, a B.S. Business Administration from Mount St. Mary College, a graduate Certificate in Project Management from Empire State College and an MBA from City University.


[보도 자료]

2022 Semiconductor Photoresists – Advanced Nodes Ramp Growth continues strong through 2026

San Diego, CA, July 18, 2022: TECHCET—the electronic materials advisory firm providing business and technology information— announced an updated outlook for the semiconductor-related Photoresist market. Growth is expected as revenues are predicted to increase by 7.5% in 2022 to reach almost US$2.3 billion. The 2021 to 2026 CAGR for total resists is forecasted to be 5.9%, with the fastest growing products being EUV and KrF type resist materials, as stated in TECHCET’s newly released 2022 CMR™ on Litho Materials (includes information on photoresists and ancillaries).

世界のフォトレジスト市場予測 - TECHCET

“The Lithography materials market is healthy and growing and is expected to stay on an upwards trajectory given the advancement in device technology and increased layer counts,” stated Dan Tracy, Ph.D., Techcet’s Sr. Director of Marketing Research. In particular, EUV photoresists have firmly ‘arrived’ and are now officially being used for high volume chip manufacturing by multiple chip makers. EUV photoresist will grow rapidly as new logic nodes continue to be introduced; advanced DRAM enters production with EUV, especially as more ASML scanners are placed into production.

Photoresists used for “old tech” (I-line, G-line, and KrF) are expected to surge due to the near-term chip supply constraints. KrF resists continue to find growth, especially as 3DNAND device production and layer count grows. ArF and ArFi both use similar polymer/solvent platforms that utilize an aqueous developer (0.263N tetramethyl Ammonium hydroxide – TMAH), and their demand is driven by multi-patterning applications.

In South Korea, Taiwan, and China, onshoring of photoresist production is a recurring theme, and domestic manufacturing of these materials is growing. Near-term issues impacting the photoresist market, as with other materials, are inflation, supply chain disruptions, and geopolitical events. All of these are contributing to price increases and product availability for the current year, and are expected to continue doing so into 2023.

It is also important to note that new suppliers surfacing in places like South Korea and China may lead to dynamic adjustments within the photoresist market landscape. These new suppliers are benefitting from government and chipmaker support within their respective countries.


목차

1 EXECUTIVE SUMMARY 9

1.1 MARKET TRENDS IMPACTING LITHOGRAPHY  10
1.2 TECHNICAL TRENDS IMPACTING LITHOGRAPHY  12
1.3 PHOTORESIST REVENUE 5-YEAR FORECAST  13
1.3.1 ANCILLARY AND EXTENSION REVENUE 5-YEAR FORECAST 14
1.4 YEAR 2021 IN REVIEW  15
1.5 MARKET TRENDS IMPACTING LITHOGRAPHY MATERIALS OUTLOOK  16
1.6 COMPETITIVE LANDSCAPE 19
1.7  EHS ISSUES/CONCERNS  21
1.8  ANALYST ASSESSMENT  22

2 SCOPE, PURPOSE AND METHODOLOGY  24

2.1 PURPOSE  25
2.2 METHODOLOGY  26
2.3 OVERVIEW OF OTHER TECHCET CMR™ REPORTS  27

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK  28

3.1 WORLDWIDE ECONOMY  29
3.1.1  SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY  31
3.1.2 SEMICONDUCTOR SALES GROWTH 32
3.1.3 TAIWAN MONTHLY SALES TRENDS 33
3.2 ELECTRONIC GOODS MARKET  34
3.2.1 SMARTPHONES  35
3.2.2 PC UNIT SHIPMENTS  36
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 37
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 38
3.2.3  SERVERS / IT MARKET 39
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION  40
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY 41
3.3.2 WW FAB EXPANSION DRIVING GROWTH  42
3.3.3 EQUIPMENT SPENDING TRENDS 43
3.3.4 TECHNOLOGY ROADMAPS 44
3.3.5 FAB INVESTMENT ASSESSMENT 45
3.4 POLICY & TRADE TRENDS AND IMPACT  46
3.4.1 POLICY AND TRADE ISSUES 47
3.5 SEMICONDUCTOR MATERIALS OUTLOOK  48
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES? 49
3.5.2 LOGISTICS ISSUES PLAGUE THE WESTERN WORLD, CONTINUED  50
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2026 51
3.5.4  TECHCET WAFER START FORECAST 52
3.5.5 TECHCET’S MATERIALS FORECAST  53

