MID(Molded Interconnect Device) 시장 : 2027년까지의 세계 예측

출판 : MarketsandMarkets(마켓츠앤마켓츠)출판년월 : 2022년08월

MID(Molded Interconnect Device) 시장 : 제품 유형(안테나 및 연결성, 센서), 공정별(레이저 직접 구조, 2탄 성형), 산업(가전, 통신, 의료), 지역별 – 2027년까지의 세계 예측
Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography – Global Forecast to 2027

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The molded interconnect device (MID) market is expected to grow from USD1.4 billion in 2022 to USD 2.7billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period. The major driving factors for the growth of the molded interconnect device (MID)market include the growing advancement in automotive vertical.
MID(Molded Interconnect Device) 시장은 2022년 14억 달러에서 2027년 27억 달러로 성장할 것으로 예상됩니다. 예측 기간 동안 13.6%의 CAGR로 성장할 것으로 예상됩니다. MID(Molded Interconnect Device) 시장의 성장을 이끄는 주요 요인으로는 자동차 분야의 발전이 증가하고 있습니다.

MID(Molded Interconnect Device) 시장 : 제품 유형(안테나 및 연결성, 센서), 공정별(레이저 직접 구조, 2탄 성형), 산업(가전, 통신, 의료), 지역별 - 2027년까지의 세계 예측

Connectors and switches to have significant market size of molded interconnect device (MID)market during the forecast period
Connectors and switches are mainly used in automotive and medical industries. In the automotive Vertical, connectors find application in navigation devices, infotainment systems, cameras, and so on. MID technology is used in connectors to improve assembly operability, provide electrical and mechanical reliability, and offer compactness. Limited space issue in switchescan be solved using MID technology
Telecommunication to have second highestCAGR during the forecast period.
In the telecommunications sector, MIDs are used in mobile phones and landline phones, remote controls, and the global telecommunications infrastructure such as satellites, base equipment, and network equipment. Generally, telecommunications based on the network are used in three different broad business areas, namely, central office, outside plants, and mobility. Central office refers to large facilities where very high-volume communications are switched and processed; outside plants refer to switching stations where distributive switching occurs for commercial and home landlines; and the third area is mobility, where tower-based power and grounding supports mobile communication transmission.
USto grow with highest CAGR in North America during the forecast period.
The US is the major revenue generator for players dealing in MIDs in North America. In 2021, the US accounted for highest CAGR of the MID market in North America, owing to the presence of leading manufacturers such as Molex, Arlington Plating Company, Amphenol Corporation, and Kyocera AVX Corporation. These manufacturers provide a comprehensive range of MID products to enhance the electrical connectivity and performance of the equipment or devices across various applications. Consumer electronics, medical, telecommunication, and industrial applications are driving the demand for MIDs in the US. The consumer electronics market in the US has been continuously growing. Moreover, it has been observed that the demand for miniaturized packages has started gaining momentum in consumer electronics, automotive components, medical equipment, and other devices.

In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key officials in the molded interconnect device (MID)market. Following is the breakup of the profiles of primary participants for the report.

• By Company Type:Tier 1 – 35 %, Tier 2 – 45%, and Tier 3 – 20%
• By Designation:C-Level Executives – 35%, Directors- 25%, and Others – 40%
• By Region:North America– 45%, Asia Pacific – 30%, Europe- 20% and RoW – 5%
The molded interconnect device (MID)market comprises major players are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan),Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).

MID(Molded Interconnect Device) 시장 : 제품 유형(안테나 및 연결성, 센서), 공정별(레이저 직접 구조, 2탄 성형), 산업(가전, 통신, 의료), 지역별 - 2027년까지의 세계 예측

Research Coverage
The report defines, describes, and forecasts the molded interconnect device (MID)market based onproduct type, process, verticaland geography. It provides detailed information regarding factors such as drivers, restraints, opportunities, and challenges influencing the growth of the molded interconnect device (MID)market. It also analyzes competitive developments such as product launches, acquisitions, expansions, contracts, partnerships, and developments carried out by the key players to grow in the market.
Reasons to Buy This Report
The report will help leaders/new entrants in the molded interconnect device (MID)market in the following ways:
1. The report segments the molded interconnect device (MID)market comprehensively and provides the closest market size estimation for all subsegments across regions.
2. The report will help stakeholders understand the pulse of the market and provide them with information on key drivers, restraints, challenges, and opportunities about molded interconnect device (MID)market.
3. The report will help stakeholders understand their competitors better and gain insights to improve their position in the molded interconnect device (MID)market. The competitive landscape section describes the competitor ecosystem.


