Global Chiplets Market
This report assesses the chiplets market by processor, packaging technology, end-user, and regions. It also analyzes related companies and service providers. The report also discusses market dynamics, such as drivers, opportunities, and restraints. The study forecasts the market value ($ million) of chiplets for key geographies. The report also focuses on the key emerging technologies that will fuel their adoption in the near future.
이 보고서는 프로세서, 패키징 기술, 최종 사용자 및 지역별로 칩렛 시장을 평가하며 관련 기업 및 서비스 제공업체도 분석합니다. 또한 추진 요인, 기회, 제약 등의 시장 역학에 대해서도 설명합니다. 주요 지역에서 칩렛의 시장 가치 (100 만 달러)를 예측하고 가까운 장래의 채택을 촉진하는 주요 신흥 기술에도 초점을 맞추고 있습니다.
| 조사회사 | BCC Research |
| 출판년월 | 2024년12월 |
| 페이지 수 | 84 |
| 라이센스 | Single User License |
| 가격 | USD 2,950 |
| 구성 | 영문조사보고서 |
Summary
Chiplets are revolutionizing the semiconductor industry. Also known as die or chip-on-chip, chiplets are tiny ICs that contain a specific subset of functionality. Smaller and more manageable than chips, chiplets break down complex systems into modular components. These advances enhance manufacturing yield by enabling individual testing, augment design flexibility through the integration of diverse technologies, expedite time-to-market by leveraging proven designs, and decrease costs by implementing more efficient manufacturing processes. This modular approach enables manufacturers to create chips tailored to diverse applications, driving advances in AI and high-performance computing (HPC).
Market Dynamics
The global chiplet market is driven by HPC, AI and 5G technologies. These applications require semiconductors that deliver high performance, low power consumption and smaller form factors. Chiplets, with their modular approach, offer a solution to these challenges by enabling the integration of different functionalities on a single package.
However, the chiplet market also faces challenges, including high manufacturing costs, complex design processes and a shortage of skilled workers. However, the increasing use of 2.5D and 3D packaging technologies, will offset some of these challenges.
Report Scope
This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs).
이 보고서는 CPU, GPU, FPGA(Field-Programmable Gate Array), AI-ASIC(AI 애플리케이션 특정 집적 회로) 보조 프로세서 및 APU(애플리케이션 처리 장치) 등 5개 프로세서 부문에 초점을 맞춘 칩렛에 대한 포괄적인 분석을 제공합니다. .
The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.
The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024–2029.
Report Synopsis
| Report Metrics | Details | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Base year considered | 2023 | ||||||||||
| Forecast period considered | 2024-2029 | ||||||||||
| Base year market size | $5.3 billion | ||||||||||
| Market size forecast | $42.8 billion | ||||||||||
| Growth rate | CAGR of 41.9% for the forecast period of 2024-2029 | ||||||||||
| Units considered | $ Millions | ||||||||||
| Segments covered | Processor Type, Packaging Technology, End Use Industry and Region | ||||||||||
| Regions covered | North America, Europe, Asia-Pacific, and Rest of the World (RoW) | ||||||||||
| Countries covered | U.S., Canada, U.K., Germany, France, Italy, China, Taiwan, Japan, South Korea, India, and Latin America | ||||||||||
| Key Market Drivers |
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| Companies studied |
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Report Includes
– In-depth assessment of the global market for semiconductor chiplets
– Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029
– Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region
– Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors
