출판 : Techcet 출판년월 : 2022년06월
CMP CONSUMABLES – SLURRY and PAD MARKETS
반도체 디바이스 제조에 사용되는 CMP 슬러리, 패드, 컨디셔너 시장을 조사·분석해, 기술 관련 정보나 기업 정보를 게재하고 있습니다。
| 구성 | 영문조사보고서 |
| 페이지수 | 125 ※ |
| 도표수 | 74 |
| 가격（사이트 라이센스） | USD 8,900 |
※Chapter 8（Supplier Profiles）의 페이지수는 포함되어 있지 않습니다。
Techcet「CMP CONSUMABLES – SLURRY and PAD MARKETS」는 반도체 디바이스 제조에 사용되는 CMP 소모품 중, 슬러리와 패드 시장을 조사·분석해, 기술 관련 정보나 기업 정보를 게재하고 있습니다。
이 보고서의 특징
- 시장 역학 일반 정보
- 공급 사슬 관리자, 생산 통합, R&D 관리자, 비즈니스 개발, 재무 분석가에 대한 정보
- 반도체 디바이스 제조에 사용되는 CMP 패드, 슬러리, 디스크와 관련된 공급망, 시장 및 기술 동향에 대한 정보
- 주요 공급업체, 재료 공급 문제/동향, 공급업체 시장 점유율 평가, 재료 시장 예측
주요 실적
- 이그제큐티브 요약
- 조사 범위, 목표, 방법론
- 반도체 산업의 시장 상황과 전망
- 세계 경제
- 전자 제품 시장
- 반도체 제조 성장 및 확대
- 정책 및 무역 추세 및 영향
- 반도체 재료 전망
- CMP 소모품 시장 동향
- CMP 슬러리 공급업체 시장 점유율
- CMP 패드 시장 통계 데이터 및 예측
- CMP 패드 수익 5년 예측
- CMP 패드 수의 5년 예측
- CMP 패드 공장 폐쇄
- 신규 가입자
- 존속 위기에 처한 공급업체 또는 부품/생산 라인
- CMP 패드의 M&A 활동, 공지, 파트너십
- CMP 패드 가격 동향
- 텍셋 분석가별 평가
- 재료의 하위층 공급
- 공급업체 정보
- 별표
Description
- Contains information on the overall market dynamics
- Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
- Includes supply-chain, market, and technical trends information relating to CMP pads, slurry, and disks as used for semiconductor device manufacturing.
- Covers information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments
Analyst
Sarah Okada
Ms. Okada has worked in leadership roles in the semiconductor industry for over 25 years focusing on product management, marketing and technical sales of substrate and device manufacturing equipment.
Ms. Okada started in the semiconductor industry in 1995 in the applications development group at Strasbaugh, a supplier of CMP and grinding equipment.
In 2013, she was promoted to director of sales and marketing for Strasbaugh where she incorporated marketing and sales best practices to develop a new brand for Strasbaugh and launched a successful new HVM grinding product.
Ms. Okada was key in the acquisition of Strasbaugh’s technology for Revasum in 2016, where she served as VP of marketing and product management and launched the industry’s first fully automated SiC substrate polisher.
Since joining Nova in November 2020, Ms. Okada has been leading work on the SIMS-based METRION platform and was recently promoted to product marketing director
Ms Okada holds a bachelor’s degree in Marketing and Finance from the University of Oregon.
[보도 자료]
CMP 소모품의 공급은 힘들고, 비용은 증대할 전망
~최첨단 제품이 기존 제품의 대체품에～
샌디에고, 2022년 5월 24일
전자재료 사업 및 기술정보를 제공하는 어드바이저리 기업인 TECHCET은 반도체용 화학기계평탄화(CMP) 소모품 시장이 2021년 30억 달러에 달해 약 13%로 성장했다고 발표했다. CMP 시장은 슬러리와 패드 시장이 2022년에 33억 달러, 9%로 성장했으며, 2026년까지는 연평균 성장률(CAGR) 6% 이상의 성장을 이룰 것으로 예측되고 있다.
