조사회사 : MarketsandMarkets (마켓츠앤마켓츠) 출판년월 : 2023년10월
3D Stacking Market – Global Forecast to 2028
3D 스태킹 (Stacking) 시장 : 기술 (다이 투 다이, 다이 투 웨이퍼, 웨이퍼 투 웨이퍼, 칩 투 칩, 칩 투 웨이퍼), 기술 (Si 관통 전극, 하이브리드 본딩, 모놀리식 3 차원 통합), 디바이스 (로직 IC, 광전자 공학, 메모리, MEMS) – 2028년까지의 세계 예측
3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) – Global Forecast to 2028
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Report Overview
The 3D stacking market is projected to reach USD 3.1 billion by 2028 from USD 1.2 billion in 2023, at a CAGR of 20.4% from 2023 to 2028. The major opportunities that are expected to drive the market growth of the 3D stacking market include growing adoption of high-bandwidth memory (HBM) devices and integration of advanced electronics within the automotive industry
Increasing demand for high-performance computing and energy-efficient Logics ICs
Logic Integrated Circuits (ICs) are an integral component of digital electronics, facilitating computational operations and decision-making processes within electronic devices. In 3D stacking, Logic ICs play a crucial role in enhancing computational efficiency and reducing footprint. The increasing demand for high-performance computing and energy-efficient devices has fueled the growth of 3D stacking in logic ICs. As consumer expectations for faster and more reliable electronic devices continue to rise, 3D stacking enables a significant increase in computational capabilities within a smaller physical footprint.
Need for enhanced performance and miniaturization in electronic applications to drive market growth for hybrid bonding
The process of hybrid bonding involves several key steps, starting with the preparation and creation of pre-bonding layers. These layers are crucial to ensuring a successful bond. The bonding process itself, characterized by the fusion of semiconductor wafers, is followed by a post-bond annealing step to enhance the bond’s strength and reliability. Throughout these processes, rigorous inspection and metrology measures are in place to guarantee the quality and integrity of the bonded structures.
Rising need for advanced and compact packaging solutions in high-performance computing applications to drive market growth for wafer-to-wafer 3D Stacking
Wafer-on-Wafer (WoW) is a 3D integration method that involves bonding and stacking two or more complete wafers, each containing semiconductor devices or chips, to create a vertically integrated structure. This method facilitates the integration of different functionalities from separate wafers, enabling enhanced performance, reduced interconnect lengths, and increased system density.
North America is expected to account for the second largest market share during the forecast period
Being home to some of the leading semiconductor companies, such as Intel Corporation (US), Texas Instruments Inc. (US), Qualcomm Incorporated (US), and Advanced Micro Devices, Inc. (US), makes the region technologically advanced. Semiconductor organizations such as Global Semiconductor Alliance (GSA) (US) and International Microelectronics and Packaging Society (IMAPS) (US) are dedicated associations for the advancement and growth of microelectronics and packaging in North America.
The break-up of profile of primary participants in the 3D stacking market-
• By Company Type: Tier 1 – 38%, Tier 2 – 28%, Tier 3 – 34%
• By Designation Type: C Level – 40%, Director Level – 30% , Others – 30%
• By Region Type: North America – 35%, Europe – 20%, Asia Pacific – 35%, Rest of the World – 10%
The major players of 3D stacking market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US) among others.
Research Coverage
The report segments the 3D stacking market and forecasts its size based on method, interconnecting technology, device type, end user and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing the market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.
Reasons to buy the report:
The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall 3D stacking market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
• Analysis of key drivers (Increasing focus on miniaturization and efficient space utilization in electronic devices; Cost advantage offered by 3D stacking technology is increasing its adoption; Growing demand for consumer electronics and gaming devices; Heterogeneous integration and component optimization to improve manufacturing of electronic components; 3D stacking technology to provide shorter interconnect and reduced power consumption boosting its adoption), restraints (High cost of 3D stacking technology to limit adoption; Lack of standardization governing 3D stacking technology), opportunities (Growing adoption of high-bandwidth memory (HBM) devices; Rapid expansion of semiconductor applications across various industries; The integration of advanced electronics within the automotive industry), and challenges (Growing adoption of high-bandwidth memory (HBM) devices; Rapid expansion of semiconductor applications across various industries).
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the 3D stacking market
• Market Development: Comprehensive information about lucrative markets – the report analyses the 3D stacking market across varied regions
• Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the 3D stacking market
• Competitive Assessment: In-depth assessment of market shares, growth strategies and product offerings of leading players like Intel Corporation (US), Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), Amkor Technology (US) and ASE Technology Holding Co., Ltd. (Taiwan).