4 PHOTORESIST SEGMENT  54

4.1  MARKET MACRO TRENDS  55
4.2 PHOTORESIST REVENUE FORECAST  56
4.2.1 EUV PHOTORESIST– MARKET OVERVIEW 57
4.2.2 ARF & ARFI– MARKET OVERVIEW 58
4.2.3 (KRF PHOTORESIST)– MARKET OVERVIEW 59
4.2.4 (G&I LINE)– MARKET OVERVIEW 60
4.3 PHOTORESIST MARKET SHARES  61
4.3.1 PHOTORESIST SUPPLIER REFLECTION 62
4.3.2 SUPPLIERS PHOTORESIST  63
4.3.2.1 DUPONT SUPPLY CAPACITY AND DEMAND, INVESTMENTS 64
4.3.2.2 DONGJIN SUPPLY CAPACITY AND DEMAND, INVESTMENTS 65
4.3.2.3 FUJIFILM SUPPLY CAPACITY AND DEMAND, INVESTMENTS 66
4.3.2.4 JSR SUPPLY CAPACITY AND DEMAND, INVESTMENTS 67
4.3.2.5 MERCK KGAA, EMD ELECTRONICS SUPPLY CAPACITY AND DEMAND, INVESTMENTS 68
4.3.2.6 (SHIN-ETSU) SUPPLY CAPACITY AND DEMAND, INVESTMENTS 69
4.3.2.7 SUMITOMO SUPPLY CAPACITY AND DEMAND, INVESTMENTS 70
4.3.2.8 SUB-TIER SUPPLY-CHAIN “NEW” ENTRANTS 71
4.4 PHOTORESIST TECHNOLOGY 72
4.4.1  PATTERNING TECHNOLOGY TRENDS 73
4.4.2  PRODUCTION LAYERS BY LITHOGRAPHIC EXPOSURE TYPE 74
4.4.3  DEVICE TECHNOLOGY TRENDS (EASING LITHOGRAPHY REQUIREMENTS) 75
4.4.4 PHOTORESIST TECHNOLOGY TRENDS (PLATFORM TRANSITIONS) 77
4.4.4.1 THE EVOLUTION  (A LITHO MATERIALS PERSPECTIVE): POLYMER PLATFORM TRANSITION AS WELL AS A DEVELOPER TRANSITION @ EUV  78
4.4.5  PATTERNING TRENDS 79
4.4.5.1 PATTERNING TECHNOLOGY TRENDS 80
4.4.5.2 81
4.4.6  KEY MATERIAL (MACRO)TECHNOLOGY TRENDS (PATTERNING MATERIAL TRANSITIONS TO WATCH) 82
4.5 REGIONAL TRENDS  83
4.6 EHS ISSUES  85
4.7 ASSESSMENT OF PHOTORESIST SEGMENT  86

