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3D IC 및 2.5D IC 패키징 시장조사 보고서

출판 : MarketsandMarkets (마켓츠앤마켓츠)   출판년월 : 2023년05월

3D IC 및 2.5D IC 패키징 시장 : 패키징 기술(3D 웨이퍼 레벨 칩 스케일 패키징, 3D TSV 및 2.5D), 애플리케이션(로직, 메모리, MEMS/센서, 이미징, 광전자, LED), 최종 사용자, 지역별 – 2028년까지의 세계 예측
3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region – Global Forecast to 2028

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구성 영문조사보고서
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리포트목차    주문/문의    납기/라이센스안내

 

The 3D IC and 2.5D IC packaging market is projected to reach USD 82.0 billion by 2028 from USD 49.3 billion in 2023, at a CAGR of 10.7% from 2023 to 2028. The major factors driving the market growth of the 3D IC and 2.5D IC packaging market include rising trend of increased integration density and miniaturization of electronic devices and growing demand for consumer electronics and gaming devices.
3D IC 및 2.5D IC 패키징 시장은 2023년 493억 달러에서 2028년까지 820억 달러에 이를 것으로 예상되며, 2023년부터 2028년까지 연평균 10.7% 성장할 것으로 예상됩니다. 3D IC 및 2.5D IC 패키징 시장의 시장 성장을 주도하는 주요 요인에는 전자 장치의 집적도 증가 및 소형화 추세 증가와 소비자 가전 및 게임 장치에 대한 수요 증가가 포함됩니다.

3D IC 및 2.5D IC 패키징 시장 : 패키징 기술(3D 웨이퍼 레벨 칩 스케일 패키징, 3D TSV 및 2.5D), 애플리케이션(로직, 메모리, MEMS/센서, 이미징, 광전자, LED), 최종 사용자, 지역별 - 2028년까지의 세계 예측 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
Highest interconnect density offered by 3d tsv to fuel market demand
TSVs are vertical interconnects that join the various layers of the 3D IC by slicing through the whole thickness of the silicon wafer. They enable more effective signal transmission across IC layers and shorten the distance that signals must travel, which lowers power consumption and boosts performance.

3D IC 및 2.5D IC 패키징 시장 : 패키징 기술(3D 웨이퍼 레벨 칩 스케일 패키징, 3D TSV 및 2.5D), 애플리케이션(로직, 메모리, MEMS/센서, 이미징, 광전자, LED), 최종 사용자, 지역별 - 2028년까지의 세계 예측 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
Use of IC packaging in ADAS and autonomous driving to fuel market growth
Automobiles today are integrated with various technology devices, such as ECUs, sensors, power modules, microprocessors, DSPs, and advanced driver assistance systems, among many others, which enables the usage of memories such as DRAM, NAND flash, NOR flash, and SSD storage, driven by advanced packaging of 3D IC and 2.5D IC. Low power consumption and dense packaging of 3D ICs are driving its growth in the automobile industry for memory applications.
Adoption of mems/sensors by automotive industry to drive market growth
The automotive industry has adopted MEMS sensors to boost performance, save costs, and increase reliability. For instance, inertial MEMS sensors in the automobile industry are crash-sensing for airbag control. Several advanced features of automobiles, such as crash sensing for airbag control, dynamic vehicle control, rollover detection, antitheft systems, and many more, demand MEMS with advanced packaging to ensure high performance, quick response, low power consumption, and greater compactness.

3D IC 및 2.5D IC 패키징 시장 : 패키징 기술(3D 웨이퍼 레벨 칩 스케일 패키징, 3D TSV 및 2.5D), 애플리케이션(로직, 메모리, MEMS/센서, 이미징, 광전자, LED), 최종 사용자, 지역별 - 2028년까지의 세계 예측 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
North America is expected to account for the second largest market share during the forecast period
The 3D IC and 2.5D IC packaging market in North America has been further segmented into the US., Canada, and Mexico. Being home to some of the leading semiconductor companies, such as Intel Corporation (US), Texas Instruments Inc. (US), Qualcomm Incorporated (US), and Advanced Micro Devices, Inc. (US), makes the region technologically advanced.