목차

TABLE OF CONTENTS

1 INTRODUCTION (Page No. – 25)
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.3 INCLUSIONS AND EXCLUSIONS
1.4 STUDY SCOPE
1.4.1 MARKETS COVERED
FIGURE 1 MOLDED INTERCONNECT DEVICE (MID) MARKET: SEGMENTATION
FIGURE 2 GEOGRAPHIC SCOPE
FIGURE 3 YEARS CONSIDERED
1.5 CURRENCY CONSIDERED
1.6 LIMITATIONS
1.7 STAKEHOLDERS
1.8 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY (Page No. – 29)
2.1 RESEARCH DATA
FIGURE 4 PROCESS FLOW: MOLDED INTERCONNECT DEVICE (MID) MARKET SIZE ESTIMATION
FIGURE 5 MOLDED INTERCONNECT DEVICE (MID) MARKET: RESEARCH DESIGN
2.1.1 SECONDARY AND PRIMARY RESEARCH
2.1.2 SECONDARY DATA
2.1.2.1 Secondary sources
2.1.2.2 List of key secondary sources
2.1.3 PRIMARY DATA
2.1.3.1 Primary sources
2.1.3.2 Key industry insights
2.1.3.3 Primary interviews with experts
2.1.3.4 List of key primary respondents
2.1.3.5 Breakdown of primaries
2.2 MARKET SIZE ESTIMATION
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Approach for arriving at market size by bottom-up analysis
FIGURE 6 MOLDED INTERCONNECT DEVICE MARKET: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Approach for deriving market size by top-down analysis
FIGURE 7 MOLDED INTERCONNECT DEVICE (MID) MARKET: TOP-DOWN APPROACH
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
FIGURE 8 DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
2.5 LIMITATIONS
2.6 RISK ASSESSMENT
TABLE 1 RISK ASSESSMENT

3 EXECUTIVE SUMMARY (Page No. – 40)
FIGURE 9 LASER DIRECT STRUCTURING SEGMENT TO LEAD MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD
FIGURE 10 ANTENNAE AND CONNECTIVITY MODULES TO HOLD LARGEST SHARE OF MOLDED INTERCONNECT DEVICE MARKET BY 2027
FIGURE 11 AUTOMOTIVE TO RECORD HIGHEST CAGR IN MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD
FIGURE 12 ASIA PACIFIC LIKELY TO BE FASTEST-GROWING MARKET FOR MOLDED INTERCONNECT DEVICES DURING FORECAST PERIOD

4 PREMIUM INSIGHTS (Page No. – 43)
4.1 ATTRACTIVE GROWTH OPPORTUNITIES FOR MARKET PLAYERS
FIGURE 13 INCREASING USE OF MOLDED INTERCONNECT DEVICES IN AUTOMOTIVE INDUSTRY TO OFFER OPPORTUNITIES FOR MARKET GROWTH FROM 2022 TO 2027
4.2 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY TYPE
FIGURE 14 SENSORS TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
4.3 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL
FIGURE 15 CONSUMER ELECTRONICS VERTICAL TO HOLD LARGEST SHARE OF MID MARKET DURING FORECAST PERIOD
4.4 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS AND REGION
FIGURE 16 LDS TO HAVE LARGEST MARKET SIZE FOR LDS PROCESS DURING FORECAST PERIOD
4.5 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY GEOGRAPHY (2027)
FIGURE 17 MID MARKET TO RECORD HIGHEST CAGR IN CHINA IN 2027