Table of Contents
1 INTRODUCTION 31
1.1 STUDY OBJECTIVES 31
1.2 MARKET DEFINITION 31
1.2.1 INCLUSIONS AND EXCLUSIONS 32
1.3 STUDY SCOPE 32
FIGURE 1 3D STACKING MARKET: MARKET SEGMENTATION 32
1.3.1 REGIONAL SCOPE 33
1.3.2 YEARS CONSIDERED 33
1.4 CURRENCY CONSIDERED 33
1.5 LIMITATIONS 34
1.6 STAKEHOLDERS 34
1.7 RECESSION IMPACT 34
2 RESEARCH METHODOLOGY 35
2.1 RESEARCH DATA 35
FIGURE 2 3D STACKING MARKET: RESEARCH DESIGN 35
2.1.1 SECONDARY & PRIMARY RESEARCH 37
2.1.2 SECONDARY DATA 38
2.1.2.1 Major secondary sources 38
2.1.2.2 Secondary sources 38
2.1.3 PRIMARY DATA 39
2.1.4 BREAKDOWN OF PRIMARIES 39
2.1.4.1 Key data from primary sources 40
2.2 MARKET SIZE ESTIMATION 41
FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION 41
2.2.1 BOTTOM-UP APPROACH 41
2.2.1.1 Approach to estimate market share by bottom-up analysis (demand side) 42
FIGURE 4 MARKET SIZE ESTIMATION: BOTTOM-UP APPROACH 42
2.2.2 TOP-DOWN APPROACH 42
2.2.2.1 Approach to estimate market share by top-down analysis (supply side) 42
FIGURE 5 MARKET SIZE ESTIMATION: TOP-DOWN APPROACH 43
FIGURE 6 MARKET SIZE ESTIMATION: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D STACKING SOLUTIONS AND SERVICES 43
2.3 DATA TRIANGULATION 44
FIGURE 7 DATA TRIANGULATION 44
2.4 RESEARCH ASSUMPTIONS 45
TABLE 1 RESEARCH ASSUMPTIONS 45
2.5 RISK ASSESSMENT 45
2.6 RECESSION IMPACT ANALYSIS: PARAMETERS CONSIDERED 45
3 EXECUTIVE SUMMARY 46
FIGURE 8 CONSUMER ELECTRONICS SEGMENT TO CAPTURE LARGEST SHARE OF 3D STACKING MARKET IN 2028 47
FIGURE 9 MEMORY DEVICES SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET IN 2028 47
FIGURE 10 3D TSV SEGMENT TO LEAD 3D STACKING MARKET DURING FORECAST PERIOD 48
FIGURE 11 3D STACKING MARKET TO EXHIBIT HIGHEST CAGR IN ASIA PACIFIC DURING FORECAST PERIOD 48
4 PREMIUM INSIGHTS 50
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D STACKING MARKET 50
FIGURE 12 INCREASING FOCUS ON MINIATURIZATION AND EFFICIENT SPACE UTILIZATION IN ELECTRONIC DEVICES TO BOOST MARKET GROWTH 50
4.2 3D STACKING MARKET, BY METHOD 50
FIGURE 13 DIE-TO-DIE SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET IN 2028 50
4.3 3D STACKING MARKET, BY END USER 51
FIGURE 14 AUTOMOTIVE SEGMENT TO REGISTER HIGHEST CAGR FROM 2023 TO 2028 51
4.4 3D STACKING MARKET, BY PACKAGING TECHNOLOGY 51
FIGURE 15 3D TSV SEGMENT TO ACCOUNT FOR LARGEST SHARE OF 3D STACKING MARKET FROM 2023 TO 2028 51
4.5 3D STACKING MARKET, BY DEVICE TYPE 52
FIGURE 16 MEMORY DEVICES SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET FROM 2023 TO 2028 52
4.6 ASIA PACIFIC: 3D STACKING MARKET, BY END USER AND COUNTRY 52
FIGURE 17 CONSUMER ELECTRONICS SEGMENT AND CHINA HELD LARGEST SHARE OF 3D STACKING MARKET IN ASIA PACIFIC IN 2022 52
4.7 3D STACKING MARKET, BY COUNTRY 53
FIGURE 18 TAIWAN TO BE FASTEST-GROWING COUNTRY-LEVEL MARKET FOR 3D STACKING DURING FORECAST PERIOD 53
5 MARKET OVERVIEW 54
5.1 INTRODUCTION 54
5.2 MARKET DYNAMICS 54
FIGURE 19 3D STACKING MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 54
5.2.1 DRIVERS 55
FIGURE 20 ANALYSIS OF IMPACT OF DRIVERS ON 3D STACKING MARKET 55
5.2.1.1 Increasing focus on miniaturization and efficient space utilization in electronic devices 55
5.2.1.2 Cost advantage offered by 3D stacking technology 56
5.2.1.3 Growing demand for consumer electronics and gaming devices 56
FIGURE 21 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020–2025 57
5.2.1.4 Unparalleled flexibility and customization benefits offered by 3D stacking in electronic component manufacturing 57
5.2.1.5 Reduced power consumption and operational costs over 2D stacking 57
5.2.2 RESTRAINTS 58
FIGURE 22 ANALYSIS OF IMPACT OF RESTRAINTS ON 3D STACKING MARKET 58
5.2.2.1 Need for substantial upfront investment 58
5.2.2.2 Lack of standardization governing 3D stacking technology 58
5.2.3 OPPORTUNITIES 59
FIGURE 23 ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D STACKING MARKET 59
5.2.3.1 Growing adoption of high-bandwidth memory (HBM) devices 59
5.2.3.2 Rapid expansion of semiconductor applications across various industries 60
5.2.3.3 Integration of advanced electronics into automobiles 60
5.2.4 CHALLENGES 61
FIGURE 24 ANALYSIS OF IMPACT OF CHALLENGES ON 3D STACKING MARKET 61
5.2.4.1 Maintaining effective supply chain in 3D stacking 61
