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반도체 제조 장치 부품용 석영(Quartz) 시장 조사 2024년

조사회사 : TECHCET  출판년월 : 2024년08월

QUARTZ EQUIPMENT COMPONENTS

반도체 제조 장치 부품용 석영 시장 조사 2024년: 중요 재료 리포트 시리즈 2024-2025년
2024-25 TECHCET CRITICAL MATERIALS REPORT™

구성 영문조사보고서
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주문/문의    조사회사/라이센스/납기안내

TECHCET「반도체 제조 장치 부품용 석영 시장 조사 2024년 – QUARTZ EQUIPMENT COMPONENTS」는 반도체 디바이스 제조에 사용되는 석영 유리 부품의 시장과 공급 체인을 조사·분석하고 있습니다.

리포트 내에서 제공되는 시장 데이터와 분석은 TECHCET의 데이터베이스와 수석 애널리스트의 경험, 1차 조사 및 2차 조사 결과 모두가 활용되고 있습니다. 고순도 석영 부품 시장, 원료가 되는 모래/분말로부터의 공급 체인, 기재도 조사 대상이 되고 있습니다. 공급업체 및 지역별 공급 및 시장 브레이크다운도 실시하고 있습니다.

또한 반도체 웨이퍼 투입수의 증가와 장치 시스템의 예측, 기술 개발, 지역의 동향을 바탕으로 한 예측 결과도 제공하고 있습니다.

반도체 제조 장치 부품용 석영(Quartz) 시장 조사 2024년
QUARTZ EQUIPMENT COMPONENTS

이 보고서의 주요 특징

  • 석영 기재 및 석영 부품을 포함한 석영 제품 시장에 주목.
  • 기술 동향 분석 및 고순도 모래, 기재 제조사, 석영 제조업자의 상세 정보를 게재.
  • 업계 동향을 파악하고 수요와 공급의 현상으로 업계가 직면하고 있는 단점과 문제를 명확히 한다.
  • 구매 및 업계 품질 개선과 같은 기업 의사 결정에 도움이 되는 정보를 게시합니다.
  • 공급망 관리자, 프로세스 통합, 연구개발(R&D) 임원에 대한 정보 제공. 사업 전개와 재정에 관한 분석도 게재
  • 주요 공급업체 정보, 전자기기 제품 재료 공급망 문제/동향, 공급업체 시장 점유율 전망, 전자기기 재료 시장 예측

주요 게재 내용

  • 이그제큐티브 요약
  • 조사 범위, 목표, 방법론
  • 반도체 산업 시장의 현상과 전망
  • 석영 부품 시장 동향
    • 석영 제조 부품 사업 – 시장 개관
    • 가격 동향
    • 석영 제조 부품의 범용 기술 개요
    • EHS 및 무역/물류 문제
    • 석영 제조 부품의 시장 동향에 대한 분석가 평가
  • 2차 재료 공급측의 시황
    • 제조 부품의 시장 점유율: 제조 시장
    • M&A 활동과 제휴 관계
    • 공장 폐쇄 – 없음
    • 신규 진입 기업
    • 계속 위기의 공급업체 또는 부품/생산 라인
    • 석영 공급업체에 대한 TECHCET 분석가 평가
  • 서브티어 공급망: 석영
    • 서브티어 공급망: 공급원 및 시장 개요
    • 서브티어 공급망: 디스럽션
    • 서브티어 공급원의 M&A 또는 제휴 관계
    • 서브티어 공급망: EHS 및 물류 문제(4.5 참조)
    • 서브티어 공급망: 신규 진입 기업 – 없음
    • 서브티어 공급망: 공장 업데이트
    • 서브티어 공급망: 공장 폐쇄 – 보고 없음
    • 서브티어 공급망: 가격 동향
    • 서브티어 공급망: TECHCET 애널리스트 평가
  • 공급업체 기업 정보(패브리케이터)
    • APPLIED CERAMICS, INC
    • BEIJING KAIDE QUARTZ CO., LTD
    • DONGHAI HONGWEI QUARTZ PRODUCTS CO., LTD.
    • DS TECHNO CO., LTD.
    • FERROTEC HOLDINGS CORPORATION 등 20개사 이상/li>
  • 부록
    • 기술 동향/기술적 촉진 요인