5 MARKET OVERVIEW (Page No. – 47)
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
FIGURE 18 RISING DEMAND FOR MINIATURIZATION IN CONSUMER ELECTRONICS VERTICAL DRIVING MID MARKET
5.2.1 DRIVERS
5.2.1.1 Growing use of LDS in production of 5G antennas
5.2.1.2 Increasing use of MIDs in medical devices
5.2.1.3 Rising demand for miniaturization in consumer electronics industry
5.2.1.4 Intensifying need to reduce e-waste
5.2.2 RESTRAINTS
5.2.2.1 Technological monopoly of LDS equipment manufacturers
5.2.3 OPPORTUNITIES
5.2.3.1 Rising use of MIDs in automotive industry
5.2.3.2 Expanding IoT ecosystem
5.2.3.3 Opportunities for chip-level optical interconnects
5.2.4 CHALLENGES
5.2.4.1 Incompatibility with electronic packages
5.3 VALUE CHAIN ANALYSIS
FIGURE 19 MID MARKET: VALUE CHAIN
5.3.1 RESEARCH AND DEVELOPMENT
5.3.2 MANUFACTURING
5.3.3 ASSEMBLY
5.3.4 MARKETING AND SALES
5.3.5 END-USERS
5.4 MID ECOSYSTEM ANALYSIS
FIGURE 20 MID ECOSYSTEM
TABLE 2 MID MARKET: ECOSYSTEM
5.5 PRICING ANALYSIS
TABLE 3 AVERAGE SELLING PRICE TRENDS FOR PRODUCTS
5.6 TRENDS AND DISTRIBUTION
FIGURE 21 REVENUE SHIFT FOR MID MARKET
5.7 TECHNOLOGY ANALYSIS
5.7.1 3D MOLDED INTERCONNECT DEVICES
5.7.2 LASER PLASMA PATTERNING
5.8 PORTER’S FIVE FORCES ANALYSIS
TABLE 4 MID MARKET: PORTER’S FIVE FORCES ANALYSIS
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
FIGURE 22 INFLUENCE OF STAKEHOLDERS IN BUYING PROCESS FOR TOP 3 VERTICALS
TABLE 5 INFLUENCE OF STAKEHOLDERS IN BUYING PROCESS FOR TOP 3 VERTICALS (%)
5.9.2 BUYING CRITERIA
FIGURE 23 KEY BUYING CRITERIA FOR TOP 3 VERTICALS
TABLE 6 KEY BUYING CRITERIA FOR TOP 3 VERTICALS
5.10 CASE STUDY ANALYSIS
5.10.1 MID SOLUTIONS
TABLE 7 SIEMENS COLLABORATED WITH LPKF LASER & ELECTRONICS FOR DEVELOPING MID-BASED HEARING AID
5.10.2 3D MID TECHNOLOGY
TABLE 8 3D MID COMPONENTS INSPECTION USING VISCOM S6056 MID
5.11 TRADE ANALYSIS
5.11.1 TRADE DATA FOR HS CODE 947330
FIGURE 24 IMPORT DATA FOR HS CODE 947330, BY COUNTRY, 2017−2021 (USD THOUSAND)
FIGURE 25 EXPORT DATA FOR HS CODE 947330, BY COUNTRY, 2017−2021 (USD THOUSAND)
5.12 TARIFF ANALYSIS
TABLE 9 TARIFFS DATA FOR HS 947330
5.13 PATENT ANALYSIS
FIGURE 26 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS
TABLE 10 TOP 10 PATENT OWNERS IN US IN LAST 10 YEARS
FIGURE 27 NUMBER OF PATENTS GRANTED PER YEAR FROM 2012 TO 2022
TABLE 11 LIST OF PATENTS
5.14 KEY CONFERENCES AND EVENTS, 2022–2023
TABLE 12 MID MARKET: DETAILED LIST OF CONFERENCES AND EVENTS
5.15 REGULATORY LANDSCAPE
5.15.1 REGULATIONS PERTAINING TO ELECTRIC AND ELECTRONIC PRODUCTS
TABLE 13 REGULATIONS IN US
5.15.2 STANDARDS RELATED TO ELECTRICAL EQUIPMENT
TABLE 14 STANDARDS AND DESCRIPTION
5.15.3 RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) AND WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE)

