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CVD/ALD/SOD 전구체 : 유전체 보고서 2022년

출판 : TECHCET   출판년월 : 2022년07월

Dielectrics Report: 2022 CMR™ CVD/ALD/SOD Precursors
CVD/ALD/SOD 전구체 : 유전체 보고서 2022년

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리포트목차    주문/문의    납기/라이센스안내

 

Techcet「CVD/ALD/SOD 전구체 : 유전체 리포트 2022년 – Dielectrics Report: 2022 CMR™ CVD/ALD/SOD Precursors」는 반도체 제조용 화학 기상 성장(CVD)/원자층 퇴적법(ALD)/SOD 전구체(프리카서)를 조사·분석하고 있습니다. 또한 재료 공급망의 도전과 동향, 공급업체의 시장 점유율 평가, 재료 세그먼트 예측 등 절연 전구체 관련 주요 공급자 정보를 제공합니다。

보고 개요

  • 무기 프리커서 및 유기 프리커서에 대한 시장 및 기술 동향에 대한 정보 제공. ILDs & Low-k 절연체, 하드 마스크, 측벽 스페이서, 에치 스톱층을 포함한 CVD, ALD, SOD 용도에 대해서도 설명.
  • 공급 사슬 관리자, 생산 통합, R&D 관리자, 비즈니스 개발, 재무 분석가에 대한 정보
  • 주요 공급업체, 재료 공급 문제/동향, 공급업체 시장 점유율 평가, 재료 시장 예측

주요 게시물

    1. 이그제큐티브 요약
    2. 범위, 목적, 조사 방법
    3. 반도체 산업 시장 전망
      1. 세계 경제
      2. 전자 제품 시장
      3. 자동차 판매
      4. 반도체 제조 성장 및 확대
      5. 반도체 재료 전망
    4. 전구체 시장 동향
      1. 시장 동향
      2. 공급 능력과 수요, 투자
      3. 기술적 촉진 요인/재료의 변화와 전환
      4. 유전 전구체에 대한 출원: IP 출원 동향
      5. 유전 가공 용도 및 연구 개발
      6. 지역별 – 유전 전구체
      7. EHS와 물류 문제
      8. 표준 실장/밸브 종류의 변화
      9. 시장 평가
    5. 시장 상황 및 예측
      1. 수익 동향 및 예측
      2. M&A 활동
      3. 신규 공장
      4. 신규 가입자: EUROPE CHINA ELECTRONIC MATERIALS (CHINA)
      5. 신규 가입자: NATA CHEMICALS (CHINA)
      6. 가격 동향
      7. 경쟁 환경 – 가공 도구
  1. 서브티어 소재 공급망
  2. 공급업체 정보

Overview

  • Provides market and technical trend information on organic and inorganic precursors, addressing CVD, ALD, and SOD applications including ILDs & low-κ dielectrics, hard masks, sidewall spacers and etch stop layers
  • Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
  • Covers information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments

Analyst

Jonas Sundqvist, Ph.D.

  • Sr. Technology Analyst of TECHCET— covers Electronic Gases and ALD & CVD precursors and related technologies, and the co-chair of the Annual Critical Materials Council (CMC) Conference. His over 20 years of work experience includes Group Leader of the Thin-Film Technologies Group at The Fraunhofer Institute for Ceramic Technologies and Systems (IKTS) in Germany, Clean Room Operations Manager for Lund Nano Lab, Lund University in Sweden and Group Leader of the ALD & High-k devices group at Fraunhofer’s Center Nanoelectronic Technologies (CNT) in Germany, which included 28nm node work for GLOBALFOUNDRIES Fab1.
  • Previously, at Infineon Memory Development Centre (MDC), he developed high-k and metal nitride ALD processes, and at Qimonda, he was a materials manager focused on the ALD/CVD precursors supply-chain. He holds a Ph.D. and an M.S. in inorganic chemistry from Uppsala University, Sweden & Institute for Micromanufacturing, Louisiana Teche, USA, a B.S. in electrical and electronics engineering from Lars Kagg, and nine patents and 40 related scientific publications.
  • Jonas Sundqvist is on the Scientific Committee for AVS ALD and has co-