5.2.4.2 Designing complexities associated with 3D stacking technology 61
5.3 SUPPLY CHAIN ANALYSIS 62
FIGURE 25 3D STACKING MARKET: SUPPLY CHAIN ANALYSIS 62
5.4 ECOSYSTEM MAPPING 64
FIGURE 26 3D STACKING ECOSYSTEM 64
5.5 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 64
FIGURE 27 REVENUE SHIFTS AND NEW REVENUE POCKETS FOR PLAYERS IN 3D STACKING MARKET 65
5.6 PRICING ANALYSIS 65
TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (USD) 65
5.6.1 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS OFFERED BY KEY PLAYERS 66
FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS EQUIVALENT OFFERED BY KEY PLAYERS 66
5.6.2 AVERAGE SELLING PRICE TREND 66
TABLE 3 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2018–2022 (USD/THOUSAND UNITS) 66
FIGURE 29 AVERAGE SELLING PRICE OF WAFERS, 2018–2022 66
5.7 TECHNOLOGY TRENDS 67
5.7.1 FAN-OUT WAFER-LEVEL PACKAGING 67
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING 67
5.7.3 ADVANCED MATERIALS 68
5.7.4 MONOLITHIC 3D INTEGRATION 68
5.8 PORTER’S FIVE FORCES ANALYSIS 68
TABLE 4 3D STACKING MARKET: PORTER’S FIVE FORCES ANALYSIS 69
FIGURE 30 PORTER’S FIVE FORCES ANALYSIS 69
5.8.1 THREAT OF NEW ENTRANTS 70
5.8.2 THREAT OF SUBSTITUTES 70
5.8.3 BARGAINING POWER OF SUPPLIERS 70
5.8.4 BARGAINING POWER OF BUYERS 70
5.8.5 INTENSITY OF COMPETITIVE RIVALRY 71
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 71
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 71
FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE END USERS 71
TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END USER (%) 71
5.9.2 BUYING CRITERIA 72
FIGURE 32 KEY BUYING CRITERIA FOR TOP THREE END USERS 72
TABLE 6 KEY BUYING CRITERIA, BY END USER 72
5.10 CASE STUDY ANALYSIS 72
5.10.1 SEMICONDUCTOR WAFER PRODUCER REDUCED WAFER REJECTIONS THROUGH CLOSED-LOOP MONITORING 72
5.10.2 SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM 73
5.11 TRADE ANALYSIS 73
5.11.1 IMPORT SCENARIO 73
TABLE 7 IMPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 381800, BY COUNTRY, 2018–2022 (USD MILLION) 74
5.11.2 EXPORT SCENARIO 74
TABLE 8 EXPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 381800, BY COUNTRY, 2018–2022 (USD MILLION) 74
5.12 PATENT ANALYSIS 75
TABLE 9 PATENTS RELATED TO 3D STACKING MARKET, 2020–2023 75
FIGURE 33 NUMBER OF PATENTS GRANTED PER YEAR FROM 2013 TO 2022 77
TABLE 10 NUMBER OF PATENTS RELATED TO 3D STACKING REGISTERED IN LAST 10 YEARS 77
FIGURE 34 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS 78
5.13 KEY CONFERENCES AND EVENTS, 2023–2025 78
TABLE 11 3D STACKING MARKET: DETAILED LIST OF CONFERENCES AND EVENTS 78
5.14 STANDARDS AND REGULATORY LANDSCAPE 79
5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 79
TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 79
TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 80
TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 80
5.14.2 KEY REGULATIONS AND STANDARDS 81
5.14.2.1 Regulations 82
5.14.2.2 Standards 82
6 3D STACKING MARKET, BY PACKAGING METHODOLOGY 84
6.1 INTRODUCTION 84
6.2 3D PACKAGE-ON-PACKAGE (POP) 84
6.2.1 GROWING DEMAND FOR COMPACT AND FEATURE-RICH ELECTRONIC DEVICES TO PROPEL SEGMENTAL GROWTH 84
6.3 3D SYSTEM-IN-PACKAGE (SIP) 84
6.3.1 NEED FOR MINIATURIZED AND POWER-EFFICIENT DEVICES ACROSS DIVERSE APPLICATIONS TO DRIVE SEGMENT 84
6.4 3D CHIP-ON-CHIP (COC) 85
6.4.1 NEED FOR COMPACT SOLUTIONS IN HIGH-PERFORMANCE COMPUTING APPLICATIONS TO FUEL SEGMENTAL GROWTH 85
6.5 WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) 85
6.5.1 NEED TO REDUCE CONSUMPTION OF PACKAGING MATERIAL TO PROPEL ADOPTION OF WLCSP TECHNOLOGY 85
7 3D STACKING MARKET, BY METHOD 86
7.1 INTRODUCTION 87
FIGURE 35 WAFER-TO-CHIP SEGMENT TO REGISTER HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD 87
TABLE 15 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION) 87
TABLE 16 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION) 88
7.2 DIE-TO-DIE 88
7.2.1 RISING NEED FOR COMPACT AND EFFICIENT DEVICE STRUCTURES TO BOOST ADOPTION OF DIE-TO-DIE STACKING 88
TABLE 17 DIE-TO-DIE: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION) 88
TABLE 18 DIE-TO-DIE: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION) 89
7.3 DIE-TO-WAFER 89