첨단 장치는 생산을 강화하고 CMP 가공은 계속 증가하고 있습니다. 로직 시장에서는 CMP 절차와 금속 게이트를 위한 신규 재료의 도입이 증가하고 FinFET에서 GAA의 전환이 일어나고 있다는 것이 TECHCET의 CMP 소모품에 관한 조사 보고서에서 지적되고 있습니다. 코발트, 루테늄, 몰리브덴, 니켈 및 다양한 합금이 고려 범위로 언급됩니다. 텅스텐, 구리, 코발트 패드 및 슬러리의 수요는 첨단 DRAM과 3DNAND가 뒷받침하고 있습니다. 또 웨이퍼의 상위 계층형의 생산 강화가 개시됨으로써, 선진 3DNAND도 성장 촉진 요인이 되고 있습니다.
산화물이나 텅스텐 등의 재료에 공통으로 사용되는 슬러리와 패드는 입수할 수 있지만, 종래품용 소모품에 대한 수요는 계속 낮아질 것으로 보입니다. 새로운 재료가 기존 제품에 사용되는 것을 대체함으로써 공급 업체의 일부는 기존 소모품 생산 라인을 중지하고 기존 재료에 대한 소모품의 입수량을 줄일 것입니다. 이로 인해 경쟁이 완화되고 기존 CMP 제품의 가격이 매달릴 수 있습니다.
슬러리 가격, 특히 특수 슬러리와 소구 주문분은 향후 1~2년 이상은 유지 혹은 가격 인상이 예측되고 있습니다. 나노세리아 슬러리에 대해서는 표면성상의 개선과 결함제어의 필요성이 촉진요인이 되어 수요가 증가하고 있다.
패드 시장의 경쟁 감소로 패드 가격에 움직임은 보이지 않을 것입니다. 소량 주문은 특별 가격이 될 것입니다. 그러나 중국에서 패드 공급업체가 신규 진입하면 중국 국내에서 지위를 확립하여 중국에서 경쟁사의 패드 가격 인하로 이어질 수 있다.
（원문）CMP Consumables – Supply is Tight and Costs Expected to Rise
as legacy products are replaced by leading edge
San Diego, CA, May 24, 2022: TECHCET—the electronic materials advisory firm providing business and technology information— announced the Chemical Mechanical Planarization (CMP) consumables market for semiconductors grew almost 13% in 2021 to reach US$3.0 billion. The CMP market, including both slurries and pads, will grow almost 9% in 2022 to US$3.3 billion, and the forecast through 2026 shows this market growing at over a 6% CAGR.
CMP processes continue to increase as leading-edge devices ramp up in production. The logic market is seeing a shift from FinFET to GAA, which increases the number of CMP steps and the introduction of new materials for the metal gate, as indicated in “TECHCET’s 2022 Critical Materials Report™ on CMP Consumables.” Under consideration are cobalt, ruthenium, molybdenum, nickel, and various alloys. Strong growth in leading edge DRAM and 3DNAND is boosting demand for tungsten, copper and cobalt pads and slurries. Growth is also driven by advanced 3DNAND as wafer starts for higher layer generations ramp up in production.
Demand will continue to slow for consumables for legacy products, though slurries and pads for commonly used materials, such as oxide and tungsten, will continue to be available. As new materials replace those used in legacy products, availability of consumables for the legacy materials will decrease as some suppliers will discontinue their consumables legacy product lines. This will result in less competition and will likely drive-up prices for legacy CMP products.
Slurry prices are expected to hold or increase, particularly on specialty slurries and on small quantity orders over the next year or two. Nanoceria slurries are in growing demand, driven by the need for improved surface quality and defectivity control.
Due to the lack of competition in the pad market, pad prices will hold firm. Small quantity orders will receive a premium price. However, if the new pad supplier entrants in China gain position in the local market, it could soften prices for competitive pads in China.