Description

This report covers the market and supply-chain for Quartz Fabricated Parts used in semiconductor device fabrication, and the supporting supply chain. The report contains data and analysis from TECHCET’s data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. Topics include High Purity Fabricated Quartz Parts market, supply chain from raw sand/powder, and base materials. Effort has been made to provide breakdown of the supply and market by supplier as well as region. Forecasts are based on semiconductor wafer starts growth and equipment systems forecast as well as technology developments and regional dynamics.

      • Primarily focuses on the electronics/semiconductor related markets of quartz products, including quartz base materials and quartz components
      • Technological trend analysis, details on the supply-chain from high purity sand, base material manufacturers, and quartz fabricators are provided
      • Identifies trends of the electronics quartz industry, supply and demand highlights, and any shortcomings or issues faced by the industry
      • Provides guidance for business decisions relating to purchasing and industry quality improvement decisions
      • Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
      • Covers information about key suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments

ANALYST BIOGRAPHY

Danny Elzer – Sr. Technology Analyst

      • Responsible for Specialty Gases and Chemicals, Precursors, Mechanical Components and Assemblies, Ceramics, Quarts and related technologies.
      • Over 33 years experience in the semiconductor and specialty gases industries.
      • Previously Director at Entegris where he developed new applications and expanded the market for electrostatic chucks and specialty gas products. R&D and engineering management, business development, sales.
      • Experience in all wafer fab processes, Device engineering, Analytical lab, Metrology while at Motorola and Micron in fab-centric engineering and management roles.
      • BSEE from Rochester Institute of Technology and an MBA in technology Management from the University of Phoenix

Table of Contents

1 EXECUTIVE SUMMARY 11

1.1 QUARTZ FABRICATED PARTS BUSINESS – MARKET OVERVIEW 12
1.1.1 QUARTZ FABRICATED PARTS BUSINESS – MARKET STRUCTURAL OVERVIEW 13
1.2 MARKET TRENDS IMPACTING 2024 OUTLOOK 15
1.3 QUARTZ FABRICATED PARTS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT 16
1.4 QUARTZ FABRICATED PARTS SEGMENT TRENDS 17
1.5 TECHNOLOGY TRENDS – QUARTZ FABRICATED PARTS 18
1.6 COMPETITIVE LANDSCAPE – QUARTZ FABRICATED PARTS 19
1.7 FIRST QUARTER 2024 FINANCIALS OF TOP-4 SUPPLIERS 20
1.8 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS – QUARTZ FABRICATED PARTS 21
1.9 ANALYST ASSESSMENT OF QUARTZ FABRICATED PARTS 22

2 SCOPE, PURPOSE AND METHODOLOGY 23

2.1 SCOPE 24
2.2 PURPOSE & METHODOLOGY 25
2.3 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS 26

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK 23

3.1 WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK 28
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 30
3.1.2 SEMICONDUCTOR SALES GROWTH 31
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS 32
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 33
3.2.1 ELECTRONICS OUTLOOK 34
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK 35
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 36
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 37
3.2.3 SMARTPHONE OUTLOOK 38
3.2.4 PC OUTLOOK 39
3.2.5 SERVERS / IT MARKET 40
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 41
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS 42
3.3.2 NEW FABS IN THE US 43
3.3.3 WW FAB EXPANSION DRIVING GROWTH 44
3.3.4 EQUIPMENT SPENDING TRENDS 45
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS 46
3.3.5.1 DRAM TECHNOLOGY ROADMAPS 47
3.3.5.2 3D NAND TECHNOLOGY ROADMAPS 48
3.3.6 FAB INVESTMENT ASSESSMENT 49
3.4 POLICY & TRADE TRENDS AND IMPACT 50
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 51
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028 52
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028 53

