CMP Consumables – Slurry And Pad Markets
CMP 소모품 : 슬러리 및 패드 시장 공급망 및 시장 분석 2025-2026년 – 중요 재료 보고서 시리즈
2025-2026 CMR™ CMP CONSUMABLES – SLURRY AND PAD MARKETS: SUPPLY-CHAIN & MARKET ANALYSIS – A CRITICAL MATERIALS REPORT™
| 조사회사 | TECHCET |
| 출판년월 | 2025년5월 |
| 페이지 수 | 123 |
| 도표 수 | 76 |
| 가격（사이트 라이센스） | USD 8,900 |
| 구성 | 영문조사보고서 |
※ページ数にChapter 7（Supplier Profiles）は含まれていません。
TECHCET 「CMP 소모품：슬러리와 패드 시장 2025-2026년 – CMP CONSUMABLES – SLURRY and PAD MARKETS」는 반도체 디바이스 제조용 CMP에 소모품으로서 사용되고 있는 슬러리와 패드를 대상으로 시장 동향이나 공급 체인 등을 분석·해설하고 있습니다.
이 보고서의 특징
- 반도체 제조용 CMP 패드 및 슬러리 시장 정보를 게시합니다.
- 서플라이 체인 매니저, 생산 통합, R&D 관리자, 비즈니스 개발, 재무 관련 정보 제공
- 반도체 장치 제조에 사용되는 CMP 패드, 슬러리, 디스크와 관련된 공급망, 시장 및 기술 동향에 대한 정보를 제공합니다.
- 주요 CMP 패드 및 CMP 슬러리 공급업체, 전자재료 공급망의 과제/동향, 공급업체 시장 점유율 전망, 전자기기용 재료 시장 예측도 게재.
주요 게재 내용
- 이그제큐티브 요약
- 조사 범위, 목표, 방법론
- 반도체 산업의 시장 상황과 전망
- 세계 경제와 전망
- 전자 제품 세그먼트별 칩 판매
- 반도체 제조 성장 및 확대
- 정책 및 무역 동향 및 영향
- 반도체 재료 개요
- CMP 슬러리 및 소모품 시장 동향
- CMP 패드 및 슬러리 시장
- 기술의 시장 촉진 요인/재료 변화 및 전환 – 첨단 로직과 메모리
- 첨단 패키징의 기술적 동향
- 화합물 반도체의 기술적 동향
- 새 재료의 EHS 문제
- 무역/물류 문제
- 애널리스트의 CMP 슬러리 및 패드 시장 동향 평가
- CMP 슬러리 공급자 시장 세력도
- CMP 슬러리 용도별 수량의 5년 예측
- CMP 슬러리의 지역별 수량 예측
- CMP 슬러리 용도별 수익 5년 예측
- 지역별 CMP 슬러리 시장 점유율
- 공급업체별 CMP 슬러리 시장 점유율 총
- 최근 분기 공급업체 활동 및 수익(보고 기준)
- M&A 활동과 제휴 관계
- 공장 폐쇄 – 확인할 수 없음
- 신규 진입 기업 – 확인할 수 없음
- 존속 위기에 처한 공급업체 또는 부품/생산 라인
- CMP 슬러리 가격 동향
- TECHCET 분석가의 CMP 슬러리 시장 평가
- CMP 패드 공급 업체의 시장 세력 다이어그램
- CMP 패드 용도별 수량의 5년 예측
- CMP 패드의 지역별 수량 예측
- CMP 패드 용도별 수익 5년 예측
- CMP 패드의 웨이퍼 크기별 수익 5년 예측
- 공급업체별 CMP 패드 시장 점유율 총
- 신규 진입 기업
- CMP 패드 물류 문제, M&A 활동, 공지, 제휴 관계
- CMP 패드 가격 동향
- TECHCET 분석가의 CMP 패드 시장 평가
- 재료의 하위층 공급
- 공급업체 정보
Description
This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET’s data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging.
- Contains information on the semiconductor related CMP Pads & Slurry market dynamics
- Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
- Includes supply-chain, market, and technical trends information relating to CMP pads, slurry, and disks as used for semiconductor device manufacturing.
- Covers information about key CMP Pads & Slurry suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
- Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst
Analyst
James Schlueter – TECHCET Senior Market Analyst for CMP.
- Mr. Schlueter entered the semiconductor industry in 1985 and has worked in a wide variety of technical and technical leadership roles over 36 years, including an IC manufacturer, OEM’s for PVD, ion implant, and CMP, a semiconductor industry consortium, a nanomaterials startup, and a CMP slurry developer/manufacturer.