The break-up of profile of primary participants in the 3D IC and 2.5D IC packaging market-
• By Company Type: Tier 1 – 38%, Tier 2 – 28%, Tier 3 – 34%
• By Designation Type: C Level – 40%, Director Level – 30%, Others – 30%
• By Region Type: North America – 35%, Europe – 35%, Asia Pacific – 20%, Rest of the World – 10%

The major players of 3D IC and 2.5D IC packaging market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US) among others.

3D IC 및 2.5D IC 패키징 시장 : 패키징 기술(3D 웨이퍼 레벨 칩 스케일 패키징, 3D TSV 및 2.5D), 애플리케이션(로직, 메모리, MEMS/센서, 이미징, 광전자, LED), 최종 사용자, 지역별 - 2028년까지의 세계 예측 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
Research Coverage
The report segments the 3D IC and 2.5D IC packaging market and forecasts its size based on packaging technology, application, end user and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing the market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.

3D IC 및 2.5D IC 패키징 시장 : 패키징 기술(3D 웨이퍼 레벨 칩 스케일 패키징, 3D TSV 및 2.5D), 애플리케이션(로직, 메모리, MEMS/센서, 이미징, 광전자, LED), 최종 사용자, 지역별 - 2028년까지의 세계 예측 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
Reasons to buy the report:
The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall 3D IC and 2.5D IC packaging market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
• Analysis of key drivers (Increasing need for advanced architecture in electronic products; Rising trend of increased integration density and miniaturization of electronic devices; Growing demand for consumer electronics and gaming devices), restraints (Thermal issues resulting from higher level of integration; High unit cost of 3D IC packages), opportunities (Growing adoption of high-end computing, servers, and data centers; Miniaturization of IoT Devices; Rising number of smart infrastructure and smart city projects), and challenges (Effective supply chain management; Reliability challenges with 3D IC packaging)
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the 3D IC and 2.5D IC packaging market
• Market Development: Comprehensive information about lucrative markets – the report analyses the 3D IC and 2.5D IC packaging market across varied regions
• Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the 3D IC and 2.5D IC packaging market
Competitive Assessment: In-depth assessment of market shares, growth strategies and product offerings of leading players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan) and Amkor Technology (US).