목차

1 EXECUTIVE SUMMARY

1.1 CVD/ALD/SOD PRECURSORS – MARKET OVERVIEW
1.1.1 MARKET OVERVIEW – DIELECTRIC PRECURSORS
1.2 SEGMENT REVENUE TRENDS & FORECAST
1.3 MARKET TRENDS IMPACTING MATERIALS SEGMENT OUTLOOK 1.4 YEAR 2021 IN REVIEW
1.5 SEGMENT 5-YEAR REVENUE FORECAST – DIELECTRIC
1.6 TECHNOLOGY TRENDS
1.7 COMPETITIVE LANDSCAPE
1.8 ANALYST ASSESSMENT

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE
2.2 PURPOSE
2.3 METHODOLOGY
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1 WORLDWIDE ECONOMY
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 3.1.2 SEMICONDUCTOR SALES GROWTH
3.1.3 TAIWAN MONTHLY SALES TRENDS
3.2 ELECTRONIC GOODS MARKET
3.2.1 SMARTPHONES
3.2.2 PC UNIT SHIPMENTS
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 3.2.3 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY
3.3.2 WW FAB EXPANSION DRIVING GROWTH
3.3.3 EQUIPMENT SPENDING TRENDS
3.3.4 TECHNOLOGY ROADMAPS
3.3.5 FAB INVESTMENT ASSESSMENT
3.4 POLICY & TRADE TRENDS AND IMPACT
3.4.1POLICY AND TRADE ISSUES
3.5 SEMICONDUCTOR MATERIALS OUTLOOK
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
3.5.2 CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD 3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2026
3.5.4 TECHCET WAFER START FORECAST
3.5.5 TECHCET’S MATERIALS FORECAST

4 PRECURSOR MARKET TRENDS

4.1 MARKET TRENDS
4.1.1 MARKET TRENDS – WAFER STARTS
4.1.2 MARKET TRENDS – WAFER STARTS LOGIC
4.1.3 MARKET TRENDS – WAFER STARTS DRAM
4.1.4 MARKET TRENDS – WAFER STARTS NAND
4.2 SUPPLY CAPACITY AND DEMAND, INVESTMENTS
4.3 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS
4.3.1 GENERAL TREND LAST DECADE GOING FROM PVD & LPCVD TO PECVD
4.3.2 DEVICE ROADMAP
4.3.3 LEADING EDGE DEVICE ARCHITECTURE
4.3.4 LEADING EDGE LOGIC ROADMAP
4.3.4.1 ALD DIELECTRIC PRECURSORS FOR SPACE DEFINED
MULTI-PATTERNING
4.3.4.2 SUMMARY OF DEVICE SEGMENT TRENDS AND OPPORTUNITIES 4.3.5 AN OVERVIEW OF SILICON CARBIDE AND GALLIUM NITRIDE 4.3.5.1 AN OVERVIEW OF SILICON CARBIDE AND GALLIUM NITRIDE
4.3.5.2 AN OVERVIEW OF SILICON CARBIDE AND GALLIUM NITRIDE 4.3.5.3 AN OVERVIEW OF SILICON CARBIDE AND GALLIUM NITRIDE
4.3.6 AN OVERVIEW OF SILICON CARBIDE AND GALLIUM NITRIDE
(MOCVD)
4.3.6.1 AN OVERVIEW OF SILICON CARBIDE AND GALLIUM NITRIDE (MOCVD)
4.3.6.2 AN OVERVIEW OF SILICON CARBIDE AND GALLIUM NITRIDE (MOCVD)
4.4 DIELECTRIC PRECURSORS FILING ACTIVITY: IP FILING TRENDS 4.4.1 PRECURSORS FILING ACTIVITY: BY COMPANY CATEGORY 4.4.2 DIELECTRIC PRECURSOR IP ACTIVITY: BY DEPOSITION METHOD
4.4.3 ALD DIELECTRICS FOR PHOTOLITHOGRAPHY IP
4.5 DIELECTRIC PROCESS APPLICATIONS AND R&D
4.5.1 IMPACT OF EUV ON MULTI-PATTERNING FOR DRAM MANUFACTURING – STI MODULE
4.5.2 AREA SELECTIVE DEPOSITION FOR USE IN ADVANCED LOGIC
4.5.3 DRY RESIST FOR EUV
4.6 REGIONAL TRENDS – DIELECTRIC PRECURSORS
4.6.1 REGIONAL TRENDS AND DRIVERS
4.6.2 REGIONAL TRENDS AND DRIVERS, CONTINUED
4.7 EHS AND LOGISTIC ISSUES
4.7.1 EHS AND LOGISTIC ISSUES – GREEN HOUSE GASES FROM LOGIC PRODUCTION
4.8 CHANGES IN STANDARD PACKAGING/VALVE TYPES
4.9 MARKET ASSESSMENT