– Analysis of the industry structure, including companies’ market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook
– Company profiles
Table of Contents
Chapter 1 Executive Summary
Market Outlook
Scope of the Report
Market Summary
Chapter 2 Market Overview
Overview
Macroeconomic Factors
Advanced Packaging Technologies
Geopolitical Tensions
Outlook
Chapter 3 Market Dynamics
Overview
Market Drivers
High-Performance Computing
5G’s Growing Need for Chiplets
Market Restraints/Challenges
Shortage of Skilled Labor
Global Political and Financial Crises
Market Opportunities
Continuing Investment in the Semiconductor Industry
Use in Advanced Driver-Assistance Systems (ADAS)
Chapter 4 Regulatory Landscape
Overview
North America
Asia-Pacific
Europe
RoW
Chapter 5 Emerging Technologies
Emerging Technologies
Heterogeneous Integration
3D Integration
Advanced Packaging
Co-Packaged Optics
Chiplet-Based Systems-on-Chip
Chapter 6 Market Segmentation Analysis
Segmentation Breakdown
Market Breakdown by Processor
CPUs
Graphics Processing Units
Field-Programmable Gate Arrays
AI-ASIC Coprocessors
Application Processing Units
Market Breakdown by Packaging Technology
2.5D/3D
System-in-Package
Wafer-Level Chip-Scale Packaging
Flip Chip Chip-Scale Package
Flip Chip Ball Grid Array
Fan-Out
Market Breakdown by End-User Industry
Enterprise Electronics
Consumer Electronics
Industrial Automation
Automotive
Healthcare
Military and Aerospace
Other End-User Industries
Geographical Breakdown
Market Breakdown by Region
North America
Europe
Asia-Pacific
Rest of the World
Chapter 7 Competitive Landscape
Market Ecosystem Analysis
Analysis of Leading Companies
Strategic Analysis
Recent Developments
Chapter 8 Appendix
Research Methodology
References
Abbreviations
Company Profiles
ACHRONIX SEMICONDUCTOR CORP.
ADVANCED MICRO DEVICES INC.
BROADCOM
GLOBALFOUNDRIES INC.
IBM CORP.
INTEL CORP.
NVIDIA CORP.
RANOVUS
SAMSUNG
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
List of Tables
Summary Table : Global Market for Chiplets, by Region, Through 2029
Table 1 : Global Market for Chiplets, by Processor, Through 2029
Table 2 : Global Market for Chiplets, by Packaging Technology, Through 2029
Table 3 : Global Market for Chiplets, by End-User Industry, Through 2029
Table 4 : Global Market for Chiplets, by Region, Through 2029
Table 5 : North American Market for Chiplets, by Country, Through 2029
Table 6 : North American Market for Chiplets, by Processor, Through 2029
Table 7 : North American Market for Chiplets, by Packaging Technology, Through 2029
Table 8 : North American Market for Chiplets, by End-User Industry, Through 2029
Table 9 : European Market for Chiplets, by Country, Through 2029
Table 10 : European Market for Chiplets, by Processor, Through 2029
Table 11 : European Market for Chiplets, by Packaging Technology, Through 2029
Table 12 : European Market for Chiplets, by End-User Industry, Through 2029
Table 13 : Asia-Pacific Market for Chiplets, by Country, Through 2029
Table 14 : Asia-Pacific Market for Chiplets, by Processor, Through 2029
Table 15 : Asia-Pacific Market for Chiplets, by Packaging Technology, Through 2029
Table 16 : Asia-Pacific Market for Chiplets, by End-User Industry, Through 2029
Table 17 : RoW Market for Chiplets, by Country, Through 2029
Table 18 : RoW Market for Chiplets, by Processor, Through 2029
Table 19 : RoW Market for Chiplets, by Packaging Technology, Through 2029
Table 20 : RoW Market for Chiplets, by End-User Industry, Through 2029
Table 21 : Recent Developments Related to Chiplets, 2022-2024
Table 22 : Report Information Sources
Table 23 : Abbreviations Used in the Report