7.3.1 INCREASING FOCUS ON DEVICE PERFORMANCE ENHANCEMENT TO FUEL ADOPTION OF DIE-TO-WAFER INTEGRATION IN 3D STACKING 89
TABLE 19 DIE-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION) 89
TABLE 20 DIE-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION) 90
7.4 WAFER-TO-WAFER 90
7.4.1 GROWING DEMAND FOR ADVANCED COMPACT PACKAGING SOLUTIONS TO FUEL SEGMENTAL GROWTH 90
TABLE 21 WAFER-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION) 90
TABLE 22 WAFER-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION) 91
7.5 WAFER-TO-CHIP 91
7.5.1 RISING NEED FOR COMPACT AND EFFICIENT PACKAGING SOLUTIONS IN AUTOMOTIVE ELECTRONICS TO DRIVE SEGMENT 91
TABLE 23 WAFER-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION) 91
TABLE 24 WAFER-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION) 92
7.6 CHIP-TO-CHIP 92
7.6.1 GROWING NEED FOR HIGH-PERFORMANCE AND POWER-EFFICIENT ELECTRONIC DEVICES TO PROPEL SEGMENTAL GROWTH 92
TABLE 25 CHIP-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION) 92
TABLE 26 CHIP-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION) 92
8 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY 93
8.1 INTRODUCTION 94
FIGURE 36 3D TSV SEGMENT TO CAPTURE LARGEST SHARE OF 3D STACKING MARKET DURING FORECAST PERIOD 94
TABLE 27 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION) 94
TABLE 28 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION) 95
8.2 3D HYBRID BONDING 95
8.2.1 ADOPTION OF 3D HYBRID BONDING IN HIGH-PERFORMANCE COMPUTING AND DATA-INTENSIVE APPLICATIONS TO DRIVE MARKET 95
TABLE 29 3D HYBRID BONDING: 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION) 96
TABLE 30 3D HYBRID BONDING: 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION) 96
8.3 3D THROUGH-SILICON VIA (TSV) 96
TABLE 31 3D TSV: 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION) 97
TABLE 32 3D TSV: 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION) 97
8.3.1 VIA-FIRST TSV 97
8.3.1.1 Increasing adoption of via-first TSV in applications requiring early-stage integration to drive market 97
8.3.2 VIA-MIDDLE TSV 98
8.3.2.1 Need for flexibility in vertical connections in semiconductor design to increase demand for via-middle TSV technology 98
8.3.3 VIA-LAST TSV 98
8.3.3.1 Growing adoption of via-last TSV technology in applications requiring late-stage interconnection to drive market 98
8.3.4 HYBRID TSV 98
8.3.4.1 Ability to meet specific design and performance requirements to fuel adoption of hybrid TSV 98
8.3.5 DEEP TRENCH TSV 98
8.3.5.1 Rising demand for enhanced electrical performance in advanced microprocessors and memory devices to drive market 98
8.3.6 MICROBUMP TSV 99
8.3.6.1 Rising demand for miniaturized and densely interconnected semiconductor devices to fuel market growth 99
8.3.7 THROUGH GLASS VIA (TGV) 99
8.3.7.1 Rising adoption of TGV technique in applications requiring transparent and hermetic packaging to drive market 99
8.4 MONOLITHIC 3D 99
8.4.1 ABILITY TO ADDRESS LIMITATIONS OF ADVANCED CMOS SCALING TO FUEL DEMAND FOR MONOLITHIC 3D INTEGRATION 99
TABLE 33 MONOLITHIC 3D INTEGRATION: 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION) 100
TABLE 34 MONOLITHIC 3D INTEGRATION: 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION) 100
9 3D STACKING MARKET, BY DEVICE TYPE 101
9.1 INTRODUCTION 102
FIGURE 37 MEMS/SENSORS SEGMENT TO REGISTER HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD 102
TABLE 35 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION) 103
TABLE 36 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION) 103
9.2 LOGIC ICS 103
9.2.1 RISING NEED FOR HIGH COMPUTATIONAL EFFICIENCY TO INDUCE DEMAND FOR LOGIC ICS 103
TABLE 37 LOGIC ICS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 104
TABLE 38 LOGIC ICS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 104
9.3 IMAGING & OPTOELECTRONICS 104
9.3.1 POTENTIAL TO IMPROVE IMAGE PROCESSING AND OPTICAL FUNCTIONALITIES TO SPUR ADOPTION OF 3D STACKING 104
TABLE 39 IMAGING & OPTOELECTRONICS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 105
TABLE 40 IMAGING & OPTOELECTRONICS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 105
9.4 MEMORY DEVICES 106
9.4.1 SURGING DEMAND FOR HIGH-BANDWIDTH MEMORY TO FOSTER MARKET GROWTH 106