목차

1 INTRODUCTION 27
1.1 STUDY OBJECTIVES 27
1.2 MARKET DEFINITION 27
1.2.1 INCLUSIONS AND EXCLUSIONS 28
1.3 STUDY SCOPE 28
FIGURE 1 3D IC AND 2.5D IC PACKAGING MARKET: SEGMENTATION 28
1.3.1 REGIONAL SCOPE 29
1.3.2 YEARS CONSIDERED 29
1.4 CURRENCY CONSIDERED 30
1.5 LIMITATIONS 30
1.6 STAKEHOLDERS 30
1.7 SUMMARY OF CHANGES 31
1.7.1 RECESSION IMPACT 31
2 RESEARCH METHODOLOGY 32
2.1 RESEARCH DATA 32
FIGURE 2 3D IC AND 2.5D IC PACKAGING MARKET: RESEARCH DESIGN 32
2.1.1 SECONDARY AND PRIMARY RESEARCH 34
2.1.2 SECONDARY DATA 34
2.1.2.1 Major secondary sources 35
2.1.2.2 Secondary sources 35
2.1.3 PRIMARY DATA 35
2.1.3.1 Breakdown of primaries 36
2.1.3.2 Key data from primary sources 37
2.1.3.3 Key industry insights 38
2.2 MARKET SIZE ESTIMATION 38
FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION 38
2.2.1 BOTTOM-UP APPROACH 39
2.2.1.1 Estimating market size by bottom-up approach (demand side) 39
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 40
2.2.2 TOP-DOWN APPROACH 40
2.2.2.1 Estimating market size by top-down approach (supply side) 40
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 41
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D IC AND 2.5D IC PACKAGING SOLUTIONS AND SERVICES 41
2.3 DATA TRIANGULATION 42
FIGURE 7 DATA TRIANGULATION 42
2.4 RESEARCH ASSUMPTIONS 43
TABLE 1 ASSUMPTIONS FOR RESEARCH STUDY 43
2.4.1 RESEARCH LIMITATIONS 43
2.5 RISK ASSESSMENT 44
2.6 PARAMETERS CONSIDERED TO ANALYZE IMPACT OF RECESSION ON 3D IC AND 2.5D IC PACKAGING MARKET 44
3 EXECUTIVE SUMMARY 45
3.1 3D IC AND 2.5D IC PACKAGING MARKET: RECESSION IMPACT 46
FIGURE 8 RECESSION IMPACT: GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES 46
FIGURE 9 RECESSION IMPACT ON 3D IC AND 2.5D IC PACKAGING MARKET, 2019–2028 (USD MILLION) 47
FIGURE 10 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE AMONG END USERS IN 3D IC AND 2.5D IC PACKAGING MARKET 47
FIGURE 11 MEMORY TO HOLD LARGEST MARKET SHARE AMONG APPLICATIONS IN 3D IC AND 2.5D IC PACKAGING MARKET 48
FIGURE 12 2.5D PACKAGING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD 48
FIGURE 13 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC TO EXHIBIT FASTEST GROWTH DURING FORECAST PERIOD 49
4 PREMIUM INSIGHTS 50
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 50
FIGURE 14 INCREASED ADOPTION OF CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH 50
4.2 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER 50
FIGURE 15 MILITARY & AEROSPACE TO REGISTER HIGHEST CAGR FROM 2023 TO 2028 50
4.3 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 51
FIGURE 16 2.5D TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028 51
4.4 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 51
FIGURE 17 MEMORY TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028 51
4.5 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC, BY END USER AND COUNTRY 52
FIGURE 18 CONSUMER ELECTRONICS VERTICAL AND CHINA WERE LARGEST SHAREHOLDERS IN ASIA PACIFIC 3D IC AND 2.5D IC PACKAGING MARKET IN 2022 52
4.6 GEOGRAPHIC SNAPSHOT OF 3D IC AND 2.5D IC PACKAGING MARKET 53
FIGURE 19 3D IC AND 2.5D IC PACKAGING MARKET IN MEXICO EXPECTED TO GROW AT FASTEST RATE DURING FORECAST PERIOD 53
5 MARKET OVERVIEW 54
5.1 INTRODUCTION 54
5.2 MARKET DYNAMICS 54
FIGURE 20 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: 3D IC AND 2.5D IC PACKAGING MARKET 54
5.2.1 DRIVERS 55
FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON 3D IC AND 2.5D IC PACKAGING MARKET 55
5.2.1.1 Increasing need for advanced architecture in electronic products 55
5.2.1.2 Rising trend of increased integration density and miniaturization of electronic devices 55
5.2.1.3 Growing demand for consumer electronics and gaming devices 56
FIGURE 22 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020–2025 (BILLION) 57
5.2.2 RESTRAINTS 57
FIGURE 23 ANALYSIS OF IMPACT OF RESTRAINTS ON 3D IC AND 2.5D IC PACKAGING MARKET 57
5.2.2.1 Thermal issues resulting from higher level of integration 57
5.2.2.2 High unit cost of 3D IC packages 58
5.2.3 OPPORTUNITIES 58
FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D IC AND 2.5D IC PACKAGING MARKET 58
5.2.3.1 Growing adoption of high-end computing, servers, and data centers 58
5.2.3.2 Miniaturization of IoT devices 59
5.2.3.3 Rising number of smart infrastructure and smart city projects 59
5.2.4 CHALLENGES 60
FIGURE 25 ANALYSIS OF IMPACT OF CHALLENGES ON 3D IC AND 2.5D IC PACKAGING MARKET 60