4 QUARTZ PARTS MARKET TRENDS 54

4.1 QUARTZ FABRICATED PARTS BUSINESS – MARKET OVERVIEW 55
4.1.1 2023 QUARTZ FABRICATED PARTS MARKET LEADING INTO 2024 56
4.1.2 QUARTZ FABRICATED PARTS MARKET OUTLOOK 57
4.1.3 QUARTZ FABRICATED PARTS 5-YEAR REVENUE FORECAST BY SEGMENT 58
4.1.4 QUARTZ FABRICATED PARTS PRODUCTION CAPACITY OF TOP SUPPLIERS 59
4.1.5 QUARTZ FABRICATED PARTS PRODUCTION BY REGION 60
4.1.6 QUARTZ FABRICATED PARTS PRODUCTION CAPACITY EXPANSIONS 61
4.1.7 INVESTMENT ANNOUNCEMENTS OVERVIEW 62
4.1.8 QUARTZ FABRICATED PARTS SUPPLY VS. DEMAND BALANCE – OVERVIEW 63
4.1.8.1 SUPPLY VS. DEMAND BALANCE – QUARTZ FABRICATED PARTS 64
4.2 PRICING TRENDS 65
4.3 QUARTZ FABRICATED PARTS GENERAL TECHNOLOGY OVERVIEW 66
4.3.1 QUARTZ FABRICATED PARTS GENERAL TECHNOLOGY OVERVIEW 67
4.3.2 QUARTZ FABRICATED PARTS APPLICATIONS 68
4.3.3 QUARTZ FABRICATED PARTS GENERAL DESCRIPTION 69
4.3.4 QUARTZ FABRICATED PARTS – WAFER SIZE AND EFFECT ON QUARTZ REQUIREMENTS 71
4.3.5 QUARTZ FABRICATED PARTS TECHNOLOGY TRENDS 72
4.4 REGIONAL CONSIDERATIONS – QUARTZ FABRICATED PARTS 73
4.4.1 REGIONAL ASPECTS AND DRIVERS 74
4.5 EHS AND TRADE/LOGISTIC ISSUES 76
4.5.1 RUSSIA INVASION OF UKRAINE 77
4.5.2 YEMEN’S HOUTHI ATTACKS IN THE RED SEA AND GULF OF ADEN DISRUPT GLOBAL SHIPPING 78
4.5.3 NEW MIDDLE EAST CONFLICT COULD DISRUPT GLOBAL TECH SUPPLY CHAIN AND INTEL’S EXPANSION PLANS 79
4.5.4 PANAMA CANAL HISTORIC DROUGHT 80
4.5.5 EHS ISSUES – ENVIRONMENTAL IMPACT 81
4.5.6 TRADE/LOGISTICS ISSUES 82
4.6 ANALYST ASSESSMENT OF QUARTZ FABRICATED PARTS MARKET TRENDS 83

5 SUPPLY-SIDE MARKET LANDSCAPE 84

5.1 QUARTZ FABRICATED PARTS MARKET SHARE – FABRICATION MARKET 85
5.1.1 QUARTZ FABRICATED PARTS MARKET SHARE – COLD FABRICATION (MACHINING) 86
5.1.2 QUARTZ FABRICATED PARTS MARKET SHARE – HOT FABRICATION (FUSED) 87
5.1.3 CURRENT QUARTER – SUPPLIERS’ ACTIVITIES & REPORTED REVENUES – QUARTZ 88
5.1.4 FIRST QUARTER 2024 FINANCIALS OF TOP-4 SUPPLIERS 89
5.1.5 CURRENT QUARTER ACTIVITY – SHIN-ETSU 90
5.1.6 CURRENT QUARTER ACTIVITY – TOSOH QUARTZ 91
5.1.7 CURRENT QUARTER ACTIVITY – FERROTEC 92
5.1.8 CURRENT QUARTER ACTIVITY – WONIK 93
5.1.9 CURRENT ACTIVITY – HERAEUS 94
5.2 M&A ACTIVITY AND PARTNERSHIPS 95
5.3 PLANT CLOSURES – NONE 96
5.4 NEW ENTRANTS 97
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS 98
5.6 TECHCET ANALYST ASSESSMENT OF QUARTZ SUPPLIERS 99