- After a thin film process engineering positions in a Sperry Corp. fab, development of a PVD sputtering tool at Eaton Corp., and technically leading an advanced step coverage
- PVD projects at SEMATECH, Mr. Schlueter was promoted to Project Leader for PVD and then CMP, followed by Program Manager for CMP at SEMATECH. He subsequently became the CMP Process Development Manager for SpeedFam/SpeedFamIPEC/Novellus. After serving as CTO/COO at nanomaterials startup SDCMaterials, he
became Technical Manager and Director of CMP Slurry Development at DuPont/AirProducts/Versum Materials/EMD, where he and his teams developed a number of commercially successful CMP slurry products. - Mr. Schlueter semi-retired in 2022 and started EbeneWafer Consulting, LLC, which provides technical and marketing consulting services for CMP.
- Mr. Schlueter holds two bachelor of science degrees from South Dakota State University.
TABLE OF CONTENTS
1 EXECUTIVE SUMMARY
1.1 CMP PAD AND SLURRY MARKET OVERVIEW
1.2 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY CONSUMABLE SEGMENT
1.3 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY APPLICATION
1.4 CMP SLURRY VOLUME AND PAD UNIT USAGE FORECAST BY REGION
1.5 5-YEAR CMP SLURRY REVENUE FORECAST BY APPLICATION
1.6 5-YEAR CMP PAD REVENUE FORECAST BY APPLICATION
1.7 TOTAL CMP SLURRY MARKET SHARE BY SUPPLIER
1.8 TOTAL CMP PAD MARKET SHARE BY SUPPLIER
1.9 ADVANCED LOGIC TRANSISTOR TECHNOLOGY ROADMAP
1.10 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
1.11 ANALYST ASSESSMENT OF CMP SLURRY AND PADS
2 SCOPE, PURPOSE AND METHODOLOGY
2.1 SCOPE
2.2 PURPOSE
2.3 METHODOLOGY
2.4 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS
3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK
3.1 WORLDWIDE ECONOMY AND OUTLOOK
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
3.1.2 SEMICONDUCTOR SALES GROWTH
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
3.2.1 FACTORS IMPACTING ELECTRONIC SYSTEMS OUTLOOK
3.2.2 PC OUTLOOK
3.2.3 SMARTPHONE OUTLOOK
3.2.4 AUTOMOTIVE INDUSTRY OUTLOOK
3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
3.3.2 PUBLIC FUNDS STIMULATING PRIVATE INVESTMENTS IN EXPANSION ACROSS THE GLOBE
3.3.3 SEMICONDUCTOR SUPPLY CHAIN ANNOUNCED EXPANSIONS IN THE US
3.3.4 EQUIPMENT SPENDING TRENDS
3.3.5 TECHNOLOGY ROADMAPS
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2029
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028
4 CMP SLURRY & PAD CONSUMABLES MARKET TRENDS
4.1 OVERALL CMP PAD AND SLURRY MARKET
4.1.1 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY CONSUMABLE SEGMENT
4.1.2 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY APPLICATION
4.1.3 2024 REGIONAL CMP SLURRIES AND PADS MARKET
4.1.4 REGIONAL CMP SLURRY AND PAD MARKET OUTLOOK
4.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS – ADVANCED LOGIC AND MEMORY
4.2.1 ADVANCED LOGIC TRANSISTOR TECHNOLOGY ROADMAP
4.2.2 NEW ADVANCED LOGIC TECHNOLOGY TRENDS –GAA + BACKSIDE POWER DELIVERY (BPD)
4.2.3 NEW ADVANCED LOGIC TECHNOLOGY TRENDS – BACKSIDE POWER DELIVERY (BPD)
4.2.4 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS
4.2.5 TECHNICAL DRIVERS / 3D NAND STACKING
4.2.6 TECHNICAL DRIVERS / 3D NAND STACKING
4.3 TECHNICAL TRENDS IN ADVANCED PACKAGING
4.3.1 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.2 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.3 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.4 MARKET GROWTH TRENDS IN ADVANCED PACKAGING
4.4 TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR
4.5 EHS ISSUES FOR NEW MATERIALS
4.5.1 EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM
4.6 TRADE/LOGISTICS ISSUES