5 ANCILLARY AND EXTENSIONS MARKET SEGMENT  89

5.1 MARKET LANDSCAPE FOR ANCILLARIES  90
5.2 ANCILLARY FORECASTS  91
5.2.1 ANCILLARIES (EBR, DEVELOPER, ETC.) VOLUMES FORECAST 92
5.2.2 ANCILLARIES (EBR AND PREWET) REVENUE FORECAST 93
5.2.3 ANCILLARIES (EBR AND PREWET) VOLUMES FORECAST 94
5.2.4 ANCILLARIES (NTD DEVELOPER AND RINSE) REVENUES FORECAST 95
5.2.5 ANCILLARIES (NTD DEVELOPER AND RINSE)VOLUMES FORECAST 96
5.2.6 ANCILLARIES (PTD DEVELOPER) REVENUE FORECAST 97
5.2.7 ANCILLARIES (PTD DEVELOPER)VOLUMES FORECAST 98
5.3 KEY SUPPLIERS OF EXTENSION MATERIALS  99
5.3.1 SELECT EXTENSION AND ANCILLARY SUPPLIERS 100
5.4 EXTENSION MATERIALS FORECASTS  101
5.4.1 EXTENSIONS (BOTTOM COATINGS) REVENUE FORECAST 102
5.4.2 EXTENSIONS (BOTTOM COATINGS) VOLUMES FORECAST 103
5.4.3 EXTENSIONS (SI BOTTOM ANTIREFLECTIVE COATINGS) REVENUE FORECAST 104
5.4.4 EXTENSIONS (SI BOTTOM ANTIREFLECTIVE COATINGS) VOLUMES FORECAST 105
5.4.5 EXTENSIONS (KRF BOTTOM ANTIREFLECTIVE COATINGS) REVENUE FORECAST 106
5.4.6 EXTENSIONS (KRF BOTTOM ANTIREFLECTIVE COATINGS) VOLUMES FORECAST 107
5.4.7 EXTENSIONS (SOC BOTTOM ANTIREFLECTIVE COATINGS) REVENUE FORECAST 108
5.4.8 EXTENSIONS (SOC BOTTOM ANTIREFLECTIVE COATINGS) VOLUMES FORECAST 109
5.4.9 EXTENSIONS (ARF BOTTOM ANTIREFLECTIVE COATINGS) REVENUE FORECAST 110
5.4.10 EXTENSIONS (ARF BOTTOM ANTIREFLECTIVE COATINGS) VOLUMES FORECAST 111
5.5 ANCILLARY AND EXTENSION MATERIALS TECHNOLOGIES  112
5.5.1 MATERIAL CHANGES DRIVEN BY NEW PROCESSES (193NM IMMERSION TO EUV) 113
5.5.2 THE DEVELOPER TRANSITION 114
5.5.3 SOLVENT IMPACT: TRANSITION FROM POSITIVE PHOTORESIST TO NEGATIVE PHOTORESIST 115
5.6 ANCILLARY SUPPLY LANDSCAPE (NON-PHOTORESIST MAKERS)  116
5.7 ANCILLARY AND EXTENSION MATERIALS ASSESSMENT  117
5.7.1 ANALYST ASSESSMENT (ANCILLARIES) 118
5.7.2 ANALYST ASSESSMENT (EXTENSIONS) 119

6  SUPPLY-CHAIN “NEW” ENTRANTS  120

6.1 SUPPLY-CHAIN “NEW” ENTRANTS- LAM RESEARCH  121
6.2 SUPPLY-CHAIN “NEW” ENTRANTS- DONGJIN SEMICHEM  122
6.3 SUPPLY-CHAIN: DISRUPTIONS  123
6.4 SUB-TIER SUPPLY-CHAIN: DISRUPTIONS 124
6.5 SUPPLY-CHAIN PRICING TRENDS  125
6.6 REFERENCES  126