6 SUB-TIER SUPPLY-CHAIN, QUARTZ 100

6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW 101
6.1.1 QUARTZ SUB-TIER SUPPLY-CHAIN MARKET BACKGROUND 102
6.1.2 QUARTZ SUB-TIER SUPPLY-CHAIN MARKET TRENDS 103
6.1.3 QUARTZ BASE MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT 105
6.1.4 SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS MARKET SHARE 106
6.1.5 SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS – TUBES AND RODS MARKET SHARE 107
6.1.6 SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS – INGOTS AND BOULES MARKET SHARE 108
6.1.7 SUB-TIER SUPPLY CHAIN: QUARTZ BASE MATERIALS – SAND/POWDER MARKET SHARE 109
6.1.8 SEMICONDUCTOR-GRADE QUARTZ SUB-TIER SUPPLIER NEWS 110
6.2 SUB-TIER SUPPLY-CHAIN – DISRUPTIONS 111
6.3 SUB-TIER SUPPLY-CHAIN M&A OR PARTNERSHIP ACTIVITY 112
6.4 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES – SEE SECTION 4.5 113
6.5 SUB-TIER SUPPLY-CHAIN “NEW” ENTRANTS – NONE 114
6.6 SUB-TIER SUPPLY-CHAIN PLANT UPDATES 115
6.7 SUB-TIER SUPPLY-CHAIN PLANT CLOSURES – NONE REPORTED 116
6.8 SUB-TIER SUPPLY-CHAIN PRICING TRENDS 117
6.9 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 118

7 SUPPLIER PROFILES (FABRICATORS) 119

APPLIED CERAMICS, INC.
BEIJING KAIDE QUARTZ CO., LTD
DONGHAI HONGWEI QUARTZ PRODUCTS CO., LTD.
DS TECHNO CO., LTD.
FERROTEC HOLDINGS CORPORATION
…AND 20+ MORE

8 APPENDIX 209

8.1 TECHNOLOGY TRENDS/TECHNICAL DRIVERS – OUTLINE 210
8.1.1 QUARTZ GENERAL TECHNOLOGY OVERVIEW & TECHNOLOGY TRENDS 211
8.1.2 CUSTOMER DRIVEN TECHNOLOGIES 212
8.1.3 NAND ROADMAPS AND CHALLENGES – 3D NAND LEVELS W/ STACKS/TIERS 213
8.1.4 3D NAND PROCESS ADVANCES REQUIRED 214
8.1.5 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILE FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE 215
8.1.6 ADVANCED LOGIC ROADMAPS AND CHALLENGES – LOGIC TRANSISTOR EST. ROADMAP 216
8.1.7 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE 217
8.1.7.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC’S GAA FETS VS. INTEL’S RIBBONFET 218
8.1.8 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES 219
8.1.9 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY 221
8.1.9.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY – DSA 222
8.1.9.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING 224
8.1.9.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION 225
8.1.10 CFET ARCHITECTURE: CFET SCALING ADVANTAGE 226
8.1.10.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS) 227
8.1.10.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS 230
8.1.11 INORGANIC EUV RESIST – SPIN ON DEPOSITION 232
8.1.11.1 INORGANIC EUV RESIST – ALD DEPOSITED 233
8.1.12 SELF ALIGNED MULTI PATTERNING – SADP 234
8.1.12.1 SELF ALIGNED MULTI PATTERNING – SAQP 235
8.1.12.2 SELF ALIGNED MULTI PATTERNING – PEALD EQUIPMENT 236
8.1.12.3 SELF ALIGNED MULTI PATTERNING – CAN SAQP BYPASS EUV BEYOND 7 NM? 237
8.1.13 EUV, MULTI PATTERNING AND GEOPOLITICS 238
8.1.14 AREA SELECTIVE DEPOSITION (ASD) 239
8.1.14.1 AREA SELECTIVE DEPOSITION (ASD) – TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 240
8.1.15 SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS 241