6 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PRODUCT TYPE (Page No. – 67)
6.1 INTRODUCTION
FIGURE 28 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PRODUCT TYPE
FIGURE 29 ANTENNAE AND CONNECTIVITY MODULES TO ACCOUNT FOR LARGEST MARKET SIZE DURING FORECAST PERIOD
TABLE 15 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 16 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
6.2 ANTENNAE AND CONNECTIVITY MODULES
6.2.1 EXTENSIVELY USED IN CONSUMER ELECTRONICS
TABLE 17 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 18 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 19 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 20 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
6.3 SENSORS
6.3.1 USED IN INDUSTRIAL APPLICATIONS
TABLE 21 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 22 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 23 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 24 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
6.4 CONNECTORS AND SWITCHES
6.4.1 USED IN NAVIGATION DEVICES
TABLE 25 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 26 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 27 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 28 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
6.5 LIGHTING SYSTEMS
6.5.1 MOLDED INTERCONNECT DEVICES MAKE LIGHTING SYSTEMS COST-EFFICIENT AND EFFECTIVE
TABLE 29 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 30 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 31 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 32 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
6.6 OTHERS
TABLE 33 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 34 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 35 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 36 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)

7 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS (Page No. – 78)
    7.1 INTRODUCTION
FIGURE 30 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS
FIGURE 31 LASER DIRECT STRUCTURING (LDS) TO REGISTER HIGHEST CAGR IN MID MARKET DURING FORECAST PERIOD
TABLE 37 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION)
TABLE 38 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION)
7.2 LASER DIRECT STRUCTURING (LDS)
7.2.1 CAN INTEGRATE MORE ELECTRONIC CIRCUITS INTO SMALLER SPACES
TABLE 39 LASER DIRECT STRUCTURING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION 2018–2021 (USD MILLION)
TABLE 40 LASER DIRECT STRUCTURING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION 2022–2027 (USD MILLION)
7.3 TWO-SHOT MOLDING
7.3.1 USED FOR HIGH-VOLUME PRODUCTION OF MOLDED INTERCONNECT DEVICES
TABLE 41 TWO-SHOT MOLDING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 42 TWO-SHOT MOLDING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
7.4 FILM TECHNIQUES
7.4.1 USED FOR PRODUCTION OF FLAT SURFACES
TABLE 43 FILM TECHNIQUES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 44 FILM TECHNIQUES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)

8 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL (Page No. – 84)
8.1 INTRODUCTION
FIGURE 32 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL
FIGURE 33 AUTOMOTIVE SEGMENT TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
TABLE 45 MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 46 MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
8.2 TELECOMMUNICATIONS
8.2.1 USES MOLDED INTERCONNECT DEVICES FOR WIRELESS COMMUNICATIONS
TABLE 47 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 48 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027(USD MILLION)
TABLE 49 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 50 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027(USD MILLION)
8.3 CONSUMER ELECTRONICS
8.3.1 USES MOLDED INTERCONNECT DEVICES IN ANTENNAS
TABLE 51 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 52 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
TABLE 53 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 54 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
8.4 AUTOMOTIVE
8.4.1 DEPLOYS MOLDED INTERCONNECT DEVICES IN SMART VEHICLES
TABLE 55 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 56 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
TABLE 57 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 58 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
8.5 MEDICAL
8.5.1 NEED FOR MINIATURIZED MEDICAL DEVICES
TABLE 59 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 60 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
TABLE 61 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 62 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
8.6 INDUSTRIAL
8.6.1 MOLDED INTERCONNECT DEVICES ARE USED IN INDUSTRIAL SENSORS
TABLE 63 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 64 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
TABLE 65 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 66 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
8.7 MILITARY & AEROSPACE
8.7.1 GROWING DEMAND FOR RADAR AND ELECTRONIC WARFARE EQUIPMENT
TABLE 67 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 68 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
TABLE 69 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 70 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)