5.2.4.1 Effective supply chain management 60
5.2.4.2 Reliability challenges in 3D IC packaging 60
5.3 SUPPLY CHAIN ANALYSIS 61
FIGURE 26 SUPPLY CHAIN ANALYSIS: 3D IC AND 2.5D IC PACKAGING MARKET 61
5.4 3D IC AND 2.5D IC PACKAGING ECOSYSTEM 63
FIGURE 27 3D IC AND 2.5D IC PACKAGING ECOSYSTEM 63
5.5 REVENUE SHIFT AND NEW REVENUE POCKETS FOR 3D IC AND 2.5D IC PACKAGING MARKET 64
FIGURE 28 REVENUE SHIFT IN 3D IC AND 2.5D IC PACKAGING MARKET 64
5.6 AVERAGE SELLING PRICE ANALYSIS 64
TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (THOUSAND UNITS) 65
5.6.1 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS 65
FIGURE 29 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS 65
5.6.2 AVERAGE SELLING PRICE TREND 65
TABLE 3 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, 12-INCH EQUIVALENT WAFERS, (USD/THOUSAND UNITS) 65
FIGURE 30 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, BY WAFER (USD/THOUSAND UNITS) 66
5.7 TECHNOLOGY TRENDS 66
5.7.1 FAN-OUT WAFER-LEVEL PACKAGING 66
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING 67
5.8 PORTER’S FIVE FORCES ANALYSIS 67
TABLE 4 3D IC AND 2.5D IC PACKAGING MARKET: PORTER’S FIVE FORCES ANALYSIS 67
FIGURE 31 PORTER’S FIVE FORCES ANALYSIS 68
5.8.1 THREAT OF NEW ENTRANTS 69
5.8.2 THREAT OF SUBSTITUTES 69
5.8.3 BARGAINING POWER OF SUPPLIERS 69
5.8.4 BARGAINING POWER OF BUYERS 69
5.8.5 INTENSITY OF COMPETITIVE RIVALRY 70
5.9 KEY STAKEHOLDERS AND BUYING PROCESS AND/ OR BUYING CRITERIA 70
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 70
FIGURE 32 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END USERS 70
TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 VERTICALS (%) 71
5.9.2 BUYING CRITERIA 71
FIGURE 33 KEY BUYING CRITERIA FOR TOP THREE VERTICALS 71
TABLE 6 KEY BUYING CRITERIA FOR TOP THREE VERTICALS 71
5.10 CASE STUDY ANALYSIS 72
5.10.1 CLOSED-LOOP MONITORING AND CONTROL BASED ON THERMAL BEHAVIOR REDUCED WAFER REJECTION 72
5.10.2 SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM 72
5.11 TRADE ANALYSIS 72
5.11.1 IMPORT SCENARIO 73
TABLE 7 IMPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION) 73
5.11.2 EXPORT SCENARIO 73
TABLE 8 EXPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION) 74
5.12 PATENT ANALYSIS 75
TABLE 9 NOTABLE PATENTS RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET, 2020–2023 75
FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR, 2013–2022 79
TABLE 10 NUMBER OF PATENTS REGISTERED RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET IN LAST 10 YEARS 79
FIGURE 35 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS 80
5.13 KEY CONFERENCES AND EVENTS, 2023–2024 80
TABLE 11 3D IC AND 2.5D IC PACKAGING MARKET: KEY CONFERENCES AND EVENTS 80
5.14 STANDARDS AND REGULATORY LANDSCAPE 81
5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 81
TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 81
TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 82
TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 82
5.14.2 KEY REGULATIONS AND STANDARDS 83
5.14.2.1 North America 83
5.14.2.2 Europe 83
5.14.2.3 Asia Pacific 84
5.14.2.4 Regulations 84
5.14.2.5 Standards 84
6 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 86
6.1 INTRODUCTION 87
FIGURE 36 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 87
TABLE 15 COMPARISON BETWEEN 2.5D AND 3D IC TECHNOLOGIES 88
FIGURE 37 MARKET FOR 3D WLCSP TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 88
TABLE 16 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 89
TABLE 17 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 89
6.2 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP) 89
6.2.1 USE OF 3D WLCSP IN CONSUMER ELECTRONICS TO DRIVE MARKET 89
TABLE 18 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 90
TABLE 19 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 90
6.3 3D THROUGH-SILICON VIA (TSV) 91
6.3.1 HIGHEST INTERCONNECT DENSITY OFFERED BY 3D TSV TO FUEL DEMAND 91
TABLE 20 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 91
TABLE 21 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 92
6.4 2.5D 92
6.4.1 REDUCED COST BENEFIT OFFERED BY 2.5D IC PACKAGING TO DRIVE MARKET 92
TABLE 22 2.5D: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 93
TABLE 23 2.5D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 93
7 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 94
7.1 INTRODUCTION 95
FIGURE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 95