7 SUPPLIER PROFILES 129

AVANTOR
BASF
BREWER SCIENCE
CHANG CHUN PETROCHEMICAL
DONGJIN CHEMICAL
And More…

FIGURES & TABLES

FIGURE 1: PHOTORESIST REVENUE FORECAST 13
FIGURE 2: TOTAL ANCILLARY AND EXTENSION REVENUE FORECAST 14
FIGURE 3: BOTTOM ANTI-REFLECTIVE COATINGS (Barcs) EXAMPLE 18
FIGURE 4: MARKET SHARES OF TOP 3 PHOTORESIST COMPANIES 19
FIGURE 5: ASML EUV SYSTEM BEAM PATH NXE: 3400B 22
FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021) 31
FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES  32
FIGURE 8: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX* 33
FIGURE 9: SEMICONDUCTOR CHIP APPLICATIONS 34
FIGURE 10: MOBILE PHONE SHIPMENTS WW ESTIMATES  35
FIGURE 11: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3 36
FIGURE 12: GLOBAL EV TRENDS 37
FIGURE 13: SEMICONDUCTOR SPEND PER VEHICLE TYPE 38
FIGURE 14: TSMC CONSTRUCTION SITE IN ARIZONA 40
FIGURE 15: CHIP EXPANSIONS 2021-2026 > US$460 B 41
FIGURE 16: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD 42
FIGURE 17: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS 43
FIGURE 18: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP 44
FIGURE 19: EUROPE CHIP EXPANSION UPSIDE 49
FIGURE 20: TECHCET WAFER START FORECAST BY NODE 51
FIGURE 21: TECHCET WAFER START FORECAST BY NODE 52
FIGURE 22: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK 53
FIGURE 23: PHOTORESIST REVENUE FORECAST 56
FIGURE 24: EUV PHOTORESIST REVENUE FORECAST 57
FIGURE 25: EUV PHOTORESIST VOLUME FORECAST 57
FIGURE 26: ARF PHOTORESIST REVENUE FORECAST 58
FIGURE 27: ARF PHOTORESIST VOLUME FORECAST 58
FIGURE 28: KRF PHOTORESIST REVENUE FORECAST 59
FIGURE 29: KRF PHOTORESIST VOLUME FORECAST 59
FIGURE 30: G&I PHOTORESIST REVENUE FORECAST 60
FIGURE 31: G&I PHOTORESIST VOLUME FORECAST 60
FIGURE 32: 2021 PHOTORESIST MARKET SHARES ESTIMATES (% OF WW REVENUES)  61
FIGURE 33: GENERAL SCHEMATIC OF LITHO EXPOSURES BY DEVICE TYPE 74
FIGURE 34: NAND SCALING 75
FIGURE 35: SCANNER TECHNOLOGY TRENDS ARF TO EUV 76
FIGURE 36: EVOLUTION OF PHOTORESIST CHEMISTRY 78
FIGURE 37: NANO IMPRINT LITHOGRAPHY:  80
FIGURE 38: CONVENTIONAL AND SELECTIVE DIRECTED SELF-ASSEMBLY 81
FIGURE 39: ANCILLARY REVENUES FORECAST 91
FIGURE 40: ANCILLARY VOLUME FORECAST 92
FIGURE 41: EBR AND PREWET REVENUE FORECAST 93
FIGURE 42: EBR AND PREWET VOLUME FORECAST 94
FIGURE 43: NTD CHEMICALS REVENUE FORECAST 95
FIGURE 44: NTD CHEMICALS VOLUME FORECAST 96
FIGURE 45: PTD REVENUE FORECAST 97
FIGURE 46: PTD VOLUME FORECAST 98
FIGURE 47: EXTENSION MATERIALS REVENUE FORECAST 102
FIGURE 48: EXTENSION VOLUME FORECAST 103
FIGURE 49: SI BARC REVENUE FORECAST 104
FIGURE 50: SI BARC VOLUME FORECAST 105
FIGURE 51: KRF BARC REVENUE FORECAST 106
FIGURE 52: KRF BARC VOLUME FORECAST 107
FIGURE 53: SOC REVENUE FORECAST 108
FIGURE 54: SOC VOLUME FORECAST 109
FIGURE 55: ARF BARC REVENUE FORECAST 110
FIGURE 56: ARF BARC VOLUME FORECAST 111
FIGURE 57: DEVELOPER TRANSITION 114
FIGURE 58: SOLVENT IMPACT FOR POSITIVE VS. NEGATIVE PHOTORESIST 115
FIGURE 59: LAM RESEARCH DRY RESIST 121

TABLES

TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES* 29
TABLE 2: IMF ECONOMIC OUTLOOK*  30
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021 39
TABLE 4:  REGIONAL SEMICONDUCTOR TRENDS 83
TABLE 5: REGIONAL LITHOGRAPHY MATERIALS SUPPLIER EXPANSIONS 84
TABLE 6:  SOLVENT SUPPLIERS 90
TABLE 7: KEY SUPPLIERS OF EXTENSION MATERIALS 99
TABLE 8: ANCILLARY SUPPLIER LANDSCAPE 116


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