9 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY REGION (Page No. – 98)
9.1 INTRODUCTION
FIGURE 34 MOLDED INTERCONNECT DEVICE MARKET IN CHINA TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
TABLE 71 MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 72 MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
9.2 NORTH AMERICA
FIGURE 35 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT
TABLE 73 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION)
TABLE 74 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION)
TABLE 75 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION)
TABLE 76 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION)
TABLE 77 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 78 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 79 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 80 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
9.2.1 US
9.2.1.1 Increase in adoption of miniaturized packages
9.2.2 CANADA
9.2.2.1 Government initiatives and investments to support semiconductors manufacturing
9.3 EUROPE
FIGURE 36 EUROPE: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT
TABLE 81 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION)
TABLE 82 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION)
TABLE 83 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION)
TABLE 84 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION)
TABLE 85 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 86 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 87 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 88 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
9.3.1 GERMANY
9.3.1.1 Increasing demand for ADAS
9.3.2 FRANCE
9.3.2.1 Presence of developed communication network
9.3.3 UK
9.3.3.1 Heightened demand from medical vertical
9.3.4 REST OF EUROPE
9.4 ASIA PACIFIC
FIGURE 37 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT
TABLE 89 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION)
TABLE 90 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION)
TABLE 91 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION)
TABLE 92 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION)
TABLE 93 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 94 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 95 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 96 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
9.4.1 CHINA
9.4.1.1 Increase in medical equipment manufacturing
9.4.2 JAPAN
9.4.2.1 Increase in demand for consumer electronics and automobiles
9.4.3 SOUTH KOREA
9.4.3.1 Expansion of manufacturing sector
9.4.4 REST OF ASIA PACIFIC
9.5 REST OF THE WORLD (ROW)
FIGURE 38 REST OF THE WORLD: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT
TABLE 97 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION)
TABLE 98 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION)
TABLE 99 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION)
TABLE 100 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION)
TABLE 101 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION)
TABLE 102 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION)
TABLE 103 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION)
TABLE 104 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION)
9.5.1 SOUTH AMERICA
9.5.1.1 High adoption of wireless communication
9.5.2 MIDDLE EAST AND AFRICA
9.5.2.1 Favorable government initiatives and high military investments

10 COMPETITIVE LANDSCAPE (Page No. – 121)
10.1 OVERVIEW
10.2 THREE-YEAR REVENUE ANALYSIS OF TOP 5 PLAYERS
FIGURE 39 REVENUE ANALYSIS, 2019–2021 (USD BILLION)
10.3 KEY PLAYER STRATEGIES/RIGHT TO WIN
TABLE 105 KEY STRATEGIES OF TOP PLAYERS IN MID MARKET
10.4 MARKET SHARE ANALYSIS (2021)
TABLE 106 MID MARKET: MARKET SHARE ANALYSIS
FIGURE 40 MARKET SHARE ANALYSIS: MID MARKET, 2021
10.5 COMPANY EVALUATION QUADRANT, 2021
10.5.1 STARS
10.5.2 PERVASIVE PLAYERS
10.5.3 EMERGING LEADERS
10.5.4 PARTICIPANTS
FIGURE 41 MID MARKET: COMPANY EVALUATION QUADRANT, 2021
10.5.5 COMPANY FOOTPRINT
TABLE 107 COMPANY FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET
TABLE 108 COMPANY VERTICAL FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET
TABLE 109 COMPANY PROCESS FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET
TABLE 110 COMPANY REGIONAL FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET
10.6 SMALL AND MEDIUM-SIZED ENTERPRISE (SME) EVALUATION QUADRANT, 2021
10.6.1 PROGRESSIVE COMPANIES
10.6.2 RESPONSIVE COMPANIES
10.6.3 DYNAMIC COMPANIES
10.6.4 STARTING BLOCKS
FIGURE 42 MOLDED INTERCONNECT DEVICE (MID) MARKET: SME EVALUATION QUADRANT, 2021
TABLE 111 MID MARKET: DETAILED LIST OF KEY STARTUPS/SMES
10.7 COMPETITIVE SCENARIO
TABLE 112 MOLDED INTERCONNECT DEVICE (MID) MARKET: PRODUCT LAUNCHES, JANUARY 2020–JANUARY 2022
TABLE 113 MOLDED INTERCONNECT DEVICE (MID) MARKET: DEALS, JANUARY 2020–JANUARY 2022