4.7 ANALYST ASSESSMENT OF CMP SLURRY AND PAD MARKET TRENDS
5 CMP SLURRY SUPPLY-SIDE MARKET LANDSCAPE
5.1 5-YEAR CMP SLURRY VOLUME USAGE FORECAST BY APPLICATION
5.2 CMP SLURRY VOLUME USAGE FORECAST BY REGION
5.3 5-YEAR CMP SLURRY REVENUE FORECAST BY APPLICATION
5.4 REGIONAL CMP SLURRY MARKET SHARE
5.5 TOTAL CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.1 LEADING CMP SLURRY MARKET SHARE SUPPLIERS BY REVENUE
5.5.2 OXIDE (CERIA) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.3 HKMG (METAL AND OXIDE) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.4 POLYSILICON CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.5 OXIDE (SILICA) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.6 TUNGSTEN CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.7 CU BULK CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.8 CU BARRIER CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.9 NEW METALS (CO, MO, RU, ETC.) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.10 CU BACKSIDE POWER (BPD) CMP SLURRY MARKET SHARE BY SUPPLIER
5.6 CURRENT QUARTER – SUPPLIERS’ ACTIVITIES & REPORTED REVENUES
5.7 M&A ACTIVITY AND PARTNERSHIPS
5.8 PLANT CLOSURES – NONE IDENTIFIED
5.9 NEW ENTRANTS – NONE IDENTIFIED
5.10 SUPPLIERS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.11 CMP SLURRY PRICING TRENDS
5.12 TECHCET ANALYST ASSESSMENT OF CMP SLURRY SUPPLIERS
6 CMP PAD SUPPLY-SIDE MARKET LANDSCAPE
6.1 5-YEAR CMP PAD UNIT USAGE FORECAST BY APPLICATION
6.2 CMP PAD UNIT USAGE FORECAST BY REGION
6.3 5-YEAR CMP PAD REVENUE FORECAST BY APPLICATION
6.4 5-YEAR CMP PAD REVENUE FORECAST BY WAFER SIZE
6.5 TOTAL CMP PAD MARKET SHARE BY SUPPLIER
6.6 NEW ENTRANTS
6.7 CMP PAD LOGISTICS ISSUES, M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
6.8 CMP PAD PRICING TRENDS
6.9 PAD SUPPLIER TECHCET ANALYST ASSESSMENT
7 MATERIAL SUB-TIER SUPPLY – ABRASIVES
7.1 CMP PAD PRICING TRENDS
7.2 VERTICALLY INTEGRATED SLURRY SUPPLIERS
7.3 RAW SUPPLY-CHAIN DISRUPTORS
7.4 RAW MATERIALS M&A ACTIVITY
7.5 ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
7.6 ABRASIVE SUPPLY-CHAIN “NEW” ENTRANTS OR PLANT CLOSURES
7.7 ABRASIVE SUPPLY-CHAIN PRICING TRENDS
7.8 SUB-TIER SUPPLY CHAIN: SLURRY ABRASIVE SUPPLY NOTABLES
7.9 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT
8 SUPPLIER PROFILES
ACE NANOCHEM
ANJI MICRO SHANGHAI
ASAHI GLASS
BASF
DONGJIN SEMICHEM
AND MORE…
FIGURES
FIGURE 1.1: FORECASTED 2025 MARKET SIZE
FIGURE 1.2: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 1.3: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 1.4: 2025 SLURRY VOLUME AND PAD UNIT USAGE FORECAST BY REGION
FIGURE 1.5: 2023 – 2029 SLURRY REVENUE FORECAST BY APPLICATION
FIGURE 1.6: 2023 – 2029 PAD REVENUE FORECAST BY APPLICATION
FIGURE 1.7: 2024 TOTAL CMP SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 1.8: 2024 TOTAL CMP PAD SUPPLIER MARKET SHARE BY REVENUE
FIGURE3.1: HISTORICAL AND FORECASTED GDP GROWTH
FIGURE 3.2: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2024)
FIGURE 3.3: WORLDWIDE SEMICONDUCTOR SALES ($B)
FIGURE 3.4: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) MOMENTUM TRACKER
FIGURE 3.5: 2024 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.6: SMARTPHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.7: GLOBAL LIGHT VEHICLE PRODUCTION FORECAST
FIGURE 3.8: US EV RETAIL SHARE FORECAST
FIGURE 3.9: AUTOMOTIVE SEMICONDUCTOR CONTENT BY DEVICE TYPE
FIGURE 3.10: AI INFRASTRUCTURE VALUE FORECAST
FIGURE 3.11: SCALE OF TODAY’S AI-CENTRIC DATA CENTERS
FIGURE 3.12: TSMC PHOENIX FAB INVESTMENT TO EXCEED US $65B
FIGURE 3.13: ESTIMATED GLOBAL FAB INVESTMENT 2024-2029