TABLE 41 MEMORY DEVICES: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 106
TABLE 42 MEMORY DEVICES: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 107
9.5 MEMS/SENSORS 107
9.5.1 GROWING REQUIREMENT FOR COMPACT AND ACCURATE SENSING TECHNOLOGIES TO FUEL UPTAKE OF 3D STACKING 107
TABLE 43 MEMS/SENSORS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 108
TABLE 44 MEMS/SENSORS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 108
9.6 LIGHT EMITTING DIODES (LEDS) 108
9.6.1 RISING DEMAND FOR INNOVATIVE DESIGNS AND IMPROVED LUMINOSITY IN LEDS TO FUEL SEGMENTAL GROWTH 108
TABLE 45 LEDS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 109
TABLE 46 LEDS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 109
9.7 OTHERS 109
TABLE 47 OTHERS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 110
TABLE 48 OTHERS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 110
10 3D STACKING MARKET, BY END USER 111
10.1 INTRODUCTION 112
FIGURE 38 AUTOMOTIVE SEGMENT TO RECORD HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD 112
TABLE 49 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 112
TABLE 50 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 113
10.2 CONSUMER ELECTRONICS 113
10.2.1 INCREASING TECHNOLOGICAL ADVANCEMENTS IN CONSUMER ELECTRONICS TO DRIVE ADOPTION OF 3D STACKING 113
TABLE 51 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION) 114
TABLE 52 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION) 114
TABLE 53 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 115
TABLE 54 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 115
10.3 MANUFACTURING 115
10.3.1 INCREASING SHIFT TOWARD SMART FACTORIES AND INDUSTRY 4.0 TO FUEL ADOPTION OF 3D STACKING 115
TABLE 55 MANUFACTURING: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION) 116
TABLE 56 MANUFACTURING: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION) 116
TABLE 57 MANUFACTURING: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 116
TABLE 58 MANUFACTURING: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 117
10.4 COMMUNICATIONS 117
10.4.1 INTEGRATION OF ADVANCED FUNCTIONALITIES IN HIGH-PERFORMANCE COMPUTING APPLICATIONS TO DRIVE MARKET 117
TABLE 59 COMMUNICATIONS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION) 118
TABLE 60 COMMUNICATIONS: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION) 118
TABLE 61 COMMUNICATIONS: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 118
TABLE 62 COMMUNICATIONS: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 119
10.5 AUTOMOTIVE 119
10.5.1 RISING DEMAND FOR COMPACT AND POWERFUL AUTOMOTIVE ELECTRONIC SYSTEMS TO PROPEL MARKET GROWTH 119
TABLE 63 AUTOMOTIVE: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION) 119
TABLE 64 AUTOMOTIVE: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION) 120
TABLE 65 AUTOMOTIVE: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 120
TABLE 66 AUTOMOTIVE: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 120
10.6 HEALTHCARE 121
10.6.1 SURGING DEMAND FOR ADVANCED MEDICAL EQUIPMENT FOR HIGH PERFORMANCE AND EFFICIENCY TO FUEL MARKET GROWTH 121
TABLE 67 HEALTHCARE: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION) 121
TABLE 68 HEALTHCARE: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION) 121
TABLE 69 HEALTHCARE: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 122
TABLE 70 HEALTHCARE: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 122
10.7 OTHERS 122
TABLE 71 OTHERS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION) 123
TABLE 72 OTHERS: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION) 123
TABLE 73 OTHERS: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 123
TABLE 74 OTHERS: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 124
11 3D STACKING MARKET, BY REGION 125
11.1 INTRODUCTION 126
FIGURE 39 ASIA PACIFIC TO RECORD HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD 126
TABLE 75 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 127
TABLE 76 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 127
11.2 NORTH AMERICA 127
FIGURE 40 NORTH AMERICA: 3D STACKING MARKET SNAPSHOT 128
TABLE 77 NORTH AMERICA: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 129
TABLE 78 NORTH AMERICA: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 129