11 COMPANY PROFILES (Page No. – 136)
11.1 KEY COMPANIES
(Business overview, Products offered, Recent Developments, MNM view)*
11.1.1 MOLEX
TABLE 114 MOLEX: BUSINESS OVERVIEW
TABLE 115 MOLEX: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 116 MOLEX: DEALS
11.1.2 LPKF LASER & ELECTRONICS
TABLE 117 LPKF LASER & ELECTRONICS: BUSINESS OVERVIEW
FIGURE 43 LPKF LASER & ELECTRONICS: COMPANY SNAPSHOT
TABLE 118 LPKF LASER & ELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 119 LPKF LASER & ELECTRONICS: PRODUCT LAUNCHES
11.1.3 TE CONNECTIVITY
TABLE 120 TE CONNECTIVITY: BUSINESS OVERVIEW
FIGURE 44 TE CONNECTIVITY: COMPANY SNAPSHOT
TABLE 121 TE CONNECTIVITY: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 122 TE CONNECTIVITY: PRODUCT LAUNCHES
TABLE 123 TE CONNECTIVITY: DEALS
11.1.4 TAOGLAS
TABLE 124 TAOGLAS: BUSINESS OVERVIEW
TABLE 125 TAOGLAS: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 126 TAOGLAS: PRODUCT LAUNCHES
TABLE 127 TAOGLAS: DEALS
11.1.5 AMPHENOL CORPORATION
TABLE 128 AMPHENOL CORPORATION: BUSINESS OVERVIEW
FIGURE 45 AMPHENOL CORPORATION: COMPANY SNAPSHOT
TABLE 129 AMPHENOL CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 130 AMPHENOL CORPORATION: PRODUCT LAUNCHES
TABLE 131 AMPHENOL CORPORATION: DEALS
TABLE 132 AMPHENOL CORPORATION: OTHERS
11.1.6 HARTING
TABLE 133 HARTING: BUSINESS OVERVIEW
TABLE 134 HARTING: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 135 HARTING: PRODUCT LAUNCHES
TABLE 136 HARTING: OTHERS
11.1.7 ARLINGTON PLATING COMPANY
TABLE 137 ARLINGTON PLATING COMPANY: BUSINESS OVERVIEW
TABLE 138 ARLINGTON PLATING COMPANY: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 139 ARLINGTON PLATING COMPANY: DEALS
TABLE 140 ARLINGTON PLATING COMPANY: OTHERS
11.1.8 MID SOLUTIONS GMBH
TABLE 141 MID SOLUTIONS GMBH: BUSINESS OVERVIEW
TABLE 142 MID SOLUTIONS GMBH: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 143 MID SOLUTIONS GMBH: OTHERS
11.1.9 2E MECHATRONIC
TABLE 144 2E MECHATRONIC: BUSINESS OVERVIEW
TABLE 145 2E MECHATRONIC: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 146 2E MECHATRONIC: OTHERS
11.1.10 KYOCERA AVX
TABLE 147 KYOCERA AVX: BUSINESS OVERVIEW
TABLE 148 KYOCERA AVX: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 149 KYOCERA AVX: PRODUCT LAUNCHES
TABLE 150 KYOCERA AVX: DEALS
TABLE 151 KYOCERA AVX: OTHERS
11.1.11 JOHNAN
TABLE 152 JOHNAN: BUSINESS OVERVIEW
TABLE 153 JOHNAN: PRODUCTS/SOLUTIONS/SERVICES OFFERED
TABLE 154 JOHNAN: DEALS
TABLE 155 JOHNAN: OTHERS
11.2 OTHER IMPORTANT PLAYERS
11.2.1 TEPROSA
11.2.2 SUNWAY COMMUNICATION
11.2.3 AXON CABLE
11.2.4 S2P
11.2.5 SUZHOU CICOR TECHNOLOGY CO. LTD
11.2.6 TACTOTEK
11.2.7 DURATECH INDUSTRIES
11.2.8 TEKRA
11.2.9 YOMURA TECHNOLOGIES
11.2.10 MACDERMID ALPHA ELECTRONICS
11.2.11 GALTRONICS
11.2.12 YAZAKI CORPORATION
11.2.13 CHOGORI TECHNOLOGY
11.2.14 SUZHOU ZEETEK ELECTRONICS
11.2.15 TOYO CONNECTORS
11.2.16 SINOPLAST
*Details on Business overview, Products offered, Recent Developments, MNM view might not be captured in case of unlisted companies.

12 APPENDIX (Page No. – 172)
12.1 DISCUSSION GUIDE
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
12.3 CUSTOMIZATION OPTIONS
12.4 RELATED REPORTS
12.5 AUTHOR DETAILS


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