FIGURES

FIGURE 1.1: QUARTZ FABRICATED PARTS REVENUE FORECAST BY SEGMENT 16
FIGURE 1.2: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE 19
FIGURE 1.3: TOP-4 QUARTZ MAKERS’ QUARTERLY COMBINED SALES (US$M) 20
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023) 30
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES 31
FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSII) IN 000’S OF NTD 32
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS 33
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS) 35
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION 36
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION 37
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES 38
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST 39
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND 41
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028 42
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US 43
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD 44
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE 45
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW 46
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW 47
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW 48
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024 49
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS 52
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD) 53
FIGURE 4.1: QUARTZ FABRICATED PARTS REVENUE FORECAST BY SEGMENT 58
FIGURE 4.2: FABRICATED QUARTZ COMPONENTS MARKET SHARE % BY SUPPLIER 59
FIGURE 4.3: 2023 FABRICATED QUARTZ COMPONENTS BY REGION 60
FIGURE 4.4: QUARTZ FABRICATED PARTS CAPACITY/DEMAND FORECAST 64
FIGURE 4.5: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS 68
FIGURE 4.6: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS 69
FIGURE 4.7: QUARTZ PRODUCTS FOR DRY ETCH APPLICATIONS 70
FIGURE 4.8: QUARTZ PRODUCTS FOR EPI APPLICATIONS 70
FIGURE 4.9: 2023 QUARTZ FABRICATED PARTS REVENUE SHARE BY REGION 73
FIGURE 4.10: ASSESSED CONTROL OF TERRAIN AROUND DONETSK 77
FIGURE 4.11: YEMEN’S HOUTHI ATTACKS DISRUPTING GLOBAL SHIPPING 78
FIGURE 4.12: MIDDLE EAST CONFLICT 79
FIGURE 4.13: PANAMA CANAL SHIPPING 80
FIGURE 4.14: GREENHOUSE GAS PROTOCOL, DETAILED CATEGORIES 81
FIGURE 4.15: SCOPE 3 EMISSIONS FOR SEMICONDUCTOR COMPANIES 81
FIGURE 5.1: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE (HOT & COLD) 85
FIGURE 5.2: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE 86
FIGURE 5.3: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE 87
FIGURE 5.4: TOP-4 QUARTZ MAKERS’ QUARTERLY COMBINED SALES (US$M) 89
FIGURE 5.5: TOSS CORP 2024 FINANCIALS 91
FIGURE 5.6: WONIK CURRENT QUARTER FINANCIALS 93
FIGURE 5.7: #2 HERAEUS CONSOLIDATED 2023 FINANCIALS 94
FIGURE 6.1: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS 101
FIGURE 6.2: QUARTZ BASE MATERIALS REVENUE FORECAST BY SEGMENT 105
FIGURE 6.3: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- BASE MATERIAL 106
FIGURE 6.4: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- TUBES AND RODS 107
FIGURE 6.5: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- INGOT/BOULE 108
FIGURE 6.6: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- 2023 QUARTZ POWDER 109
FIGURE 8.1: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES 212
FIGURE 8.2: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME 213
FIGURE 8.3: 3D NAND PROGRESSION 214
FIGURE 8.4: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS 215
FIGURE 8.5: GATE STRUCTURE ROADMAP 216
FIGURE 8.6: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP 217
FIGURE 8.7: RIBBON FET 218
FIGURE 8.8: MONO LAYER NANO SHEETS CHANNELS 220
FIGURE 8.9: NANO IMPRINT LITHOGRAPHY PROCESS FLOW 221
FIGURE 8.10: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY 221
FIGURE 8.11: DIRECTED SELF-ASSEMBLY 222
FIGURE 8.12: DSA PATENT FILING BY COMPANY 223
FIGURE 8.13: DSA PATEN FILING SINCE 2023 223
FIGURE 8.14: WHAT IS PATTERN SHAPING? 224
FIGURE 8.15: REFINING EUV PATTERNING BY APPLIED MATERIALS 225
FIGURE 8.16: COMPLEMENTARY FET (CFET) 226
FIGURE 8.17: CFET IMPROVES PERFORMANCE IN TRACK SCALING 226
FIGURE 8.18: MONOLITHIC CFET PROCESS FLOW EXAMPLE 227
FIGURE 8.19: MCFET NEW FEATURE- MIDDLE DIELECTRIC ISOLATION 227
FIGURE 8.20: LOW TEMPERATURE GATE STACK OPTION EXAMPLES 228
FIGURE 8.21: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES 228
FIGURE 8.22: BSPDN ADVANTAGE- IR DROP REDUCTION 229
FIGURE 8.23: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET 230
FIGURE 8.24: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS 231
FIGURE 8.25: INPRIA EUV MOR 232
FIGURE 8.26: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD STACKS OF PHOTO RESIST 232
FIGURE 8.27: PATENT FILING FOR MLD DEPOSITED EUV RESIST SEARCH PERFORMED IN PATBASE 233
FIGURE 8.28: SADP PROCESS FLOW USING ALD SPACER 234
FIGURE 8.29: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW 235
FIGURE 8.30: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 240
FIGURE 8.31: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS INTEGRATIONS (APPLIED MATERIALS) 241