FIGURE 39 MEMS/SENSORS TO RECORD HIGHEST CAGR DURING FORECAST PERIOD 95
TABLE 24 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 96
TABLE 25 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 96
7.2 LOGIC 97
7.2.1 GROWING PENETRATION OF IOT TO DRIVE MARKET 97
TABLE 26 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 97
TABLE 27 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 98
7.3 IMAGING & OPTOELECTRONICS 98
7.3.1 RISING DEMAND FOR SECURITY AND REAL-TIME MONITORING IN AUTOMOBILES TO DRIVE MARKET 98
FIGURE 40 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR FROM 2023 TO 2028 99
TABLE 28 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 99
TABLE 29 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 100
7.4 MEMORY 100
7.4.1 INCREASED USE OF ARTIFICIAL INTELLIGENCE AND MACHINE LEARNING TO DRIVE MARKET 100
TABLE 30 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 101
TABLE 31 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 101
7.5 MEMS/SENSORS 101
7.5.1 ADOPTION OF MEMS/SENSORS BY AUTOMOTIVE INDUSTRY TO DRIVE MARKET 101
TABLE 32 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 102
TABLE 33 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 102
7.6 LEDS 103
7.6.1 USE OF LEDS IN FIBER OPTICS TO DRIVE MARKET 103
TABLE 34 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 103
TABLE 35 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 104
7.7 OTHERS 104
TABLE 36 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 105
TABLE 37 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 105
8 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER 106
8.1 INTRODUCTION 107
FIGURE 41 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER 107
FIGURE 42 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 107
TABLE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 108
TABLE 39 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 108
8.2 CONSUMER ELECTRONICS 109
8.2.1 INCREASING MEMORY REQUIREMENTS IN CONSUMER ELECTRONICS TO FUEL MARKET 109
TABLE 40 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 109
TABLE 41 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 110
TABLE 42 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 110
TABLE 43 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 110
8.3 INDUSTRIAL 111
8.3.1 RISING ADOPTION OF INDUSTRY 4.0 TO DRIVE MARKET 111
TABLE 44 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 111
TABLE 45 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 112
TABLE 46 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 112
TABLE 47 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 112
8.4 TELECOMMUNICATIONS 113
8.4.1 GROWING USE CASES OF 5G TECHNOLOGY TO FUEL MARKET 113
TABLE 48 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 113
TABLE 49 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 114
TABLE 50 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 114
TABLE 51 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 114
8.5 AUTOMOTIVE 115
8.5.1 USE OF IC PACKAGING IN ADAS AND AUTONOMOUS DRIVING TO FUEL MARKET 115
TABLE 52 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 115
TABLE 53 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 116
TABLE 54 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 116
TABLE 55 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 116
8.6 MILITARY & AEROSPACE 117
8.6.1 NEED FOR RELIABLE AND SECURE COMMUNICATION TO FUEL MARKET 117
TABLE 56 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 117
TABLE 57 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 118
TABLE 58 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 118
TABLE 59 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 118
8.7 MEDICAL DEVICES 119
8.7.1 CAPABILITY TO INCORPORATE MANY SENSORS INTO SINGLE PACKAGE TO FUEL MARKET DEMAND FOR IC PACKAGING 119
TABLE 60 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 119
TABLE 61 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 120
TABLE 62 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION) 120
TABLE 63 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION) 120
9 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION 121
9.1 INTRODUCTION 122
FIGURE 43 ASIA PACIFIC TO WITNESS HIGHEST CAGR IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD 122
TABLE 64 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION) 122
TABLE 65 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION) 123