TABLE 79 NORTH AMERICA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 129
TABLE 80 NORTH AMERICA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 130
11.2.1 US 130
11.2.1.1 Presence of fabrication business giants to support market growth 130
TABLE 81 US: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 131
TABLE 82 US: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 131
11.2.2 CANADA 131
11.2.2.1 Increasing focus on innovation and technological advancements to foster market growth 131
TABLE 83 CANADA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 133
TABLE 84 CANADA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 133
11.2.3 MEXICO 133
11.2.3.1 Government-led initiatives to develop semiconductor industry to fuel market growth 133
TABLE 85 MEXICO: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 134
TABLE 86 MEXICO: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 134
11.2.4 NORTH AMERICA: RECESSION IMPACT 135
11.3 EUROPE 135
FIGURE 41 EUROPE: 3D STACKING MARKET SNAPSHOT 136
TABLE 87 EUROPE: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 136
TABLE 88 EUROPE: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 137
TABLE 89 EUROPE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 137
TABLE 90 EUROPE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 137
11.3.1 GERMANY 138
11.3.1.1 Growing production of automobiles to create demand for 3D stacking 138
TABLE 91 GERMANY: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 138
TABLE 92 GERMANY: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 139
11.3.2 FRANCE 139
11.3.2.1 Increasing R&D in 3D stacking to drive market 139
TABLE 93 FRANCE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 139
TABLE 94 FRANCE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 140
11.3.3 UK 140
11.3.3.1 5G implementation to create conducive environment for market growth 140
TABLE 95 UK: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 140
TABLE 96 UK: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 141
11.3.4 REST OF EUROPE 141
TABLE 97 REST OF EUROPE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 141
TABLE 98 REST OF EUROPE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 142
11.3.5 EUROPE: RECESSION IMPACT 142
11.4 ASIA PACIFIC 142
FIGURE 42 ASIA PACIFIC: 3D STACKING MARKET SNAPSHOT 143
TABLE 99 ASIA PACIFIC: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 144
TABLE 100 ASIA PACIFIC: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 144
TABLE 101 ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 144
TABLE 102 ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 145
11.4.1 CHINA 145
11.4.1.1 Increasing investments in semiconductor industry to drive market 145
TABLE 103 CHINA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 145
TABLE 104 CHINA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 146
11.4.2 JAPAN 146
11.4.2.1 Increasing focus on precision engineering to boost adoption of 3D stacking 146
TABLE 105 JAPAN: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 146
TABLE 106 JAPAN: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 147
11.4.3 SOUTH KOREA 147
11.4.3.1 Growing focus on innovation and research to contribute to market growth 147
TABLE 107 SOUTH KOREA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 147
TABLE 108 SOUTH KOREA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 148
11.4.4 TAIWAN 148
11.4.4.1 Rising demand for compact, efficient, and high-performing chips to support market growth 148
TABLE 109 TAIWAN: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 149
TABLE 110 TAIWAN: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 149
11.4.5 REST OF ASIA PACIFIC 149
TABLE 111 REST OF ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 150
TABLE 112 REST OF ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 150
11.4.6 ASIA PACIFIC: RECESSION IMPACT 150
11.5 REST OF THE WORLD (ROW) 151
TABLE 113 ROW: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION) 151
TABLE 114 ROW: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION) 151
TABLE 115 ROW: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 151
TABLE 116 ROW: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 152