TABLES
TABLE 1.1: BREAKOUT OF FABRICATED QUARTZ MARKET BY HOT AND COLD FABRICATION 12
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES 28
TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS 36
TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023 40
TABLE 4.1: BREAKOUT OF FABRICATED QUARTZ MARKET BY HOT AND COLD FABRICATION 55
TABLE 4.2: ESTIMATED FABRICATED QUARTZ COMPONENTS SHARE BY SUPPLIER 59
TABLE 4.3: QUARTZ FABRICATED PARTS SUPPLIER MANUFACTURING LOCATIONS 60
TABLE 4.4: OVERVIEW OF ANNOUNCED 2023/2024 QUARTZ FABRICATED PARTS SUPPLIER INVESTMENTS 62
TABLE 4.5: COMPARISON OF TUBES AND BOATS ATTRIBUTES FOR 200MM AND 300MM PROCESSES 71
TABLE 4.6: REGIONA L QUARTZ MARKET ATTRIBUTES AND EXPANSION ACTIVITY, (1 OF 2) 74
TABLE 4.7: REGIONAL QUARTZ MARKET ATTRIBUTES AND EXPANSION ACTIVITY, (2 OF 2) 75
TABLE 5.1: MOST RECENT QUARTERLY QUARTZ SUPPLIER SALES (IN US$M) 88
TABLE 5.2: SHIN-ETSU CURRENT QUARTER FINANCIALS (ANNUAL RESULTS) 90
TABLE 5.3: FERROTEC YOY FINANCIALS 92
TABLE 5.4: FERROTEC ANNUAL (ENDING 3/2024) FINANCIALS 92
TABLE 8.1: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL) 218
TABLE 8.2: MULTIPATTERNING AT 7NM BY TSMC 237
TABLE 8.3: SELECTIVE DEPOSITION – SELECTIVELY DEPOSITED MATERIALS 239


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