FIGURE 3.14: ANNOUNCED PUBLIC STIMULUS AND RESPECTIVE SEMICONDUCTOR CHIP MANUFACTURING REGIONS
FIGURE 3.15: SEMICONDUCTOR SUPPLY CHAIN EXPANSIONS WITHIN THE US ANNOUNCED MAY 2020 – AUGUST 2024
FIGURE 3.16: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M)
FIGURE 3.17: TECHCET WAFER START FORECAST BY NODE SEGMENTS MILLIONS OF 200MM EQUIVALENTS PER YEAR
FIGURE 3.18: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: FORECASTED 2025 MARKET SIZE
FIGURE 4.2: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 4.3: CMP SLURRY AND PAD REVENUE FORECAST BY APPLICATION
FIGURE 4.4: SLURRY AND PAD REVENUE BY HQ REGION
FIGURE 4.5 CMP STEPS FOR ADVANCED NODES
FIGURE 4.6: BENEFITS OF GAA + BACKSIDE POWER DELIVERY
FIGURE 4.7: EXAMPLES OF VARYING BACKSIDE POWER IMPLEMENTATION SCHEMES
FIGURE 4.8: BACKSIDE POWER IMPLEMENTATION
FIGURE 4.9: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
FIGURE 4.10: 3D NAND CROSS-SECTION
FIGURE 4.11: NUMBER OF CMP STEPS FOR MEMORY TECHNOLOGY NODES
FIGURE 4.12: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 4.13: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 4.14: ADVANCED PACKAGING WAFER BONDING HISTORY
FIGURE 4.15: HYBRID BONDING FLOW PROGRESSION
FIGURE 4.16: CMP OPPORTUNITIES DIE WAFER (D2W) AND WAFER TO WAFER (W2W) HYBRID BONDING
FIGURE 4.17: GROWTH IN ADVANCED PACKAGING
FIGURE 4.18: SILICON CARBIDE WAFER USAGE BY SIZE AND YEAR
FIGURE 5.1: 2023 – 2029 SLURRY VOLUME FORECAST BY APPLICATION
FIGURE 5.2: 2025 SLURRY VOLUME USAGE FORECAST BY REGION
FIGURE 5.3: 2023 – 2029 SLURRY REVENUE FORECAST BY APPLICATION
FIGURE 5.4: 2024 SUPPLIER MARKET SHARE BY HQ REGION
FIGURE 5.5: 2024 TOTAL CMP SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.6: 2024 OXIDE (CERIA) SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.7: 2024 HKMG SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.8: 2024 POLYSILICON SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.9: 2024 OXIDE (SILICA) SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.10: 2024 TUNGSTEN SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.11: 2024 CU BULK SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.12: 2024 CU BARRIER SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.13: 2024 NEW METALS SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.14: 2024 CU BACKSIDE POWER SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 6.1: 2023 – 2029 PAD USAGE FORECAST BY APPLICATION
FIGURE 6.2: 2025 PAD UNIT USAGE FORECAST BY REGION
FIGURE 6.3: 2023 – 2029 PAD REVENUE FORECAST BY APPLICATION
FIGURE 6.4: 2023 – 2029 PAD REVENUE FORECAST BY WAFER SIZE
FIGURE 6.5: 2024 TOTAL CMP PAD SUPPLIER MARKET SHARE BY REVENUE
FIGURE 7.2: SLURRY POTENTIAL HAZARDS (SDS)
TABLES
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
TABLE 3.2: INITIALLY ANNOUNCED US RECIPROCAL TARIFF SCHEDULE, BY COUNTRY
TABLE 3.3: WORLDWIDE PC FORECAST BY SEGMENT
TABLE 3.4: IT MARKET SPENDING FORECAST, 2025
TABLE 4.1: REGIONAL CMP SLURRY AND PAD MARKETS
TABLE 4.1 REGIONAL CMP SLURRY AND PAD MARKETS, CONT’D
TABLE 4.2: SILICON CARBIDE WAFER MANUFACTURERS AND CONSUMABLES SUPPLIERS
TABLE 5.1: 2024 SLURRY MARKET LEADERS AND TAM BY APPLICATION
TABLE 5.2: MOST RECENT QUARTERLY SUPPLIER SALES OF TOP CMP SLURRY AND/OR PAD SUPPLIERS (IN LOCAL REPORTING CURRENCY)
TABLE 7.1: ABRASIVE SUPPLIERS
TABLE 7.2: VERTICALLY INTEGRATED SLURRY SUPPLIERS
TABLE 7.3: GENERAL 2024 ABRASIVE SUPPLIER RANKING
보도 자료
[보도 자료 초역]
CMP 소모품은 2025년 5.9% 성장(미국 TECHCET 예측)
2025년 3월 26일 미국 캘리포니아주 샌디에고
반도체 재료 공급망 정보를 제공하는 전자 재료 권고 기업인 TECHCET은 메모리와 로직 칩의 진화가 촉진 요인이 되어 CMP(화학 연마) 소모품 수익이 2025년 6% 증가할 것으로 예측하고 있다.