5 SEGMENT MARKET STATISTICS & FORECASTS

5.1 SEGMENT REVENUE TRENDS & FORECAST
5.1.1 CVD/ALD DIELECTRIC PRECURSOR REVENUE 2020 TO 2026 (M USD)
5.1.2 ASSESSMENT DIELECTRIC PRECURSORS
5.2 M&A ACTIVITIES
5.3 NEW PLANTS
5.4 NEW ENTRANTS – EUROPE CHINA ELECTRONIC MATERIALS (CHINA)
5.4.1 NEW ENTRANTS – NATA CHEMICALS
5.4.2 CHINA ALD DIELECTRIC RECENT DEVELOPMENT
5.5 PRICING TRENDS
5.6 COMPETITIVE LANDSCAPE — PRECURSOR SUPPLIER MARKET SHARE
5.6.1 COMPETITIVE LANDSCAPE — PRECURSOR MARKET BY REGION 5.7 MARKET LANDSCAPE — PROCESS TOOLS
5.7.1 MARKET LANDSCAPE — PROCESS TOOL FORECAST GROWTH 5.7.2 LONG TERM AND 5-YEAR WAFER EQUIPMENT FORECAST 5.7.3 PROCESS TOOLS SEGMENTED BY DEPOSITION METHOD
5.7.4 PROCESS TOOLS MADE FOR DEPOSITION, ASSESSMENT

6 SUB TIER MATERIAL SUPPLY CHAIN

6.1 SUB-TIER SUPPLY-CHAIN: INTRODUCTION
6.2 SUB-TIER SUPPLY-CHAIN M&A ACTIVITY
6.3 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
6.4 SUB-TIER SUPPLY-CHAIN “NEW” ENTRANTS
6.5 SUB-TIER SUPPLY-CHAIN PLANTS UPDATES-NEW
6.6 SUB-TIER SUPPLY-CHAIN PRICING TRENDS
6.7 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7 SUPPLIER PROFILES

ADEKA Corporation
Air Liquide
AZmax Co., Ltd
DNF Co., Ltd
Entegris
Epivalence
Gelest – Mitsubishi Chemicals Hansol Chemical
H.C. Starck
Kojundo Chemical Laboratory …and many more