목차
1 EXECUTIVE SUMMARY 11
1.1 CMP CONSUMABLES MARKET OVERVIEW 12
1.2 CMP CONSUMABLES REVENUE TRENDS 13
1.3 MARKET TRENDS IMPACTING CMP CONSUMABLES OUTLOOK 14
1.4 YEAR 2021 IN REVIEW 15
1.5 CMP CONSUMABLES FORECASTS BY MATERIAL SEGMENT 16
1.5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST 17
1.5.2 CMP PADS 5-YEAR REVENUE FORECAST 18
1.6 TECHNOLOGY TRENDS 19
1.7 SLURRY SUPPLIER COMPETITIVE LANDSCAPE 20
1.8 PAD SUPPLIER COMPETITIVE LANDSCAPE 21
1.9 ANALYST ASSESSMENT 22
2 SCOPE, PURPOSE AND METHODOLOGY 24
2.1 SCOPE 25
2.2 PURPOSE 26
2.3 METHODOLOGY 27
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS 28
3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK 29
3.1 WORLDWIDE ECONOMY 30
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 32
3.1.2 SEMICONDUCTOR SALES GROWTH 33
3.1.3 TAIWAN MONTHLY SALES TRENDS 34
3.2 ELECTRONIC GOODS MARKET 35
3.2.1 SMARTPHONES 36
3.2.2 PC UNIT SHIPMENTS 37
3.2.1.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 38
3.2.1.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 39
3.2.3 SERVERS / IT MARKET 40
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 41
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY 42
3.3.2 WW FAB EXPANSION DRIVING GROWTH 43
3.3.3 EQUIPMENT SPENDING TRENDS 44
3.3.4 TECHNOLOGY ROADMAPS 45
3.3.5 FAB INVESTMENT ASSESSMENT 46
3.4 POLICY & TRADE TRENDS AND IMPACT 47
3.4.1 POLICY AND TRADE ISSUES 48
3.5 SEMICONDUCTOR MATERIALS OUTLOOK 49
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES? 50
3.5.2 CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD 51
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2026 52
3.5.4 TECHCET WAFER START FORECAST 53
3.5.5 TECHCET’S MATERIALS FORECAST 54
4 CMP CONSUMABLES MARKET TRENDS 55
4.1 CMP CONSUMABLES MARKET TRENDS 56
4.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS 57
4.2.1 3D NAND ROADMAP 59
4.2.2 3D NAND XTACKING 60
4.2.3 TECHNICAL TRENDS IN ADVANCED PACKAGING 61
4.2.4 TECHNICAL TRENDS IN ADVANCED PACKAGING CONTINUE 62
4.2.5 CMP FOR TSV 63
4.2.6 CHALLENGES FACING REDISTRIBUTION LAYER (RDL) PROCESSES 64
4.3 TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR 65
4.3.1 SILICON CARBIDE POWER DEVICE REVENUE 66
4.3.2 SILICON CARBIDE WAFER SUPPLY AND DEMAND 67
4.3.3 CMP OF SILICON CARBIDE 68
4.3.4 SILICON CARBIDE DEFECTS 69
4.3.5 CMP CHALLENGES IN SILICON CARBIDE 70
4.4 REGIONAL TRENDS 71
4.4.1 REGIONAL TRENDS AND DRIVERS 72
4.5 EHS AND LOGISTIC ISSUES 74
4.5.1 EHS ISSUES FOR NEW MATERIALS 75
4.5.2 LOGISTIC ISSUES 76
4.5.3 EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM 77
5 CMP SLURRY SUPPLIER MARKET SHARES 78
5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST 79
5.2 CMP SLURRIES 5-YEAR FORECAST BY UNITS 80
5.3 CMP SLURRY MARKET LEADERS 81
5.3.1 TOTAL SLURRY MARKET SHARE 82
5.3.2 OXIDE (CERIA) SLURRY MARKET 83
5.3.2.1 OXIDE (CERIA) SLURRY MARKET, CONTINUED 84