Table 24 : Achronix Semiconductor Corp.: Company Snapshot
Table 25 : Achronix Semiconductor Corp.: Product Portfolio
Table 26 : Achronix Semiconductor Corp.: News/Key Developments, 2023 and 2024
Table 27 : Advanced Micro Devices Inc.: Company Snapshot
Table 28 : Advanced Micro Devices Inc.: Financial Performance, FY 2022 and 2023
Table 29 : Advanced Micro Devices Inc.: Product Portfolio
Table 30 : Advanced Micro Devices Inc.: News/Key Developments, 2022 and 2023
Table 31 : Broadcom: Company Snapshot
Table 32 : Broadcom: Financial Performance, FY 2022 and 2023
Table 33 : Broadcom: Product Portfolio
Table 34 : Broadcom: News/Key Developments, 2022 and 2023
Table 35 : GlobalFoundries Inc.: Company Snapshot
Table 36 : GlobalFoundries Inc.: Financial Performance, FY 2022 and 2023
Table 37 : GlobalFoundries Inc.: Product Portfolio
Table 38 : GlobalFoundries Inc.: News/Key Developments, 2022-2024
Table 39 : IBM Corp.: Company Snapshot
Table 40 : IBM Corp.: Financial Performance, FY 2022 and 2023
Table 41 : IBM Corp.: Product Portfolio
Table 42 : IBM Corp.: News/Key Developments, 2024
Table 43 : Intel Corp.: Company Snapshot
Table 44 : Intel Corp.: Financial Performance, FY 2022 and 2023
Table 45 : Intel Corp.: Product Portfolio
Table 46 : Intel Corp.: News/Key Developments, 2022
Table 47 : NVIDIA Corp.: Company Snapshot
Table 48 : NVIDIA Corp.: Financial Performance, FY 2022 and 2023
Table 49 : NVIDIA Corp.: Product Portfolio
Table 50 : NVIDIA Corp.: News/Key Developments, 2022-2024
Table 51 : RANOVUS: Company Snapshot
Table 52 : RANOVUS: Product Portfolio
Table 53 : Samsung: Company Snapshot
Table 54 : Samsung: Financial Performance, FY 2022 and 2023
Table 55 : Samsung: Product Portfolio
Table 56 : Samsung: News/Key Developments, 2024
Table 57 : Taiwan Semiconductor Manufacturing Co. Ltd.: Company Snapshot
Table 58 : Taiwan Semiconductor Manufacturing Co. Ltd.: Financial Performance, FY 2022 and 2023
Table 59 : Taiwan Semiconductor Manufacturing Co. Ltd.: Product Portfolio
Table 60 : Taiwan Semiconductor Manufacturing Co. Ltd.: News/Key Developments, 2022
List of Figures
Summary Figure : Global Market Shares of Chiplets, by Region, 2023
Figure 1 : Market Dynamics for the Chiplet Industry
Figure 2 : Emerging Chiplet Technologies
Figure 3 : Global Market Shares of Chiplets, by Processor, 2023
Figure 4 : Global Market Shares of Chiplets, by Packaging Technology, 2023
Figure 5 : Global Market Shares of Chiplets, by End-User Industry, 2023
Figure 6 : Global Market Shares of Chiplets, by Region, 2023
Figure 7 : Global Chiplet Ecosystem
Figure 8 : Advanced Micro Devices Inc.: Revenue Share, by Business Unit, FY 2023
Figure 9 : Advanced Micro Devices Inc.: Revenue Share, by Region, FY 2023
Figure 10 : Broadcom: Revenue Share, by Business Unit, FY 2023
Figure 11 : Broadcom: Revenue Share, by Region, FY 2023
Figure 12 : GlobalFoundries Inc.: Revenue Share, by Country/Region, FY 2023
Figure 13 : IBM Corp.: Revenue Share, by Business Unit, FY 2023
Figure 14 : IBM Corp.: Revenue Share, by Region, FY 2023
Figure 15 : Intel Corp.: Revenue Share, by Business Unit, FY 2023
Figure 16 : Intel Corp.: Revenue Share, by Region, FY 2023
Figure 17 : NVIDIA Corp.: Revenue Share, by Business Unit, FY 2023
Figure 18 : NVIDIA Corp.: Revenue Share, by Region, FY 2023
Figure 19 : Samsung: Revenue Share, by Business Unit, FY 2023
Figure 20 : Samsung: Revenue Share, by Country/Region, FY 2023
Figure 21 : Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Share, by Business Unit, FY 2023
Figure 22 : Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Share, by Region, FY 2023