9.2 NORTH AMERICA 123
FIGURE 44 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 124
TABLE 66 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 124
TABLE 67 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 125
TABLE 68 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 125
TABLE 69 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 125
FIGURE 45 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE IN NORTH AMERICAN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD 126
9.2.1 US 126
9.2.1.1 US to lead 3D IC and 2.5D IC packaging market in North America 126
TABLE 70 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 127
TABLE 71 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 127
9.2.2 CANADA 127
9.2.2.1 Establishment of Canada’s Semiconductor Council to drive regional market 127
TABLE 72 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 129
TABLE 73 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 129
9.2.3 MEXICO 129
9.2.3.1 Automotive industry in Mexico to fuel market 129
TABLE 74 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 130
TABLE 75 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 130
9.3 EUROPE 131
FIGURE 46 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 132
TABLE 76 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 133
TABLE 77 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 133
TABLE 78 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 133
TABLE 79 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 134
9.3.1 UK 134
9.3.1.1 Increased use of 5G networks to fuel market 134
TABLE 80 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 135
TABLE 81 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 135
9.3.2 GERMANY 135
9.3.2.1 Automotive industry to drive market 135
TABLE 82 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 136
TABLE 83 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 136
9.3.3 FRANCE 137
9.3.3.1 Highly developed transportation and communication networks to drive market 137
TABLE 84 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 137
TABLE 85 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 138
9.3.4 REST OF EUROPE 138
TABLE 86 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 139
TABLE 87 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 139
9.4 ASIA PACIFIC 140
FIGURE 47 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT 141
TABLE 88 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 142
TABLE 89 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 142
TABLE 90 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 142
TABLE 91 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 143
FIGURE 48 MILITARY & AEROSPACE SEGMENT IN ASIA PACIFIC MARKET TO RECORD HIGHEST CAGR DURING FORECAST PERIOD 143
9.4.1 CHINA 144
9.4.1.1 Increased semiconductor manufacturing to drive market 144
TABLE 92 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 144
TABLE 93 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 145
9.4.2 JAPAN 145
9.4.2.1.1 Increased production of consumer electronics and automobiles to drive market 145
TABLE 94 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 146
TABLE 95 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 146
9.4.3 TAIWAN 146
9.4.3.1 Presence of many key OSAT companies to fuel market 146
TABLE 96 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 147
TABLE 97 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 147
9.4.4 SOUTH KOREA 147
9.4.4.1 High manufacturing capacity to drive market 147
TABLE 98 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 148
TABLE 99 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 148
9.4.5 REST OF ASIA PACIFIC 148
TABLE 100 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 149
TABLE 101 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 149
9.5 ROW 150
TABLE 102 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION) 150
TABLE 103 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION) 150
TABLE 104 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 150
TABLE 105 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 151
9.5.1 MIDDLE EAST & AFRICA 151
TABLE 106 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 151
TABLE 107 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 152
9.5.2 SOUTH AMERICA 152
TABLE 108 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION) 152