11.5.1 MIDDLE EAST & AFRICA 152
11.5.1.1 Government initiatives to strengthen semiconductor industry to favor market growth 152
TABLE 117 MIDDLE EAST & AFRICA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 152
TABLE 118 MIDDLE EAST & AFRICA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 153
11.5.2 SOUTH AMERICA 153
11.5.2.1 Growing demand for advanced architecture and high-end computing to contribute to market growth 153
TABLE 119 SOUTH AMERICA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION) 153
TABLE 120 SOUTH AMERICA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION) 154
11.5.3 ROW: RECESSION IMPACT 154
12 COMPETITIVE LANDSCAPE 155
12.1 INTRODUCTION 155
12.2 STRATEGIES ADOPTED BY KEY PLAYERS 155
TABLE 121 OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS IN 3D STACKING MARKET 155
12.2.1 PRODUCT PORTFOLIO 156
12.2.2 REGIONAL FOCUS 156
12.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES 156
12.3 MARKET SHARE ANALYSIS, 2022 157
TABLE 122 3D STACKING MARKET: MARKET SHARE ANALYSIS, 2022 157
12.4 REVENUE ANALYSIS OF KEY PLAYERS IN 3D STACKING MARKET 159
FIGURE 43 FIVE-YEAR REVENUE ANALYSIS OF KEY PLAYERS IN 3D STACKING MARKET 159
12.5 KEY COMPANY EVALUATION MATRIX, 2022 159
12.5.1 STARS 159
12.5.2 PERVASIVE PLAYERS 159
12.5.3 EMERGING LEADERS 160
12.5.4 PARTICIPANTS 160
FIGURE 44 3D STACKING MARKET (GLOBAL): KEY COMPANY EVALUATION MATRIX, 2022 160
12.6 COMPETITIVE BENCHMARKING 161
12.6.1 COMPANY FOOTPRINT, BY INTERCONNECTING METHOD 161
12.6.2 COMPANY FOOTPRINT, BY DEVICE TYPE 162
12.6.3 COMPANY FOOTPRINT, BY END USER 163
12.6.4 COMPANY FOOTPRINT, BY REGION 164
12.6.5 OVERALL COMPANY FOOTPRINT 165
12.7 STARTUPS/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION MATRIX, 2022 166
TABLE 123 3D STACKING MARKET: DETAILED LIST OF KEY STARTUPS/SMES 166
12.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES 166
TABLE 124 COMPANY FOOTPRINT, BY INTERCONNECTING METHODS 166
TABLE 125 COMPANY FOOTPRINT, BY DEVICE TYPE 167
TABLE 126 COMPANY FOOTPRINT, BY END USER INDUSTRY 167
TABLE 127 COMPANY FOOTPRINT, BY REGION 167
12.7.2 PROGRESSIVE COMPANIES 168
12.7.3 RESPONSIVE COMPANIES 168
12.7.4 DYNAMIC COMPANIES 168
12.7.5 STARTING BLOCKS 168
FIGURE 45 3D STACKING MARKET (GLOBAL): STARTUPS/SMES EVALUATION MATRIX, 2022 168
12.8 COMPETITIVE SCENARIOS AND TRENDS 169
12.8.1 PRODUCT LAUNCHES & DEVELOPMENTS 169
TABLE 128 3D STACKING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2020–2023 169
12.8.2 DEALS 171
TABLE 129 3D STACKING MARKET: DEALS, 2020–2023 171
13 COMPANY PROFILES 175
13.1 INTRODUCTION 175
13.2 KEY PLAYERS 175
(Business overview, Products/Solutions/Services offered, Recent developments, Product launches, Deals, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses/Competitive threats)*
13.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 175
TABLE 130 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW 176
FIGURE 46 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD: COMPANY SNAPSHOT 176
TABLE 131 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED 177
TABLE 132 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES 177
TABLE 133 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS 178
TABLE 134 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: OTHERS 178
13.2.2 SAMSUNG 180
TABLE 135 SAMSUNG: COMPANY OVERVIEW 180
FIGURE 47 SAMSUNG: COMPANY SNAPSHOT 181
TABLE 136 SAMSUNG: PRODUCTS/SERVICES/SOLUTIONS OFFERED 181
TABLE 137 SAMSUNG: PRODUCT LAUNCHES 182
TABLE 138 SAMSUNG: DEALS 182
13.2.3 INTEL CORPORATION 183
TABLE 139 INTEL CORPORATION: COMPANY OVERVIEW 183
FIGURE 48 INTEL CORPORATION: COMPANY SNAPSHOT 184
TABLE 140 INTEL CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 184
13.2.4 SK HYNIX INC. 186
TABLE 141 SK HYNIX INC.: COMPANY OVERVIEW 186
FIGURE 49 SK HYNIX INC.: COMPANY SNAPSHOT 187
TABLE 142 SK HYNIX INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED 187
TABLE 143 SK HYNIX INC.: DEALS 188
13.2.5 ADVANCED MICRO DEVICES, INC. 190
TABLE 144 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW 190
FIGURE 50 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT 191
TABLE 145 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED 191