5.3.3 HKMG SLURRY MARKET 85
5.3.3.1 HKMG SLURRY MARKET, CONTINUED 86
5.3.4 POLYSILICON SLURRY MARKET 87
5.3.4.1 POLYSILICON SLURRY FOR MEMS 88
5.3.5 OXIDE (SILICA) SLURRY MARKET 89
5.3.6 TUNGSTEN SLURRY MARKET 90
5.3.7 CU BULK SLURRY MARKET 91
5.3.8 COPPER BARRIER SLURRY MARKET 92
5.3.8.1 COPPER BARRIER SLURRIES, CONTINUED 93
5.3.9 NEW METALS SLURRY MARKET 94
5.4 CMP SLURRY M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS 95
5.5 CMP SLURRY PLANT CLOSURES 97
5.6 NEW ENTRANTS 98
5.7 SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK
OF DISCONTINUATIONS 99
5.8 CMP SLURRY PRICING TRENDS 100
5.9 TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET 101
6 CMP PAD MARKET STATISTICS & FORECASTS 103
6.1 CMP PADS 5-YEAR REVENUE FORECAST 104
6.1.1 CMP PADS 5-YEAR REVENUE FORECAST 105
6.2 CMP PADS 5-YEAR FORECAST BY UNITS 106
6.3 CMP PAD PLANT CLOSURES 107
6.4 NEW ENTRANTS 108
6.5 SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK
OF DISCONTINUATIONS 109
6.6 CMP PAD M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS 110
6.7 CMP PAD PRICING TRENDS 111
6.8 TECHCET ANALYST ASSESSMENT 112
7 MATERIAL SUB-TIER SUPPLY 114
7.1 ABRASIVE SUPPLIERS 115
7.2 VERTICALLY INTEGRATED SUPPLIERS 116
7.3 RAW SUPPLY CHAIN DISRUPTORS 117
7.4 RAW MATERIALS M&A ACTIVITY 118
7.5 ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES 119
7.6 ABRASIVE SUPPLY CHAIN “NEW” ENTRANTS 120
7.7 ABRASIVE SUPPLY-CHAIN PLANTS UPDATES-NEW 121
7.8 ABRASIVE SUPPLY-CHAIN PLANT CLOSURES 122
7.9 ABRASIVE SUPPLY-CHAIN PRICING TRENDS 123
7.10 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 124
8 SUPPLIER PROFILES 125
ACE NANOCHEM
ANJI MICRO SHANGHAI
ASASHI GLASS
BASF
CABOT MICROELECTRONICS
DUPONT
EMINESS TECHNOLOGIES, INC.(PUREON)
FERRO
FUJIFILM PLANAR SOLUTIONS
FUJIMI CORP.
…and many more
9 APPENDIX 331
APPENDIX A: CMP CONSUMABLES OVERVIEW 332
APPENDIX B: TECHNICAL TRENDS IN SIC 129
APPENDIX C: PAD MANUFACTURING COST DRIVERS 340
Figures & Tables
FIGURE 1: FORECASTED 2022 MARKET SIZE 12
FIGURE 2: CMP CONSUMABLES FORECAST 13
FIGURE 3: CMP STEPS FOR ADVANCED DEVICES 14
FIGURE 4: 2021 CMP CONSUMABLES REVENUE 15
FIGURE 5: CMP CONSUMABLES REVENUE BY APPLICATION 16
FIGURE 6: CMP SLURRY REVENUE BY APPLICATION 17
FIGURE 7: CMP PAD REVENUE BY APPLICATION 18
FIGURE 8: 2D DEVICE ARCHITECTURE EVOLUTION 19
FIGURE 9: 2021 SLURRY SUPPLIER MARKET SHARES 20
FIGURE 10: 2021 PAD SUPPLIER MARKET SHARES 21
FIGURE 11: GLOBAL ECONOMY AND THE ELECTRONICS
SUPPLY CHAIN (2021) 32
FIGURE 12: WORLDWIDE SEMICONDUCTOR SALES 33
FIGURE 13: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX* 34
FIGURE 14: SEMICONDUCTOR CHIP APPLICATIONS 35
FIGURE 15: MOBILE PHONE SHIPMENTS WW ESTIMATES 36
FIGURE 16: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3 37
FIGURE 17: GLOBAL EV TRENDS 38
FIGURE 18: SEMICONDUCTOR SPEND PER VEHICLE TYPE 39