TABLE 109 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION) 153
10 COMPETITIVE LANDSCAPE 154
10.1 INTRODUCTION 154
10.2 KEY PLAYER STRATEGIES/RIGHT TO WIN 155
TABLE 110 OVERVIEW OF STRATEGIES DEPLOYED BY KEY PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 155
10.2.1 PRODUCT PORTFOLIO 156
10.2.2 REGIONAL FOCUS 156
10.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES 156
10.3 MARKET SHARE ANALYSIS, 2022 156
TABLE 111 3D IC AND 2.5D IC PACKAGING MARKET SHARE ANALYSIS (2022) 157
10.4 REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 158
FIGURE 49 FIVE-YEAR REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 158
10.5 KEY COMPANY EVALUATION QUADRANT, 2022 159
10.5.1 STARS 159
10.5.2 PERVASIVE PLAYERS 159
10.5.3 EMERGING LEADERS 159
10.5.4 PARTICIPANTS 159
FIGURE 50 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): KEY COMPANY EVALUATION QUADRANT, 2022 160
10.6 COMPETITIVE BENCHMARKING 161
10.6.1 COMPANY FOOTPRINT, BY PACKAGING TECHNOLOGY 161
10.6.2 COMPANY FOOTPRINT, BY REGION 161
10.6.3 OVERALL COMPANY FOOTPRINT 162
10.7 STARTUP/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION QUADRANT, 2022 162
TABLE 112 3D IC AND 2.5D IC PACKAGING MARKET: LIST OF KEY STARTUPS/SMES 162
10.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES 163
10.7.1.1 Company footprint, by packaging technology 163
10.7.1.2 Company footprint, by region 163
10.7.2 PROGRESSIVE COMPANIES 163
10.7.3 RESPONSIVE COMPANIES 163
10.7.4 DYNAMIC COMPANIES 163
10.7.5 STARTING BLOCKS 163
FIGURE 51 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): STARTUPS/SMES EVALUATION QUADRANT, 2022 164
10.8 COMPETITIVE SITUATION AND TRENDS 165
10.8.1 PRODUCT LAUNCHES AND DEVELOPMENTS 165
TABLE 113 3D IC AND 2.5D IC PACKAGING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2019–2023 165
10.8.2 DEALS 166
TABLE 114 3D IC AND 2.5D IC PACKAGING MARKET: DEALS, 2019–2023 166
11 COMPANY PROFILES 169
11.1 INTRODUCTION 169
11.2 KEY PLAYERS 170
(Business overview, Products/Services/Solutions offered, Recent Developments, MNM view)*
11.2.1 SAMSUNG 170
TABLE 115 SAMSUNG: BUSINESS OVERVIEW 170
FIGURE 52 SAMSUNG: COMPANY SNAPSHOT 171
11.2.2 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 174
TABLE 116 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: BUSINESS OVERVIEW 174
FIGURE 53 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: COMPANY SNAPSHOT 175
11.2.3 INTEL CORPORATION 178
TABLE 117 INTEL CORPORATION: BUSINESS OVERVIEW 178
FIGURE 54 INTEL CORPORATION: COMPANY SNAPSHOT 179
11.2.4 ASE TECHNOLOGY HOLDING CO., LTD. 181
TABLE 118 ASE TECHNOLOGY HOLDING CO., LTD: BUSINESS OVERVIEW 181
FIGURE 55 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT 182
11.2.5 AMKOR TECHNOLOGY 184
TABLE 119 AMKOR TECHNOLOGY: BUSINESS OVERVIEW 184
FIGURE 56 AMKOR TECHNOLOGY: COMPANY SNAPSHOT 185
11.2.6 BROADCOM 188
TABLE 120 BROADCOM: BUSINESS OVERVIEW 188
FIGURE 57 BROADCOM: COMPANY SNAPSHOT 189
11.2.7 TEXAS INSTRUMENTS INC. 191
TABLE 121 TEXAS INSTRUMENTS INC.: BUSINESS OVERVIEW 191
FIGURE 58 TEXAS INSTRUMENTS INC.: COMPANY SNAPSHOT 192
11.2.8 UNITED MICROELECTRONICS CORPORATION 194
TABLE 122 UNITED MICROELECTRONICS CORPORATION: BUSINESS OVERVIEW 194
FIGURE 59 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT 195
11.2.9 JCET GROUP CO., LTD. 197
TABLE 123 JCET GROUP CO., LTD.: BUSINESS OVERVIEW 197
FIGURE 60 JCET GROUP CO., LTD.: COMPANY SNAPSHOT 197
11.2.10 POWERTECH TECHNOLOGY INC. 200
TABLE 124 POWERTECH TECHNOLOGY INC.: BUSINESS OVERVIEW 200
FIGURE 61 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT 201
*Details on Business overview, Products/Services/Solutions offered, Recent Developments, MNM view might not be captured in case of unlisted companies.
11.3 OTHER PLAYERS 203
11.3.1 CADENCE DESIGN SYSTEMS, INC. 203
11.3.2 SILICONWARE PRECISION INDUSTRIES CO., LTD. 204
11.3.3 ADVANCED MICRO DEVICES, INC. 205
11.3.4 TEZZARON 206
11.3.5 TELEDYNE TECHNOLOGIES INCORPORATED 207
11.3.6 FUJITSU 208
11.3.7 XPERI INC. 209
11.3.8 MONOLITHIC 3D INC. 210
11.3.9 DECA TECHNOLOGIES 211
11.3.10 3M 212
11.3.11 GLOBALFOUNDRIES INC. 213
11.3.12 NHANCED SEMICONDUCTORS 214
11.3.13 MOLDEX3D 215
11.3.14 CEREBRAS 216
11.3.15 AYAR LABS, INC. 217
12 APPENDIX 218
12.1 DISCUSSION GUIDE 218
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 221
12.3 CUSTOMIZATION OPTIONS 223
12.4 RELATED REPORTS 223
12.5 AUTHOR DETAILS 224


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