TABLE 146 ADVANCED MICRO DEVICES, INC.: DEALS 192
13.2.6 ASE TECHNOLOGY HOLDING CO., LTD. 193
TABLE 147 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW 193
FIGURE 51 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT 194
TABLE 148 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SERVICES/SOLUTIONS OFFERED 194
TABLE 149 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES 195
13.2.7 AMKOR TECHNOLOGY 197
TABLE 150 AMKOR TECHNOLOGY: COMPANY OVERVIEW 197
FIGURE 52 AMKOR TECHNOLOGY: COMPANY SNAPSHOT 198
TABLE 151 AMKOR TECHNOLOGY: PRODUCTS/SERVICES/SOLUTIONS OFFERED 198
TABLE 152 AMKOR TECHNOLOGY: DEALS 199
13.2.8 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD. 201
TABLE 153 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: COMPANY OVERVIEW 201
FIGURE 53 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT 201
TABLE 154 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: PRODUCTS/SERVICES/SOLUTIONS OFFERED 202
TABLE 155 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: PRODUCT LAUNCHES 202
TABLE 156 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: DEALS 202
13.2.9 TEXAS INSTRUMENTS INCORPORATED 203
TABLE 157 TEXAS INSTRUMENTS INCORPORATED: COMPANY OVERVIEW 203
FIGURE 54 TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT 204
TABLE 158 TEXAS INSTRUMENTS INCORPORATED: PRODUCTS/SERVICES/SOLUTIONS OFFERED 204
TABLE 159 TEXAS INSTRUMENTS INCORPORATED: DEALS 205
13.2.10 UNITED MICROELECTRONICS CORPORATION 206
TABLE 160 UNITED MICROELECTRONICS CORPORATION: COMPANY OVERVIEW 206
FIGURE 55 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT 207
TABLE 161 UNITED MICROELECTRONICS CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED 207
TABLE 162 UNITED MICROELECTRONICS CORPORATION: DEALS 208
13.2.11 POWERTECH TECHNOLOGY INC 209
TABLE 163 POWERTECH TECHNOLOGY INC: COMPANY OVERVIEW 209
FIGURE 56 POWERTECH TECHNOLOGY INC: COMPANY SNAPSHOT 210
TABLE 164 POWERTECH TECHNOLOGY INC: PRODUCTS/SERVICES/SOLUTIONS OFFERED 210
13.2.12 CADENCE DESIGN SYSTEMS, INC. 211
TABLE 165 CADENCE DESIGN SYSTEMS, INC.: COMPANY OVERVIEW 211
FIGURE 57 CADENCE DESIGN SYSTEMS, INC.: COMPANY SNAPSHOT 212
TABLE 166 CADENCE DESIGN SYSTEMS, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED 212
TABLE 167 CADENCE DESIGN SYSTEMS, INC.: DEALS 213
13.2.13 BROADCOM 214
TABLE 168 BROADCOM: COMPANY OVERVIEW 214
FIGURE 58 BROADCOM: COMPANY SNAPSHOT 215
TABLE 169 BROADCOM: PRODUCTS/SERVICES/SOLUTIONS OFFERED 215
TABLE 170 BROADCOM: DEALS 216
13.2.14 TOWER SEMICONDUCTOR 217
TABLE 171 TOWER SEMICONDUCTOR: COMPANY OVERVIEW 217
FIGURE 59 TOWER SEMICONDUCTOR: COMPANY SNAPSHOT 217
TABLE 172 TOWER SEMICONDUCTOR: PRODUCTS/SERVICES/SOLUTIONS OFFERED 218
TABLE 173 TOWER SEMICONDUCTOR: DEALS 218
13.2.15 IBM 219
TABLE 174 IBM: COMPANY OVERVIEW 219
FIGURE 60 IBM: COMPANY SNAPSHOT 220
TABLE 175 IBM: PRODUCTS/SERVICES/SOLUTIONS OFFERED 220
TABLE 176 IBM: PRODUCT LAUNCHES 221
13.2.16 TOKYO ELECTRON LIMITED 222
TABLE 177 TOKYO ELECTRON LIMITED: COMPANY OVERVIEW 222
FIGURE 61 TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT 223
TABLE 178 TOKYO ELECTRON LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED 223
TABLE 179 TOKYO ELECTRON LIMITED: PRODUCT LAUNCHES 224
13.2.17 CEA-LETI 225
TABLE 180 CEA-LETI: COMPANY OVERVIEW 225
TABLE 181 CEA-LETI: PRODUCTS/SERVICES/SOLUTIONS OFFERED 225
*Details on Business overview, Products/Solutions/Services offered, Recent developments, Product launches, Deals, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses/Competitive threats might not be captured in case of unlisted companies.
13.3 OTHER PLAYERS 226
13.3.1 SILICONWARE PRECISION INDUSTRIES CO., LTD. 226
13.3.2 GLOBALFOUNDRIES INC. 227
13.3.3 NHANCED SEMICONDUCTORS 228
13.3.4 DECA TECHNOLOGIES 229
13.3.5 TEZZARON 230
13.3.6 TELEDYNE TECHNOLOGIES INCORPORATED 230
13.3.7 HUAWEI TECHNOLOGIES CO. LTD. 231
13.3.8 QUALCOMM TECHNOLOGIES, INC. 232
13.3.9 3M 233
13.3.10 AYAR LABS, INC. 234
13.3.11 APPLIED MATERIALS, INC. 235
13.3.12 MONOLITHIC 3D INC. 236
13.3.13 MOLDEX3D 236
13.3.14 CEREBRAS 237
13.3.15 XPERI INC. 237
14 APPENDIX 238
14.1 DISCUSSION GUIDE 238
14.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 241
14.3 CUSTOMIZATION OPTIONS 243
14.4 RELATED REPORTS 243
14.5 AUTHOR DETAILS 244