FIGURE 19: TSMC CONSTRUCTION SITE IN ARIZONA. 41
FIGURE 20: CHIP EXPANSIONS 2021-2026 > US$460 B 42
FIGURE 21: SEMICONDUCTOR CHIP MANUFACTURING REGIONS
OF THE WORLD 43
FIGURE 22: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS 44
FIGURE 23: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP 45
FIGURE 24: EUROPE CHIP EXPANSION UPSIDE 50
FIGURE 25: TECHCET WAFER START FORECAST BY NODE 52
FIGURE 26: TECHCET WAFER START FORECAST BY NODE 53
FIGURE 27: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK 54
FIGURE 28: CMP CONSUMABLES REVENUE FOR 2022 56
FIGURE 29: NUMBER OF CMP STEPS FOR ADVANCED TECHNOLOGY
NODES 57
FIGURE 30: 14NM VS. 3NM METALLIZATION TECHNIQUES 58
FIGURE 31: COMPARISON OF MATERIAL CHARACTERISTICS OF METALS 58
FIGURE 32: XTACKING HYBRID BONDING TECHNOLOGY FOR 3D NAND 60
FIGURE 33: CMP OPPORTUNITIES IN ADVANCED PACKAGING 61
FIGURE 34: KEY TRENDS IN ADVANCED PACKAGING 62
FIGURE 35: CMP OPPORTUNITIES IN ADVANCED PACKAGING 63
FIGURE 36: RDL CHALLENGES FOR ADVANCED PACKAGING 64
FIGURE 37: POWER SIC DEVICE MARKET REVENUES 66
FIGURE 38: SILICON CARBIDE WAFER DEMAND BY APPLICATION 67
FIGURE 39: SILICON CARBIDE-BASED POWER DEVICE 68
FIGURE 40: DEFECTS IN SILICON CARBIDE SUBSTRATES AND EPI WAFERS 69
FIGURE 41: SILICON CARBIDE DEFECTS 69
FIGURE 42: BATCH POLISH VS. CMP 70
FIGURE 43: SLURRY AND PAD REVENUE BY HQ REGION 71
FIGURE 44: CMP SLURRY REVENUE BY APPLICATION 79
FIGURE 45: FORECASTED SLURRY VOLUME DEMAND 80
FIGURE 46: SLURRY SUPPLIER MARKET SHARES IN 2021 82
FIGURE 47: OXIDE (CERIA) SLURRY MARKET SHARES 83
FIGURE 48: STI CMP PROCESS 84
FIGURE 49: HKMG/FRONT-END SLURRY MARKET SHARES 85
FIGURE 50: POLYSILICON SLURRY MARKET SHARES 87
FIGURE 51: MEMS CMP CROSS SECTION 88
FIGURE 52: OXIDE (SILICA) SLURRY MARKET SHARES 89
FIGURE 53: TUNGSTEN SLURRY MARKET SHARES 90
FIGURE 54: CU-BULK SLURRY MARKET SHARES 91
FIGURE 55: CU-BARRIER CMP SLURRY MARKET SHARE 92
FIGURE 56: NEW METALS SLURRY MARKET SHARES 94
FIGURE 57: CMP PAD REVENUE BY APPLICATION 104
FIGURE 58: CMP PAD REVENUE BY WAFER SIZE 105
FIGURE 59: FORECASTED PAD USAGE 106
FIGURE 60: CMP FOR IC MANUFACTURING PROCESS 333
FIGURE 61: IC1000 LIKE PAD CROSS-SECTION 342
FIGURE 62: IC1000 SEM CROSS-SECTION 343
TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES* 30
TABLE 2: IMF ECONOMIC OUTLOOK* 31
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION
SERVICES FORECAST 2021 40
TABLE 4: 3D NAND ROADMAP BY NODE 59
TABLE 5: SILICON CARBIDE WAFER MANUFACTURERS 65
TABLE 6: CONSUMABLES SUPPLIERS 66
TABLE 7: REGIONAL WAFER MARKETS 72
TABLE 8: REGIONAL WAFER MARKETS BY SUPPLIER
HEADQUARTER REGION 73
TABLE 9: 2022 SLURRY MARKET LEADERS AND TAM BY APPLICATION 81
TABLE 10: ABRASIVE SUPPLIERS 115
TABLE 11: VERTICALLY INTEGRATED SUPPLIERS 116
TABLE 12: PHYSICAL AND ELECTRICAL PROPERTY COMPARISON
OF SI AND SIC 335