3D NAND, FinFET 로직, DRAM 디바이스의 대용량 생산이 뒷받침되고, CMP 소모품은 TAM(Total Addressable Market)에서 2024년 34억 2,000만 달러에서 2025년에는 36억 2,000만 달러로 성장할 것으로 전망되고 있다. TECHCET에 의하면, 제조의 복잡화와 과제가 많아지는 것으로 더욱 CMP의 공수도 늘어나게 된다고 한다.
2024년에는 메모리와 첨단 로직 칩이 다소 복조됨에 따라 CMP 소모품 수익도 1.5% 증가했습니다. 기존 장치에 대한 수요는 줄어들었고, 특히 자동차 부문에서 그 경향이 두드러졌습니다. 가장 큰 세그먼트인 구리, 텅스텐, 산화물은 여전히 중요한 수익 요인이 되었습니다. 특히 첨단 로직 및 추가된 3D NAND 레이어를 위한 상호 연결 증가와 같은 디바이스 기술의 진화로 생산 강화가 계속되고 있습니다.
슬러리의 삭감이나 처리 비용의 삭감을 목적으로, 특주로 배합된 슬러리나 ChEmpower사의 CMP 패드 등의 혁신에 대한 수요가 성장을 촉진하고 있습니다.또한 제조업체는 첨단 반도체 가공의 효율성과 소유 비용 절감을 강화하는 데 주력하고 있으며, 후지 필름과 DuPont의 스핀 오프 기업에 의한 투자가 향후 시장을 지향 할 것입니다.
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TECHCET Projects 5.9% Growth in CMP Consumables for 2025
San Diego, CA, March XX, 2025: TECHCET — the electronic materials advisory firm providing semiconductor materials supply chain information — forecasts a 6% increase in CMP Consumables revenue for 2025, driven by advances in memory and logic chips. The Total Addressable Market (TAM) for CMP Consumables is expected to grow from $3.42B in 2024 to $3.62B in 2025, fueled by high-volume manufacturing of 3D NAND, FinFET Logic, and DRAM devices, which require more CMP steps due to the increasing complexity and challenges associated with manufacturing those devices, according to TECHCET’s Critical Materials Report™ on CMP Consumables.
In 2024, CMP Consumables saw modest growth, with a 1.5% increase in revenue driven by a slight recovery in memory and advanced logic chips. Legacy devices saw weaker demand, particularly in the automotive sector. The largest segments—Copper, Tungsten, and Oxide consumables—remained key revenue drivers, as advanced device technologies (especially increasing interconnects for advanced logic and additional 3D NAND layers) continued to ramp up production.
Looking ahead, growth will be driven by increased demand for custom-formulated slurries and innovations like ChEmpower’s CMP pads, which aim to eliminate slurries and reduce disposal costs. Additionally, investments by companies like FujiFilm and DuPont’s upcoming spin-off will further shape the market, as manufacturers focus on improving efficiency and reducing the cost of ownership in advanced semiconductor processes.
CMP consumables for metals to see large growth over next 5 years
San Diego, CA, May 2, 2024: TECHCET — the advisory firm providing materials market information for semiconductor supply chain resilience — is forecasting upwards growth of 6% in 2024 for Semiconductor CMP Consumables. CMP consumables for metals (Co, Mo, Ru) show the largest growth rate by far, increasing 94% over the next 5 years. Healthy growth is also expected for polysilicon and oxide CMP consumables, as highlighted in TECHCET’s Critical Materials Report™ on CMP Consumables.
For the slurry segment, Fujifilm Electronic Materials (FFEM) currently holds the highest share of the market at 31% due to their strong position in Cu slurry (holding the majority share in the segment). Entegris is ranked second in market share, largely due to their acquisitions of Sinmat, Chemetall Precision Microchemicals (was BASF) and CMC. For the pad segment, DuPont continues to be the dominant supplier, representing over 50% of the market.
Geopolitical events could potentially cause delays and price increases as suppliers qualify alternate sources to China and Russia for raw materials. For example, alumina, ceria, and silica raw material supply could be impacted.