FIGURES &TABLES

FIGURES

FIGURE 1: DIELECTRIC PRECURSOR MARKET FORECAST
FIGURE 2: TOTAL PRECURSOR MARKET (M USD)
FIGURE 3: DIELECTRIC PRECURSOR MARKET 2020 TO 2026
FIGURE 4: GLOBAL ADVANCED PRECURSOR MARKET 2021 (USD)
FIGURE 5: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021)
FIGURE 6: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 7: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX* FIGURE 8: 2021 CHIP REVENUE
FIGURE 9: MOBILE PHONE SHIPMENTS WW ESTIMATES
FIGURE 10: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3 FIGURE 11: GLOBAL EV TRENDS
FIGURE 12: SEMICONDUCTOR SPEND PER VEHICLE TYPE
FIGURE 13: TSMC CONSTRUCTION SITE IN ARIZONA
FIGURE 14: CHIP EXPANSIONS 2021-2026 > US$460 B
FIGURE 15: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 16: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS FIGURE 17: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP
FIGURE 18: EUROPE CHIP EXPANSION UPSIDE
FIGURE 19: TECHCET WAFER START FORECAST BY NODE
FIGURE 20: TECHCET WAFER START FORECAST BY LOGIC NODE FIGURE 21: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
FIGURE 22: FORECASTS – WAFER STARTS 2018 TO 2026
FIGURE 23: FORECASTS – WAFER STARTS LOGIC 300MM
FIGURE 24: FORECASTS – WAFER STARTS DRAM 300MM
FIGURE 25: ANNUAL WAFER STARTS
(MILLIONS OF 200MM EQUIVALENT / YEAR)
FIGURE 26: ALD DIELECTRICS FOR PHOTOLITHOGRAPHY IP
FIGURE 27: DEVICE ARCHITECTURES
FIGURE 28: DEVICE ROADMAPS
FIGURE 29: IMEC 2021 LOGIC ROADMAP
FIGURE 30: SCALING AND LITHOGRAPHY TRENDS FIGURE 31: IMEC 2021 LOGIC ROADMAP
FIGURE 32: MULTI-PATTERNING PROCESS STEPS AND SEM
FIGURE 33: LOW TEMP DIELECTRIC PRECURSOR DEPOSITION TEMPERATURE AND ACTIVATION ENERGY FOR ADV. MPT/QPT
FIGURE 34: POWER DEVICE APPLICATION OVERVIEW
FIGURE 35: POWER MOSFET STRUCTURE
FIGURE 36: POWER DEVICE TRADEOFFS
FIGURE 37: MARKET SHARE EPI MOCVD EQUIP. TOTAL AVAILABLE MARKET- US$700 M
FIGURE 38: IP FILING FOR CVD AND ALD DIELECTRIC PRECURSORS
FIGURE 39: DIELECTRIC PRECURSOR IP DISTRIBUTION (2019-2021)
FIGURE 40: DIELECTRIC IP FILING TRENDS BY DEP METHOD (1993 TO 2019)
FIGURE 41: PATENT ACTIVITY BUBBLE CHART, OF ALD DIELECTRICS AND PHOTOLITHOGRAPHY
FIGURE 42: IMPACT OF EUV ON USAGE OF MULTI-PATTERNING
FIGURE 43: TOPOGRAPHY FOR SELECTIVE SIN
FIGURE 44: EXAMPLE OF LINE PATTERNS CREATED VIA “DRY RESIST” (CVD DEPOSITION)
FIGURE 45: HARDMASK, LOW K & DIELCTRIC PRECURSORS REGIONAL
SHARES 2021
FIGURE 46: ENVIRONMENTAL FOOTPRINT OF MOORES LAW
FIGURE 47: SEGMENTATION OF THE AMPOULE FLEER 2020 BASED ON NUMBER OF UNITS IN THE FIELD
FIGURE 48: DIELECTRIC PRECURSOR MARKET FORECAST
FIGURE 49: DIELECTRIC PRECURSOR MARKET 2020 TO 2026
FIGURE 50: ECEM PRODUCT OFFERINGS
FIGURE 51: SAQP FILM STRUCTURE AND PROCESS FLOW
FIGURE 52: TOTAL DIELECTRIC PRECURSOR MARKET SHARE 2021 (US$652 M) 104
FIGURE 53: GLOBAL ADVANCED PRECURSOR MARKET 2021 (USD) FIGURE 54: SEMICONDUCTOR EQUIPMENT SEGMENTATION
FIGURE 55: SEMICONDUCTOR EQUIPMENT FORECAST
FIGURE 56: SEMICONDUCTOR MARKET SIZE AND OUTLOOK
FIGURE 57: SEMICONDUCTOR EQUIPMENT FORECAST
FIGURE 58: DEPOSITION SEGMENTS (USD BILLION)
FIGURE 59: TYPICAL NON-HALIDE LIGANDS USED FOR ALD PRECURSORS
FIGURE 60: SYSTEM DEFINITION OF THE GLOBAL ANTHROPOGENIC COBALT CYCLE AND MODELING FRAMEWORK FOR COBALT DEMAND AND SECONDARY SUPPLY POTENTIALS.

TABLES

TABLE 1: PRECURSOR MARKET GROWTH OVERVIEW (REGIONAL CONSUMPTION BY REVENUE)
TABLE 2: PRECURSOR MARKET SIZE
TABLE 3: INDUSTRY AND ECONOMIC SUMMARY
TABLE 4: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
TABLE 5: IMF ECONOMIC OUTLOOK*
TABLE 6: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021
TABLE 7: GENERAL PRECURSOR TRENDS AND OPPORTUNITIES BY DEVICE TYPE
TABLE 8: MOCVD APPLICATIONS – EPI DEPOSITION ON SUBSTRATE TABLE 9: MOCVD EQUIPMENT VENDORS
TABLE 10: REGIONAL MARKETS (US$ MILLIONS)
TABLE 11: REGIONAL PRECURSOR MARKETS
TABLE 12: REGIONAL WAFER MARKETS
TABLE 13: PRECURSOR MARKET SIZE TABLE 14: M&A ACTIVITIES


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